公开(公告)号：US20250125230A1

公开(公告)日：2025-04-17

申请号：US18728485

申请日：2022-09-14

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xinhong LU ,  Yan QU ,  Shuilang DONG ,  Liuqing LI ,  Jingshang ZHOU ,  Guoteng LI ,  Baoman LI

IPC: H01L23/495

Abstract: Disclosed are a chip on film, a manufacturing method thereof, and a display apparatus. The chip on film includes: at least one substrate layer; a plurality of pads on the at least one substrate layer; a plurality of first leads on the at least one substrate layer and electrically connected to part of the pads; and a plurality of second leads on a side of each substrate layer away from the layer where the plurality of pads are located, and electrically connected to the rest of the pads.

公开(公告)号：US20250147153A1

公开(公告)日：2025-05-08

申请号：US18993762

申请日：2024-02-22

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yuehua LIU ,  Wei ZHAO ,  Baoman LI

IPC: G01S7/481 ,  G01S7/48 ,  G01S7/499 ,  G01S17/894

Abstract: Disclosed are a LiDAR assembly and an apparatus with a detection function. The LiDAR assembly includes: a transmitter configured to emit first laser light along a first direction; a first scanner, where an input terminal of the first scanner faces to an output terminal of the transmitter, and the first scanner is configured to control the first laser light to be deflected from the first direction to a plurality of different first deflection directions, and emit the first laser light along the plurality of first deflection directions to a target object; a receiver configured to receive laser light reflected by the target object and convert an optical signal into an electrical signal; and a signal processing unit configured to receive the electrical signal, analyze and compute the electrical signal to obtain information about a distance from the target object and a shape of the target object.

公开(公告)号：US20240365478A1

公开(公告)日：2024-10-31

申请号：US18769438

申请日：2024-07-11

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guoteng LI ,  Shuilang DONG ,  Xinhong LU ,  Liuqing LI ,  Jingshang ZHOU ,  Baoman LI ,  Zhao CUI ,  Yingwei LIU

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/16 ,  H05K3/40 ,  H05K5/00

CPC classification number: H05K3/4691 ,  H05K1/111 ,  H05K3/16 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2203/0143 ,  H05K2203/0723 ,  H05K2203/1377

Abstract: Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.