ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND BACKLIGHT MODULE

    公开(公告)号:US20220310660A1

    公开(公告)日:2022-09-29

    申请号:US17418945

    申请日:2020-09-18

    IPC分类号: H01L27/12 G02F1/13357

    摘要: The present disclosure provides an array substrate and a manufacturing method thereof, a display panel and a backlight module. The manufacturing method of the array substrate includes: providing a base substrate; forming a metal wiring layer on a side of the base substrate, the metal wiring layer including a first copper metal layer; forming a planarization layer on a side of the metal wiring layer away from the base substrate; forming a drive lead layer on a side of the planarization layer away from the base substrate, the drive lead layer being electrically connected to the metal wiring layer, the drive lead layer including a second copper metal layer with a thickness larger than that of the first copper metal layer; forming a functional device layer on a side of the drive lead layer away from the base substrate.

    DEBRIS CLEANING DEVICE AND ELECTROPLATING SYSTEM

    公开(公告)号:US20220098752A1

    公开(公告)日:2022-03-31

    申请号:US17398980

    申请日:2021-08-10

    IPC分类号: C25D21/06

    摘要: A debris cleaning device includes: a process treatment tank for containing a liquid medicine and a substrate to be treated, wherein the bottom of the tank body of the process treatment tank is provided with a liquid medicine discharge port, and the side wall of the tank body of the process treatment tank is provided with a liquid medicine inlet port; and a self-circulation debris removal system, the self-circulation debris removal system comprising a circulation pipeline communicating between the liquid medicine discharge port and the liquid medicine inlet port, the circulation pipeline being provided with a control valve for controlling the on-off state of the circulation pipeline, a debris filtering and collecting device for filtering the debris in the circulation pipeline, and a power pump for providing circulation driving force for the liquid medicine in the circulation pipeline.

    SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY PANEL

    公开(公告)号:US20220302177A1

    公开(公告)日:2022-09-22

    申请号:US17550244

    申请日:2021-12-14

    摘要: A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.

    ARRAY SUBSTRATE, METHOD FOR PREPARING ARRAY SUBSTRATE, AND BACKLIGHT MODULE

    公开(公告)号:US20220123024A1

    公开(公告)日:2022-04-21

    申请号:US17281015

    申请日:2020-01-03

    IPC分类号: H01L27/12 H01L27/15

    摘要: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

    FILLING DEVICE AND APPARATUS, ELECTROCHEMICAL DEPOSITION SYSTEM AND FILLING METHOD

    公开(公告)号:US20220290321A1

    公开(公告)日:2022-09-15

    申请号:US17514971

    申请日:2021-10-29

    IPC分类号: C25D21/12 C25D17/02

    摘要: The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.

    SUBSTRATE TRANSFER DEVICE
    9.
    发明申请

    公开(公告)号:US20220168888A1

    公开(公告)日:2022-06-02

    申请号:US17516269

    申请日:2021-11-01

    IPC分类号: B25J9/02 B25J15/02 B25J13/08

    摘要: The present application relates to a substrate transfer device, comprising a horizontally arranged cross beam, and support beams longitudinally arranged at two ends of the cross beam, wherein a substrate carrier is suspended on the cross beam, the substrate carrier is located between the two support beams, and the substrate carrier is parallel to a plane where the two support beams are located, the substrate carrier comprises two side walls oppositely arranged in a horizontal direction, and each of the support beams is provided with an auxiliary clamping structure for clamping the substrate carrier during transferring of the substrate carrier.

    DRIVING SUBSTRATE, METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE

    公开(公告)号:US20210359182A1

    公开(公告)日:2021-11-18

    申请号:US17260778

    申请日:2020-04-10

    IPC分类号: H01L33/62 H01L33/12

    摘要: The present disclosure provides a driving substrate, a method for preparing the same, and a display device. The driving substrate includes: a base substrate; a stress buffer layer located on the base substrate; a plurality of first wirings located on a surface of the stress buffer layer away from the base substrate; a first insulating layer located on a surface of the first wiring away from the base substrate; a plurality of second wiring structures located on a surface of the first insulating layer away from the base substrate; a second insulating layer located on a surface of the second wiring structure away from the base substrate; an electronic element located on a surface of the second insulating layer away from the base substrate.