公开(公告)号：US20240172543A1

公开(公告)日：2024-05-23

申请号：US17779140

申请日：2021-06-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jie SUN ,  Hui WANG ,  Yanming WANG ,  Yage SONG ,  Shengji YANG ,  Yongchun ZHANG ,  Xiaojun MAO ,  Yunjiang ZHANG ,  Meijian LUO

IPC: H10K59/80 ,  H10K59/131

CPC classification number: H10K59/8794 ,  H10K59/131 ,  H10K59/8792

Abstract: The embodiment of the present disclosure provides a display module, which includes a circuit board and a display panel provided on a first surface of the circuit board, wherein the display panel includes a display region and a non-display region located at a periphery of the display region; the first surface of the circuit board is also provided with a frame body, the display panel is located within the frame body, a fixing adhesive is filled between a peripheral edge of the display panel and the frame body, and the fixing adhesive also covers the non-display region of the display panel.

公开(公告)号：US20240359972A1

公开(公告)日：2024-10-31

申请号：US18766713

申请日：2024-07-09

Applicant: Beijing BOE Sensor Technology Co., Ltd. ,  BOE Technology Group Co., Ltd. ,  Beijing BOE Technology Development Co., Ltd.

Inventor： Lihui WANG ,  Yue LI ,  Qiuxu WEI ,  Weilong GUO ,  Wenbo CHANG ,  Taonan ZHANG ,  Jie SUN ,  Nana HE ,  Yanfei REN ,  Feng QU

IPC: B81B7/00

CPC classification number: B81B7/0045 ,  B81B2201/0264 ,  B81B2207/096 ,  B81B2207/11

Abstract: Provided is a package structure, including: an insulating dielectric layer having a first surface and a second surface opposite to each other, wherein at least one first accommodation space running from the first surface to the second surface is formed in the insulating dielectric layer; and at least one conductive post in one-to-one correspondence with the at least one first accommodation space, wherein the conductive post is within the corresponding first accommodation space, a material of the conductive post comprises a non-metallic conductive material, and an absolute value of a difference between a thermal expansion coefficient of the conductive post and a thermal expansion coefficient of the insulating dielectric layer is less than or equal to 8×10−6/° C.; wherein the at least one conductive post comprises at least one first conductive post, two end faces of the first conductive post are flush with the first surface and the second surface, respectively.

公开(公告)号：US20180219123A1

公开(公告)日：2018-08-02

申请号：US15542234

申请日：2017-01-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Long WANG ,  Yanzhao LI ,  Chieh Hsing CHUNG ,  Jie SUN

IPC: H01L33/00 ,  H01L27/15

CPC classification number: H01L33/0079 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/00 ,  H01L2933/0025

Abstract: A light-emitting diode substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of a light-emitting diode (LED) substrate, including: disposing a supporting substrate supporting a plurality of LED units to be opposed to a receiving substrate so that a side of the supporting substrate facing the receiving substrate supports the plurality of LED units; and irradiating a side of the supporting substrate away from the receiving substrate with laser, stripping the LED units from the supporting substrate, and transferring the LED units onto the receiving substrate. The manufacturing method of the LED substrate can better transfer LED units from the supporting substrate onto the receiving substrate.

公开(公告)号：US20240196670A1

公开(公告)日：2024-06-13

申请号：US17794829

申请日：2021-09-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  YUNNAN INVENSIGHT OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Zhijian ZHU ,  Pengcheng LU ,  Junbo WEI ,  Xiao BAI ,  Jie SUN ,  Yage SONG ,  Shengji YANG ,  Xiaochuan CHEN

IPC: H10K59/131 ,  H10K59/95

CPC classification number: H10K59/131 ,  H10K59/95

Abstract: Embodiments of the present disclosure provide a display substrate, a related display motherboard, and a related display panel. The display substrate has a central region and a peripheral region surrounding the central region. The display substrate includes a substrate, a dielectric layer located on the substrate and including a first portion and a second portion arranged in sequence in a direction perpendicular to the substrate, a pad located within the peripheral region and on a surface of the second portion on a side away from the substrate, and a conductive sealing part located within the peripheral region and in the dielectric layer, wherein the conductive sealing part includes at least a first portion adjacent to the pad in a direction parallel to the substrate, and wherein the first portion of the conductive sealing part is covered by the second portion of the dielectric layer.

公开(公告)号：US20160364196A1

公开(公告)日：2016-12-15

申请号：US15150952

申请日：2016-05-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jie SUN

IPC: G06F3/14 ,  G09G5/00

CPC classification number: G06F3/1446 ,  G09G5/003 ,  G09G5/006 ,  G09G2300/026 ,  G09G2310/0221 ,  G09G2356/00

Abstract: The present disclosure provides a splicing screen, a method for determining an address of each splicing screen unit and a master control board. The splicing screen includes a plurality of splicing screen units which are spliced together. Each splicing screen unit includes a master control board, a gravity sensor coupled with the master control board, infrared emitters and infrared receivers. The infrared emitters and the infrared receivers are divided into four groups each including one infrared emitter and one infrared receiver; the four groups are at four sides including top, bottom, left and right sides of each splicing screen unit, respectively. At adjacent sides of adjacent two splicing screen units, two groups have an identical horizontal position or an identical vertical position. In adjacent two splicing screen units, signal is capable of being transmitted among infrared emitters and infrared receivers of only two groups at adjacent sides of adjacent two splicing screen units.

Abstract translation: 本公开提供了拼接屏幕，用于确定每个拼接屏幕单元和主控板的地址的方法。 拼接屏幕包括拼接在一起的多个拼接屏单元。 每个拼接屏单元包括主控板，与主控板耦合的重力传感器，红外发射器和红外接收器。 红外发射器和红外接收器分为四组，每组包括一个红外发射器和一个红外接收器; 四个组分别包括每个拼接屏单元的顶部，底部，左侧和右侧的四个侧面。 在相邻的两个拼接筛单元的相邻侧，两组具有相同的水平位置或相同的垂直位置。 在相邻的两个拼接屏单元中，信号能够在相邻两个拼接屏单元的相邻侧的仅两组的红外发射器和红外接收器之间传输。

公开(公告)号：US20240426680A1

公开(公告)日：2024-12-26

申请号：US18686517

申请日：2023-01-03

Applicant: Beijing BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qiuxu WEI ,  Yue LI ,  Lihui WANG ,  Weilong GUO ,  Yanfei REN ,  Taonan ZHANG ,  Wenbo CHANG ,  Jie SUN ,  Nana HE ,  Shaohua WU ,  Guochen DU ,  Ding DING ,  Feng QU

IPC: G01L1/14

Abstract: An MEMS pressure sensor, a method for manufacturing an MEMS pressure sensor, and a pressure detection device are provided. The MEMS pressure sensor includes: an adapter board; an integrated circuit chip on one side of the adapter board; and a sensor chip on a side of the adapter board away from the integrated circuit chip. The sensor chip includes a first electrode and a second electrode, and the first electrode is between the adapter board and the second electrode; the second electrode includes a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed onto the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity. The first and second electrodes of the sensor chip are electrically connected to the integrated circuit chip through the adapter board.

公开(公告)号：US20190051866A1

公开(公告)日：2019-02-14

申请号：US15570891

申请日：2017-04-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jie SUN ,  Chung Chun LEE ,  Chieh Hsing CHUNG

IPC: H01L51/56 ,  H01L51/52 ,  H01L27/32

Abstract: An organic light-emitting diode (OLED) illuminating lamp sheet and a manufacturing method thereof are provided. The method for manufacturing an OLED illuminating lamp sheet includes: manufacturing an array substrate, the array substrate includes a first base and a first electrode formed on the first base; bonding an electrostatic film to a surface of the array substrate provided with the first electrode, forming a patterned electrostatic film by patterning the electrostatic film, and forming an organic film layer by taking the patterned electrostatic film as a mask; forming a second electrode and obtaining an OLED element; and encapsulating the OLED element and obtaining an OLED illuminating lamp sheet.