摘要:
A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
摘要:
A display panel includes: a backplane, light-emitting devices, first electrodes, and connection traces. The backplane includes a first surface, a second surface opposite thereto, and side surfaces connecting the two surfaces. At least one of the side surfaces is a selected side surface. The light-emitting devices are disposed on the first surface. The first electrodes are disposed on the first surface and are proximate to the selected side surface. Each connection trace includes a first trace segment, a second trace segment, and a third trace segment that are connected in sequence. The first trace segment is disposed on the first surface, and the first trace segment is electrically connected to a first electrode. The second trace segment is disposed on the selected side surface. The third trace segment is disposed on the second surface, and is configured to be electrically connected to a flexible printed circuit.
摘要:
A display panel includes a display substrate having a display area and at least one wiring area, and a protective film including a first protective portion and at least one second protective portion. The first protective portion is disposed on a display side of the display substrate, and covers the display area. The at least one second protective portion each covers a wiring area in the at least one wiring area, and is bent from the display side of the display substrate to a non-display side of the display substrate, by a side of the display substrate. The at least one second protective portion each includes a main film layer and a wiring layer. The wiring layer includes a plurality of wirings. At least one wiring extends from the display side of the display substrate to the non-display side of the display substrate, by the side of the display substrate.
摘要:
A display panel includes: a backplane, a plurality of light-emitting devices, a plurality of connecting leads, a first protective layer and a reflective layer. The backplane includes a first main surface, a second main surface, and a plurality of side surfaces. At least one side surface is as a selected side surface. The plurality of light-emitting devices are disposed on the second main surface and are electrically connected to the plurality of connecting leads. The plurality of connecting leads are disposed on the first main surface, the selected side surface and the second main surface, and each connecting lead sequentially passes through the selected side surface and the second main surface from the first main surface. The first protective layer covers the plurality of connecting leads. The reflective layer includes at least a first portion covering a portion of the first protective layer on the selected side surface.
摘要:
A display panel (10) includes a circuit backplane (1) and a reflective layer (3). The circuit backplane (1) includes a first main surface (11), a second main surface (12), and a plurality of side surfaces (13). The second main surface (12) is disposed opposite to the first main surface (11). The side surfaces (13) each connect the first main surface (11) and the second main surface (12). At least one side surface in the plurality of side surfaces (13) is a selected side surface (13a). The selected side surface (13a) is covered by the reflective layer (3), the reflective layer (3) being configured to be removed under a predetermined process condition.
摘要:
Provided are a display substrate, a tiled display panel and a display device, relating to the field of display technology. The display substrate comprises a base substrate, and a plurality of light-emitting units, a protective layer and a connecting wire which are sequentially stacked in a direction away from the base substrate. One end of the connecting wire is connected to the plurality of light-emitting units through a via hole provided in the protective layer, and the other end is used for connecting a drive circuit, that is, the drive circuit can be directly provided at a side of the protective layer away from the base substrate. When a plurality of display substrates are tiled to form a tiled display panel, there is no need to bend a flexible circuit board at sides of each display substrate, and therefore, the gap between every two adjacent display substrates is small, and the display effect is good.
摘要:
A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.
摘要:
The present disclosure relates to a display panel and a method for manufacturing a display panel. The display panel includes a first substrate having a first wiring, a second substrate having a second wiring, the first substrate, and the second substrate being laminated on each other to form a laminated structure, and a third wiring located on a side surface of the laminated structure, wherein the third wiring connects the first wiring and the second wiring.
摘要:
A method of manufacturing a low temperature polycrystalline silicon thin film and a thin film transistor, a thin film transistor, a display panel and a display device are provided. The method includes: forming an amorphous silicon thin film (01) on a substrate (1); forming a pattern of a silicon oxide thin film (02) covering the amorphous silicon thin film (01), a thickness of the silicon oxide thin film (02) located at a preset region being larger than that of the silicon oxide thin film (02) located at other regions; and irradiating the silicon oxide thin film (02) by using excimer laser to allow the amorphous silicon thin film (01) forming an initial polycrystalline silicon thin film (04), the initial polycrystalline silicon thin film (04) located at the preset region being a target low temperature polycrystalline silicon thin film (05). The polycrystalline silicon thin film has more uniform crystal size.
摘要:
Provides are a display panel, a display module, and a display device. The display panel includes an opening region, a barrier region surrounding the opening region, a display region surrounding the barrier region, a base substrate, a crack blocking structure surrounding the opening region; a barrier wall surrounding the crack blocking structure. The barrier wall and the crack blocking structure include a first metal layer and a first organic layer, an edge of side of the first metal layer away from the base substrate is indented relative to an edge of side of the first organic layer proximal to the base substrate. The barrier wall and the crack blocking structure includes a deep groove penetrating through a film layer between the first organic layer and the base substrate, the deep groove surrounds the opening region. The first organic layer fills the deep groove and is connected to the base substrate.