HIGH-THROUGHPUT TEST CHIP
    1.
    发明公开

    公开(公告)号:US20240181443A1

    公开(公告)日:2024-06-06

    申请号:US17789263

    申请日:2021-08-27

    Abstract: A high-throughput test chip includes: a backplane, a cover plate and a connector. The backplane and the cover plate are aligned to form a plurality of accommodation chambers. Test chip units are disposed on one side of the backplane facing the cover plate, and each of the test chip units is located in the corresponding accommodation chamber. Each of the accommodation chambers is provided with a liquid inlet and a liquid outlet. The connector includes pipelines; each of the pipelines is provided with a valve structure configured to control connection or disconnection of the pipeline. In each pair of a pipeline and an accommodation chamber, an inlet of the pipeline communicates with the liquid outlet of the accommodation chamber; the pipelines form at least one pipeline group, each pipeline group at least includes two pipelines, and the pipelines in each pipeline group share the same sample liquid outlet.

    MICROFLUIDIC SUBSTRATE, MICROFLUIDIC CHIP AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230158508A1

    公开(公告)日:2023-05-25

    申请号:US17753101

    申请日:2021-03-12

    CPC classification number: B01L7/52 B01L3/502707 B01L2300/12 B01L2300/1827

    Abstract: The present disclosure provides a microfluidic substrate, a microfluidic chip and a manufacturing method thereof. The microfluidic substrate includes: a first substrate; a conductive layer on the first substrate; and a defining layer on a side of the conductive layer facing away from the first substrate, the defining layer defining a concave portion; wherein the conductive layer comprises a plurality of conductive patterns corresponding to the concave portion, the plurality of conductive patterns are arranged along a first direction, each conductive pattern extends along a second direction and comprises a first end and a second end, the first direction is perpendicular to the second direction, and each conductive pattern has a maximum local resistance value at the first end and the second end of the conductive pattern.

    DETECTION CHIP, METHOD FOR MANUFACTURING DETECTION CHIP, METHOD FOR OPERATING DETECTION CHIP, AND REACTION SYSTEM

    公开(公告)号:US20220395828A1

    公开(公告)日:2022-12-15

    申请号:US16968245

    申请日:2019-11-13

    Abstract: A detection chip, a method for manufacturing a detection chip, a method for operating a detection chip, and a reaction system are disclosed. The detection chip includes a first substrate, a micro-cavity definition layer, and a heating electrode. The micro-cavity definition layer defines a plurality of micro-reaction chambers. The heating electrode is configured to release heat after being energized. The heating electrode includes a first electrode portion and at least one second electrode portion. Orthographic projections of the plurality of micro-reaction chambers on the first substrate are within an orthographic projection of the first electrode portion on the first substrate, the orthographic projections of the plurality of micro-reaction chambers on the first substrate do not overlap with an orthographic projection of the second electrode portion on the first substrate, and a resistance value of the first electrode portion is greater than a resistance value of the second electrode portion.

    DETECTION CHIP, METHOD OF USING DETECTION CHIP AND REACTION SYSTEM

    公开(公告)号:US20220410149A1

    公开(公告)日:2022-12-29

    申请号:US17430854

    申请日:2021-03-12

    Abstract: A detection chip, a method of using a detection chip and a reaction system are provided. The detection chip includes a first substrate, a micro-chamber definition layer and a heating electrode. The micro-chamber definition layer is located on the first substrate and defines a plurality of micro-reaction chambers. The heating electrode is located on the first substrate and closer to the first substrate than the micro-chamber definition layer, and configured to release heat after being energized. The heating electrode includes a plurality of sub-electrodes, orthographic projections of the plurality of micro-reaction chambers on the first substrate overlap with orthographic projections of at least two of the plurality of sub-electrodes on the first substrate, and the at least two of the plurality of sub-electrodes have different heating values per unit time after being energized.

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