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公开(公告)号：US11345855B2
公开(公告)日：2022-05-31
申请号：US16607217
申请日：2019-04-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Rui Li , Haiyan Sun , Hao Miao , Pengju Zhang , Mingxing Liu , Hong Zhu , Yajie Wang , Jingzhe Fang
Abstract: A liquid crystal composition and a display device are provided. The liquid crystal composition includes a compound having a structure represented by general formula (I) and a compound having a structure represented by general formula (II), and L1, L2, L3 and L4 are independently selected from Z1 is selected from a single bond or —C≡C—; R1, R2 and R3 are independently selected from alkyl, alkenyl, alkynyl, haloalkyl or OR4; and R4 is selected from alkyl, alkenyl, alkynyl or haloalkyl.
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公开(公告)号：US10414683B2
公开(公告)日：2019-09-17
申请号：US15206880
申请日：2016-07-11
Inventor： Liyuan Jiang , Yaokun Zheng , Lianjie Qu , Yajie Wang , Yanqi Jiang
IPC: C03B33/023 , C03B33/02 , C03B33/07 , B26F3/00 , C03C15/00 , B23K26/364 , B23K26/40 , B23K26/359 , B23K28/02 , B23K101/18 , B23K103/00 , C03B33/04
Abstract: A method for cutting a substrate of irregular pattern comprises: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.
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3.发明申请公开(公告)号：US20150218033A1
公开(公告)日：2015-08-06
申请号：US14347138
申请日：2013-10-15
Inventor： Liyuan Jiang , Yaokun Zheng , Lianjie Qu , Yajie Wang , Yanqi Jiang
CPC classification number: C03B33/0222 , B23K26/0087 , B23K26/359 , B23K26/364 , B23K26/40 , B23K28/02 , B23K2101/18 , B23K2103/50 , B23K2103/54 , B26F3/002 , C03B33/04 , C03B33/074 , C03C15/00 , Y10T29/49996 , Y10T225/12
Abstract: A method for cutting a substrate of irregular pattern includes: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.
Abstract translation: 用于切割不规则图案的基板的方法包括：在基板上形成切割线，其中由切割线包围的封闭区域是所需的不规则图案; 在切割线处形成槽线; 以及向所述基板施加外力以将所述基板划分在所述槽线处。 该方法可以显着提高切割不规则图案的基板的精度和效率。
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4.发明授权公开(公告)号：US09416041B2
公开(公告)日：2016-08-16
申请号：US14347138
申请日：2013-10-15
Inventor： Liyuan Jiang , Yaokun Zheng , Lianjie Qu , Yajie Wang , Yanqi Jiang
CPC classification number: C03B33/0222 , B23K26/0087 , B23K26/359 , B23K26/364 , B23K26/40 , B23K28/02 , B23K2101/18 , B23K2103/50 , B23K2103/54 , B26F3/002 , C03B33/04 , C03B33/074 , C03C15/00 , Y10T29/49996 , Y10T225/12
Abstract: A method for cutting a substrate of irregular pattern includes: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.
Abstract translation: 用于切割不规则图案的基板的方法包括：在基板上形成切割线，其中由切割线包围的封闭区域是所需的不规则图案; 在切割线处形成槽线; 以及向所述基板施加外力以将所述基板划分在所述槽线处。 该方法可以显着提高切割不规则图案的基板的精度和效率。
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