ETCHING DEVICE, ETCHING METHOD AND PATTERNING APPARATUS
    1.
    发明申请
    ETCHING DEVICE, ETCHING METHOD AND PATTERNING APPARATUS 审中-公开
    蚀刻装置,蚀刻方法和绘图装置

    公开(公告)号:US20150255266A1

    公开(公告)日:2015-09-10

    申请号:US14446619

    申请日:2014-07-30

    IPC分类号: H01L21/02 H01L21/67

    摘要: The present invention provides an etching device, which comprises a treatment solution tank for containing treatment solution; and a grabbing unit for putting the substrate in the treatment solution tank and moving the treated substrate out of the treatment solution tank. Accordingly, the present invention further provides an etching method for treating a substrate by using the above etching device. The present invention further provides a patterning apparatus comprising the above etching device. According to the present invention, the uniformity of a reaction between the treatment solution and a corresponding material on the substrate can be improved, and damages which may be caused to the pattern by the existing spray mode can be avoided.

    摘要翻译: 本发明提供了一种蚀刻装置,其包括用于包含处理溶液的处理溶液罐; 以及用于将基板放置在处理溶液罐中并将处理过的基板移出处理溶液罐的抓取单元。 因此,本发明还提供了通过使用上述蚀刻装置处理基板的蚀刻方法。 本发明还提供一种包括上述蚀刻装置的图案形成装置。 根据本发明,可以提高处理液与基板上的相应材料之间的反应的均匀性,并且可以避免可能通过现有喷雾模式对图案造成的损害。