Display substrate, tiled display panel and display device

    公开(公告)号:US12237316B2

    公开(公告)日:2025-02-25

    申请号:US17778540

    申请日:2021-06-25

    Abstract: A display substrate, including: a base substrate including at least a side edge and a display area; a plurality of pixel units disposed in the display area, a second pixel unit is located on a side of a first pixel unit close to the side edge, edges of the second pixel unit include the side edge, a third pixel unit is located between the first pixel unit and the second pixel unit, and the third pixel unit is adjacent to the second pixel unit; and a plurality of light emitting diode chips disposed on the base substrate a first light emitting diode chip is located in the first pixel unit, a part of a second light emitting diode chip is located in the second pixel unit, and the other part of the second light emitting diode chip is located in the third pixel unit.

    Display substrate and driving method thereof, and display apparatus

    公开(公告)号:US12198608B2

    公开(公告)日:2025-01-14

    申请号:US18005373

    申请日:2021-11-24

    Abstract: A display substrate includes a plurality of data lines extending in a first direction, and a plurality of sub-pixels. A sub-pixel includes a pixel driving circuit and a light-emitting device. The pixel driving circuit includes a current control circuit, and a duration control circuit electrically connected to the current control circuit and the light-emitting device. The current control circuit is configured to generate a driving signal to drive the light-emitting device to emit light; and the duration control circuit is configured to generate a duration control signal to control a duration of a connection between the current control circuit and the light-emitting device. The current control circuit and the duration control circuit are electrically connected to a same data line.

    Method for transferring chip, display device, chip and target substrate

    公开(公告)号:US11901486B2

    公开(公告)日:2024-02-13

    申请号:US17256185

    申请日:2020-04-03

    Abstract: Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.

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