摘要:
A hot melt adhesive made from a blend of a polypropylene-based polymer, a polyolefin elastomer, and an amorphous polyolefin. These adhesives exhibit excellent molten and pre-set flow allowing them to wet out substrates yet develop properties needed to form and maintain strong bonds making them useful for hygiene, construction, and packaging applications.
摘要:
A hot melt adhesive composition made from polypropylene copolymer or polypropylene impact copolymer, a polyolefin elastomer, a low density polyethylene, a tackifying resin, a plasticizer, and a nucleating agent. These adhesives are fast setting yet show an improved balance of mechanical properties making them useful for hygiene, construction, and packaging applications.
摘要:
A hot melt adhesive made from a blend of a polypropylene-based polymer, a polyolefin elastomer, and an amorphous polyolefin. These adhesives exhibit excellent molten and pre-set flow allowing them to wet out substrates yet develop properties needed to form and maintain strong bonds making them useful for hygiene, construction, and packaging applications.
摘要:
A hot melt adhesive using polypropylene impact copolymers that is particularly well suited for elastic attachment and stretch films in diaper structures. The hot melt adhesive composition is a blend of about 2.5% to about 30%, by weight, of a polypropylene impact copolymer; about 2.5% to about 30%, by weight, of an olefin based elastomer; about 10% to about 70%, by weight, of a tackifying resin having a softening point of at least about 80° C. and up to about 140° C.; about 0% to about 60%, by weight, of a plasticizer; and about 0.1% to about 5% of a stabilizer or antioxidant.
摘要:
A hot melt adhesive composition made from polypropylene copolymer or polypropylene impact copolymer, a polyolefin elastomer, a low density polyethylene, a tackifying resin, a plasticizer, and a nucleating agent. These adhesives are fast setting yet show an improved balance of mechanical properties making them useful for hygiene, construction, and packaging applications.