公开(公告)号：US20220298866A1

公开(公告)日：2022-09-22

申请号：US17662871

申请日：2022-05-11

Applicant: Baker Hughes Holdings LLC

Inventor： Wanjun Cao ,  Marc W. Bird

IPC: E21B10/573 ,  C04B35/528 ,  C04B35/56 ,  C04B35/565 ,  C04B35/563 ,  C22C26/00 ,  B24D18/00 ,  E21B10/567

Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.

公开(公告)号：US11536091B2

公开(公告)日：2022-12-27

申请号：US15993362

申请日：2018-05-30

Applicant: Baker Hughes Holdings LLC

Inventor： Wanjun Cao ,  Marc W. Bird

IPC: E21B10/573 ,  C04B35/528 ,  C04B35/56 ,  C04B35/565 ,  C04B35/563 ,  C22C26/00 ,  B24D18/00 ,  E21B10/567 ,  E21B10/54

Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.

公开(公告)号：US20220275486A1

公开(公告)日：2022-09-01

申请号：US17662807

申请日：2022-05-10

Applicant: Baker Hughes Holdings LLC

Inventor： Wanjun Cao ,  Marc W. Bird

IPC: C22C29/08 ,  E21B10/567 ,  E21B10/573 ,  B22F3/15 ,  C22C29/00 ,  B24D18/00 ,  B22F7/06 ,  C22C29/06

Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.

公开(公告)号：US12018533B2

公开(公告)日：2024-06-25

申请号：US18051184

申请日：2022-10-31

Applicant: Baker Hughes Holdings LLC

Inventor： Wanjun Cao ,  Marc W. Bird

IPC: C04B35/528 ,  B24D18/00 ,  C04B35/56 ,  C04B35/563 ,  C04B35/565 ,  C22C26/00 ,  E21B10/567 ,  E21B10/573 ,  E21B10/54

CPC classification number: E21B10/5735 ,  B24D18/0009 ,  C04B35/528 ,  C04B35/56 ,  C04B35/5607 ,  C04B35/5611 ,  C04B35/5615 ,  C04B35/5618 ,  C04B35/5622 ,  C04B35/563 ,  C04B35/565 ,  C22C26/00 ,  E21B10/5673 ,  C22C2026/006 ,  E21B10/54

Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.

公开(公告)号：US11807920B2

公开(公告)日：2023-11-07

申请号：US17662807

申请日：2022-05-10

Applicant: Baker Hughes Holdings LLC

Inventor： Wanjun Cao ,  Marc W. Bird

IPC: C22C29/08 ,  E21B10/567 ,  E21B10/573 ,  B22F3/15 ,  C22C29/00 ,  B22F7/06 ,  C22C29/06 ,  E21B10/55 ,  B22F5/00 ,  C22C26/00 ,  B24D18/00

CPC classification number: C22C29/08 ,  B22F3/15 ,  B22F7/06 ,  B24D18/0009 ,  C22C29/005 ,  C22C29/067 ,  E21B10/5673 ,  E21B10/5735 ,  B22F2005/001 ,  B22F2998/10 ,  C22C26/00 ,  E21B10/55 ,  B22F2998/10 ,  C22C1/05 ,  B22F3/10 ,  B22F2998/10 ,  C22C1/05 ,  B22F3/15 ,  B22F2998/10 ,  C22C1/05 ,  B22F3/14

Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.

公开(公告)号：US20230091691A1

公开(公告)日：2023-03-23

申请号：US18051184

申请日：2022-10-31

Applicant: Baker Hughes Holdings LLC

Inventor： Wanjun Cao ,  Marc W. Bird

IPC: E21B10/573 ,  C04B35/528 ,  C04B35/56 ,  C04B35/565 ,  C04B35/563 ,  C22C26/00 ,  B24D18/00 ,  E21B10/567

Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.

公开(公告)号：US11292750B2

公开(公告)日：2022-04-05

申请号：US15594174

申请日：2017-05-12

Applicant: Baker Hughes Holdings LLC

Inventor： Marc W. Bird

IPC: E21B10/567 ,  E21B10/46 ,  C04B35/645 ,  B22F7/06 ,  C22C19/07 ,  C22C19/00 ,  C04B35/56 ,  C04B35/63 ,  C04B35/638 ,  C22C1/05 ,  C22C29/00 ,  C22C29/08 ,  B23B27/20 ,  B22F5/00

Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, Al, W, and C. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.

公开(公告)号：US11885182B2

公开(公告)日：2024-01-30

申请号：US17662871

申请日：2022-05-11

Applicant: Baker Hughes Holdings LLC

Inventor： Wanjun Cao ,  Marc W. Bird

IPC: E21B10/573 ,  C04B35/528 ,  C04B35/56 ,  C04B35/565 ,  C04B35/563 ,  B24D18/00 ,  E21B10/567 ,  C22C26/00 ,  E21B10/54

CPC classification number: E21B10/5735 ,  B24D18/0009 ,  C04B35/528 ,  C04B35/56 ,  C04B35/563 ,  C04B35/565 ,  C04B35/5607 ,  C04B35/5611 ,  C04B35/5615 ,  C04B35/5618 ,  C04B35/5622 ,  C22C26/00 ,  E21B10/5673 ,  C22C2026/006 ,  E21B10/54

Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.