摘要:
A multi-cycle, multi-slope analog to digital converter overlaps charge and discharge periods to reduce latency to the end of the measurement following a sampling window. Additionally, charging and discharging of an integration capacitor during the measurement cycle occurs between defined thresholds so as to avoid saturation within the analog to digital converter.
摘要:
A method for characterizing a load on a data line includes the steps of: (A) Applying at least three successive voltages to the data line. Each respective odd-numbered successive voltage of the at least three successive voltages has substantially a first voltage value displaced a first voltage interval from a reference voltage value. Each respective even-numbered successive voltage of the at least three successive voltages has substantially a second voltage value displaced a second voltage interval from the reference voltage value. (B) Measuring a respective current value on the data line while each of the at least three successive voltages is applied to the data line. (C) Comparing the respective current values for selected successive voltages of the at least three successive voltages to determine whether a hysteric impedance change occurs when voltage on the data line is varied.
摘要:
A communication link between two isolated electrical devices provides for adjustable impedances coupled to the communication link signal paths to balance the signal paths and improve CMRR. The communication link may be a bidirectional capacitively coupled differential signal line to improve noise rejection. The capacitance may be realized as portions of circuit board traces, lead frames, IC pins and/or molding on ICs or on an IC package. The variable impedance compensates for variances in the capacitive coupling values so that the signal paths react similarly in the presence of noise or interference. The variable impedance may be set or programmed from stored values that may be digital or analog. The capacitive coupling of the differential signal line permits integration of isolated devices in a common package.
摘要:
A system for measuring signals in a non-linear network is provided which reduces the reliance on hardware and processing support when correcting for A/D offset by performing a pair of dual slope measurement cycles with an integrating analog to digital converter (ADC) circuit. Each of the measurement cycles has at least four phases including a first integrating phase and a first de-integrating phase followed by a second integrating phase and a second de-integrating phase. The system further includes an ADC controller operatively communicative with the integrating ADC circuit for detecting when the first count value is reached during the second de-integrating phase and then resetting the second count value in response to this detection so that the second count value is offset corrected at the end of the second de-integration phase. As a result, a difference calculation is automatically performed during the measurement cycle.
摘要:
Inter-integrated circuit-capable devices for use on an inter-integrated circuit bus are disclosed. The inter-integrated circuit-capable devices include integrated, internally-configurable addressing registers in place of external pins. Cascaded systems of inter-integrated circuit-capable devices for easier addressing are also disclosed as are methods for writing address identifier codes to addressing registers of the cascaded, inter-integrated circuit-capable devices.
摘要:
A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an IC, connected to vertical thermally conductive conduits made of interconnect elements of the IC. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the IC substrate at the other end. The lateral thermoelectric elements are thermally isolated by interconnect dielectric materials on the top side and field oxide on the bottom side. When operated in a generator mode, the metal thermal terminals are connected to a heat source and the IC substrate is connected to a heat sink. Thermal power flows through the vertical conduits to the lateral thermoelectric elements, which generate an electrical potential. The electrical potential may be applied to a component or circuit in the IC. The thermoelectric device may be integrated into an IC without adding fabrication cost or complexity.
摘要:
In one embodiment, an integrated differential isolation loss detector is disclosed that generates a first temperature that is a function of a high side current and a second temperature that is a function of a low side current. A temperature sensor senses the difference between the first and second temperatures and provides an output signal that is indicative of the magnitude and the polarity of the sensed difference. A controller receives the output signal and if the difference is greater than a predetermined magnitude the high side current, the low side current, or both can be disconnected from the load.In another embodiment, an integrated differential isolation loss detector is disclosed that includes a first temperature difference generator that generates first and second temperatures where the difference between the first and second temperatures is a function of the magnitude of the high side current. The integrated differential isolation loss detector further includes a second temperature difference generator coupled to the low side current that generates third and fourth temperatures where the difference between the third and fourth temperatures is a function of the magnitude of the low side current. A second temperature sensor senses the difference between the third and fourth temperatures and provides a second output signal that is indicative of the magnitude and the polarity of the sensed difference. A controller receives the first and second output signals and if the difference between the two output signals is greater than a predetermined magnitude the high side current, the low side current, or both can be disconnected from the load.
摘要:
A current sensor and a method for measuring currents on an integrated circuit in an isolated manner. The current sensor uses a Peltier device as a thermal difference generator to generate a first temperature at a temperature generating junction and a second temperature at a second temperature generating junction. The two temperature generating junctions being spaced apart from one another and where the temperature difference between the first and second temperatures is a function of the sampled current. A Seebeck transducer operating as a thermal difference sensor has a first temperature sensing junction thermally coupled to the first temperature generating junction and a second temperature sensing junction thermally coupled to the second temperature generating junction. The thermal difference detector detects the temperature difference between the first and second temperature sensing junctions and provides a measurement signal that is indicative of the temperature difference between the two temperature sensing junctions that is indicative of the measured current.
摘要:
A detection system to detect disconnection of a powered device from a link of a power over Ethernet system is disclosed. The detection system can include closed-loop control configured to supply a predetermined test current to an electrically conductive path that includes at least a portion of the link via which the powered device is connectable for receiving power. A detector is configured to monitor the closed-loop control, the loop detector providing a disconnect signal if the closed-loop control is outside of expected operating parameters, thereby indicating that the powered device has been disconnected from the link.
摘要:
An integrated circuit (IC) includes a heated portion. The heated portion/IC includes a substrate having a topside semiconductor surface having circuitry configured to provide a circuit function. A pre-metal dielectric (PMD) layer is on the topside semiconductor surface. A metal interconnect stack is on the PMD. A trim portion includes one or more temperature sensitive circuit components which affect a temperature behavior of the IC. The heated portion extends over and beyond an area of the trim portion having an integrated heating structure including at least a first heater formed from a metal interconnect level that includes a first plurality of winding segments which have a varying pitch. A heat spreader formed from a second metal interconnect layer is between trim portion and the first heater. Thermal plugs are lateral to the temperature sensitive circuit components and thermally couple the heat spreader to the topside semiconductor surface.