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公开(公告)号:US06207595B1
公开(公告)日:2001-03-27
申请号:US09033505
申请日:1998-03-02
申请人: Bernd K. Appelt , Lawrence R. Blumberg , William T. Fotorny , Ross D. Havens , Robert M. Japp , Kostas Papathomas , Jan Obrzut , Mark D. Poliks , Amarjit S. Rai
发明人: Bernd K. Appelt , Lawrence R. Blumberg , William T. Fotorny , Ross D. Havens , Robert M. Japp , Kostas Papathomas , Jan Obrzut , Mark D. Poliks , Amarjit S. Rai
IPC分类号: B32B2704
CPC分类号: H01L23/564 , H01L23/08 , H01L23/145 , H01L2924/0002 , H05K1/0366 , H05K2201/029 , H05K2201/0761 , Y10T442/2475 , Y10T442/2959 , Y10T442/2992 , H01L2924/00
摘要: A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.
摘要翻译: 一种其制造的织物材料及其制造方法,其适用于包括芯片载体的电子封装。 当受到高温和高湿度条件的影响时,表现出高的绝缘电阻。
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公开(公告)号:US5013395A
公开(公告)日:1991-05-07
申请号:US91009
申请日:1987-08-28
CPC分类号: C23F1/46
摘要: A method of continuously regenerating a metal containing acid solution enhanced with a salt-free material. The metal dissolved in a bulk metal containing acid solution is continuously oxidized by introducing a gas into a packed reaction vessel. The packed reaction vessel is in operative relationship with the bulk acid solution for recirculating regenerated solution and for receiving spent solution. The gas is introduced substantially cocurrently with the spent acid solution.
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