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    METHODS AND SYSTEMS TO SUPPLEMENT A LISTING VIA A THIRD PARTY TRUST PROVIDER
    2.
    发明申请
    METHODS AND SYSTEMS TO SUPPLEMENT A LISTING VIA A THIRD PARTY TRUST PROVIDER 有权
    通过第三方信托提供者补充上市的方法和系统

    公开(公告)号：US20120109780A1

    公开(公告)日：2012-05-03

    申请号：US12917358

    申请日：2010-11-01

    申请人： Dilip Varadarajan ,  Naoki Ogishi ,  Balaji Thallam Parthasarathy ,  Bin Gong ,  Danny Chang

    发明人： Dilip Varadarajan ,  Naoki Ogishi ,  Balaji Thallam Parthasarathy ,  Bin Gong ,  Danny Chang

    IPC分类号： G06Q30/00

    CPC分类号： G06Q30/0609 ,  G06Q30/0601 ,  G06Q30/0613

    摘要： Various embodiments include a method and system to supplement a listing via a third party trust provider. Responsive to an event associated with an item listing, supplemental trust information is requested from a third party trust provider using at least one predetermined criterion from the item listing. At least a portion of the supplemental trust information may be stored in the item listing. A notification may be presented in response to a trigger based on the at least a portion of the STI stored in the item listing.

    摘要翻译： 各种实施例包括经由第三方信任提供者补充列表的方法和系统。 响应于与项目列表相关联的事件，使用来自项目列表的至少一个预定标准从第三方信任提供者请求补充信任信息。 补充信任信息的至少一部分可以存储在项目列表中。 可以响应于基于存储在项目列表中的STI的至少一部分的触发来呈现通知。

    Chassis with rubber pads
    3.
    发明授权
    Chassis with rubber pads 失效
    带橡胶垫的底盘

    公开(公告)号：US08109486B2

    公开(公告)日：2012-02-07

    申请号：US12631849

    申请日：2009-12-06

    申请人： Bin Gong ,  Ming-Chang Lee

    发明人： Bin Gong ,  Ming-Chang Lee

    IPC分类号： F16M13/00

    CPC分类号： G06F1/1656

    摘要： A chassis includes a base body and a rubber pad. The base body includes a bottom plate and a side plate perpendicular to the bottom plate. A mounting portion is defined in a junction portion of the bottom plate and the side plate. The rubber pad includes a resisting portion and a clamping portion perpendicularly extending from the resisting portion. The rubber pad is detachably received in the mounting portion, with the resisting portion locking with the side plate and the clamping portion engaging with the bottom plate.

    摘要翻译： 底盘包括基体和橡胶垫。 基体包括底板和垂直于底板的侧板。 安装部分限定在底板和侧板的接合部分中。 橡胶垫包括阻力部分和从阻力部分垂直延伸的夹紧部分。 橡胶垫可拆卸地容纳在安装部分中，电阻部分用侧板锁定，夹紧部分与底板接合。

    Methods and systems to supplement a listing via a third party trust provider
    6.
    发明授权
    Methods and systems to supplement a listing via a third party trust provider 有权
    通过第三方信任提供者补充列表的方法和系统

    公开(公告)号：US08200543B2

    公开(公告)日：2012-06-12

    申请号：US12917358

    申请日：2010-11-01

    申请人： Dilip Varadarajan ,  Naoki Ogishi ,  Balaji Thallam Parthasarathy ,  Bin Gong ,  Danny Chang

    发明人： Dilip Varadarajan ,  Naoki Ogishi ,  Balaji Thallam Parthasarathy ,  Bin Gong ,  Danny Chang

    IPC分类号： G06Q30/00

    CPC分类号： G06Q30/0609 ,  G06Q30/0601 ,  G06Q30/0613

    摘要： Various embodiments include a method and system to supplement a listing via a third party trust provider. Responsive to an event associated with an item listing, supplemental trust information is requested from a third party trust provider using at least one predetermined criterion from the item listing. At least a portion of the supplemental trust information may be stored in the item listing. A notification may be presented in response to a trigger based on the at least a portion of the STI stored in the item listing.

    摘要翻译： 各种实施例包括经由第三方信任提供者补充列表的方法和系统。 响应于与项目列表相关联的事件，使用来自项目列表的至少一个预定标准从第三方信任提供者请求补充信任信息。 补充信任信息的至少一部分可以存储在项目列表中。 可以响应于基于存储在项目列表中的STI的至少一部分的触发来呈现通知。

    STRUCTURE AND METHOD FOR SEMICONDUCTOR TESTING
    7.
    发明申请
    STRUCTURE AND METHOD FOR SEMICONDUCTOR TESTING 审中-公开
    半导体测试的结构和方法

    公开(公告)号：US20110074459A1

    公开(公告)日：2011-03-31

    申请号：US12887491

    申请日：2010-09-21

    申请人： Wei Wei Ruan ,  Bin Gong ,  Wen Shi

    发明人： Wei Wei Ruan ,  Bin Gong ,  Wen Shi

    IPC分类号： G01R31/26 ,  H01L23/48

    CPC分类号： G01R31/2858 ,  G01R31/2884 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An embodiment of a test structure in accordance with the present invention comprises a pair of interdigitated comb portions of a metallization layer present in a recess of an inter-layer dielectric (ILD) formed over a polysilicon heater element. A third portion of the metallization layer comprises a serpentine metal line interposed between the comb portions. Application of force voltages, and detection of sense voltages, at various nodes of the metallization portions allows identification of the following: (1) electromigration of metal in the metallization portions; (2) extrusion of metal from one metallization portion to contact another; (3) breakdown voltage (Vbd) and time dependent dielectric breakdown (TDDB) of the ILD; (4) contamination in the metallization portions with mobile ions; and (5) k valve and drift in k value of the ILD. A bias voltage may be applied to the polysilicon heater to accomplish temperature control during testing.

    摘要翻译： 根据本发明的测试结构的实施例包括存在于在多晶硅加热器元件上形成的层间电介质（ILD）的凹部中的金属化层的一对叉指梳状部分。 金属化层的第三部分包括插入在梳部之间的蛇形金属线。 在金属化部分的各个节点施加力电压和检测电压允许识别以下内容：（1）金属化部分中金属的电迁移; （2）从一个金属化部分挤出金属以接触另一个; （3）ILD的击穿电压（Vbd）和时间依赖介电击穿（TDDB）; （4）金属化部分用流动离子污染; 和（5）k阀门和ILD的k值漂移。 可以将偏置电压施加到多晶硅加热器以在测试期间实现温度控制。

    Pad structure and test method
    8.
    发明授权
    Pad structure and test method 有权
    垫结构和试验方法

    公开(公告)号：US08487641B2

    公开(公告)日：2013-07-16

    申请号：US12792533

    申请日：2010-06-02

    申请人： Qiang Guo ,  Bin Gong

    发明人： Qiang Guo ,  Bin Gong

    IPC分类号： G01R31/20

    CPC分类号： G01R31/2884

    摘要： The present invention discloses a pad structure and a method for testing a integrated circuit. The structure includes the first pads and the second pads, where the first pads are distributed over a peripheral portion of the integrated circuit and connected with lead-out wires of the integrated circuit, and the second pads are connected with a metal line at a circuit portion in the integrated circuit and are sized larger than the minimum characteristic dimension of the metal line and of the integrated circuit and smaller than the size of the first pads. The pad structure and method can position a test portion with improved efficiency. Correspondingly, a probe can be used to position the test portion with improved accuracy as well.

    摘要翻译： 本发明公开了一种用于测试集成电路的焊盘结构和方法。 该结构包括第一焊盘和第二焊盘，其中第一焊盘分布在集成电路的周边部分上并与集成电路的引出线连接，第二焊盘与电路的金属线连接 并且其尺寸大于金属线和集成电路的最小特征尺寸，并且小于第一焊盘的尺寸。 衬垫结构和方法可以以改进的效率来定位测试部分。 相应地，可以使用探头来提高测量部分的准确度。

    Pad Structure and Test Method
    9.
    发明申请
    Pad Structure and Test Method 有权
    垫结构和测试方法

    公开(公告)号：US20110062976A1

    公开(公告)日：2011-03-17

    申请号：US12792533

    申请日：2010-06-02

    申请人： Qiang Guo ,  Bin Gong

    发明人： Qiang Guo ,  Bin Gong

    IPC分类号： G01R31/02 ,  G01R31/20

    CPC分类号： G01R31/2884

    摘要： The present invention discloses a pad structure and a method for testing a integrated circuit. The structure includes the first pads and the second pads, where the first pads are distributed over a peripheral portion of the integrated circuit and connected with lead-out wires of the integrated circuit, and the second pads are connected with a metal line at a circuit portion in the integrated circuit and are sized larger than the minimum characteristic dimension of the metal line and of the integrated circuit and smaller than the size of the first pads. The pad structure and method can position a test portion with improved efficiency. Correspondingly, a probe can be used to position the test portion with improved accuracy as well.

    摘要翻译： 本发明公开了一种用于测试集成电路的焊盘结构和方法。 该结构包括第一焊盘和第二焊盘，其中第一焊盘分布在集成电路的周边部分上并与集成电路的引出线连接，第二焊盘与电路的金属线连接 并且其尺寸大于金属线和集成电路的最小特征尺寸，并且小于第一焊盘的尺寸。 衬垫结构和方法可以以改进的效率来定位测试部分。 相应地，可以使用探头来提高测量部分的准确度。

    Failure Detection Method and Failure Detection Apparatus
    10.
    发明申请
    Failure Detection Method and Failure Detection Apparatus 审中-公开
    故障检测方法及故障检测装置

    公开(公告)号：US20110012613A1

    公开(公告)日：2011-01-20

    申请号：US12836093

    申请日：2010-07-14

    申请人： Bin Gong ,  Qiang Guo

    发明人： Bin Gong ,  Qiang Guo

    IPC分类号： G01R31/02

    CPC分类号： G01R31/307 ,  G01R31/2853 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses a failure detection method and a failure detection apparatus for detecting a defect in an electrical conductor. The failure detection method includes: providing at least two output terminals on the electrical conductor under test, the at least two output terminals having identical electric potentials; inputting a constant detection current sequentially to detection points arranged on the electrical conductor under test along a predetermined path; detecting an output current at one or more output terminals of the at least two output terminals; building a correspondence relationship between the detected one or more output currents at the one or more output terminals and positions of the detection points, based on information of the positions of the detection points and information of the detected one or more output currents at the one or more output terminals; and determining from the correspondence relationship whether the detection points have a defect. The failure detection method according to the invention can precisely locate defects; and uses a charged particle beam as the detection current source to avoid the size limitation of irradiation points, thereby satisfying the requirement for failure analysis in a small size.

    摘要翻译： 本发明公开了一种用于检测电导体中的缺陷的故障检测方法和故障检测装置。 故障检测方法包括：在被测电导体上提供至少两个输出端子，所述至少两个输出端子具有相同的电位; 沿着预定路径顺序地将检测点输入到被测电导体上的检测点; 检测所述至少两个输出端子的一个或多个输出端子处的输出电流; 根据检测点的位置信息和检测到的一个或多个输出电流的信息，建立在检测点的一个或多个输出端和检测点的检测到的一个或多个输出电流之间的对应关系， 更多输出端子; 并从所述对应关系确定所述检测点是否具有缺陷。 根据本发明的故障检测方法可以精确地定位缺陷; 并使用带电粒子束作为检测电流源，以避免照射点的尺寸限制，从而满足小尺寸的故障分析的要求。