公开(公告)号：US07141188B2

公开(公告)日：2006-11-28

申请号：US10158513

申请日：2002-05-30

申请人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

发明人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

IPC分类号： H01L21/4763 ,  H01B3/22 ,  C08F8/00 ,  C08J9/02

CPC分类号： H01L21/31695 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/3122 ,  H05K1/0313

摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

公开(公告)号：US07060204B2

公开(公告)日：2006-06-13

申请号：US10404047

申请日：2003-04-02

申请人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

发明人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

IPC分类号： H01B1/12 ,  C08J9/38 ,  C08J9/00

CPC分类号： H01L21/02126 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/31695 ,  H05K1/0313

摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

摘要翻译： 本发明提供一种组合物，其包含：（a）电介质材料; 和（b）包含至少两个稠合芳环的致孔剂，其中每个稠合芳环在其上具有至少一个烷基取代基，并且在相邻芳环上的至少两个烷基取代基之间存在键。 优选地，电介质材料是包含（a）热固性组分的组合物，其包含（1）如下所述的任选的式I的单体和（2）至少一种如下所述的式II的低聚物或聚合物，其中Q，G，h ，I，I和w如下所述，（b）致孔剂。 优选地，致孔剂选自非官能化聚苊烯均聚物，官能化聚苊烯均聚物，聚苊烯共聚物，聚降冰片烯，聚己内酯，聚（2-乙烯基萘），乙烯基蒽，聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚，聚丙烯酸酯，脂族 聚碳酸酯，聚砜，聚丙交酯及其共混物。 本发明的组合物特别可用作微芯片，多芯片模块，层叠电路板和印刷线路板中的介电基板材料。