Compound heat sink
    7.
    发明授权
    Compound heat sink 失效
    复合散热器

    公开(公告)号:US07592695B2

    公开(公告)日:2009-09-22

    申请号:US11609121

    申请日:2006-12-11

    IPC分类号: H01L23/10

    摘要: A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W/m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.

    摘要翻译: 用于去除特别是电子设备或其它部件的热能的复合散热器。 复合散热器包括压模基座元件; 具有至少约150W / m-K的热导率的挤出耗散元件; 以及热连接材料,其定位在所述基部元件和所述耗散元件中的每一个之间并与之热接触,其中所述热连接材料具有大于所述耗散元件的热导率的面内热导率。

    Heat Exchanger System
    8.
    发明申请
    Heat Exchanger System 审中-公开
    换热器系统

    公开(公告)号:US20090101306A1

    公开(公告)日:2009-04-23

    申请号:US11876499

    申请日:2007-10-22

    IPC分类号: F24D3/16 F24H9/06 H05B3/44

    摘要: A heat exchanger system, especially for a room, including a thermal element comprising a surface; a heat spreader comprising at least one sheet of compressed particles of exfoliated graphite having a density of at least about 0.6 g/cc and a thickness of less than about 10 mm, and further comprising a first side and a second side, wherein the heat spreader is positioned relative to the thermal element such that the heat spreader is at least partially wrapped around the thermal element so that the first side of the heat spreader is in a thermal transfer relationship with a portion of the thermal element surface.

    摘要翻译: 一种热交换器系统,特别是用于房间,包括包括表面的热元件; 散热器,其包括至少一片密度为至少约0.6g / cc和厚度小于约10mm的剥离石墨的压缩颗粒片,并且还包括第一侧和第二侧,其中散热器 相对于热元件定位,使得散热器至少部分地围绕热元件缠绕,使得散热器的第一侧与热元件表面的一部分处于热传递关系。

    Compound Heat Sink
    9.
    发明申请
    Compound Heat Sink 失效
    复合散热器

    公开(公告)号:US20080137304A1

    公开(公告)日:2008-06-12

    申请号:US11609121

    申请日:2006-12-11

    IPC分类号: H05K7/20

    摘要: A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W/m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.

    摘要翻译: 用于去除特别是电子设备或其它部件的热能的复合散热器。 复合散热器包括压铸基座元件; 具有至少约150W / m-K的热导率的挤出耗散元件; 以及热连接材料,其定位在所述基部元件和所述耗散元件中的每一个之间并与之热接触,其中所述热连接材料具有大于所述耗散元件的热导率的面内热导率。