摘要:
A plasticating apparatus and method for its use including a rotating screw having a helical flight disposed within and cooperating with the inner wall of a heated barrel with said barrel provided with inlet and outlet openings so that particles of resinous material are introduced through said inlet opening to a helical valley extending along said flight to be plasticated by said screw and advanced towards said outlet opening. A barrier extends along said helical valley to divide said helical valley into coextensive side by side helical valley sections. The barrier extends in a path which is non-parallel and alternating with respect to the helical flight so that the pitch of the barrier is alternately greater than and less than the pitch of the helical flight. The height of the barrier is less than the height of the flight so that the resinous material overflows the barrier due to changes in width of said side by side helical valley sections.
摘要:
A screw for use in an plasticating injection apparatus includes a plurality of interrupted primary flights. An outer surface of a primary valley is formed by the primary flights and features a plurality of plateaus. The plateaus span adjacent sections of the primary flights and define shallow levels between deeper levels of the primary valleys. This depth differential contributes to a turbulent mixing action which, along with the primary and secondary valleys, contributes to improve mixing action within a metering section of the screw. The primary flights are interrupted by secondary valleys which are of opposite hand to the primary valleys.
摘要:
A first dielectric layer is formed on a substrate in a transistor region and an NVM region, a first conductive layer is formed on the first dielectric layer, a second dielectric layer is formed on the first conductive layer, and a second conductive layer is formed over the second dielectric layer. A patterned etch is performed to remove at least a portion of the second conductive layer in the transistor region and to expose an extension portion of the first conductive layer. A first mask is formed over the transistor region having a first pattern, wherein the first pattern is of a gate stack of the MOSFET and an extension in the extension portion extending from the gate stack, and a second mask over the NVM region having a second pattern, wherein the second pattern is of a gate stack of the NVM cell. A patterned etch is then performed.
摘要:
A first dielectric layer is formed on a substrate in a transistor region and an NVM region, a first conductive layer is formed on the first dielectric layer, a second dielectric layer is formed on the first conductive layer, and a second conductive layer is formed over the second dielectric layer. A patterned etch is performed to remove at least a portion of the second conductive layer in the transistor region and to expose an extension portion of the first conductive layer. A first mask is formed over the transistor region having a first pattern, wherein the first pattern is of a gate stack of the MOSFET and an extension in the extension portion extending from the gate stack, and a second mask over the NVM region having a second pattern, wherein the second pattern is of a gate stack of the NVM cell. A patterned etch is then performed.
摘要:
In one embodiment, a method of forming a via includes providing a semiconductor substrate, wherein the semiconductor substrate comprises a through-via region, forming isolation openings and a sacrificial feature in the through-via region, filling the isolation openings to form isolation regions, forming a dielectric layer over the semiconductor substrate after filling the isolation openings, forming a first portion of a through-via opening in the dielectric layer, forming a second portion of the through-via opening in the semiconductor substrate, wherein forming the second portion of the through-via opening comprises removing the sacrificial feature, and forming a conductive material in the first portion and the second portion of the through-via opening.
摘要:
A semiconductor device that has a common border between P and N wells is susceptible to photovoltaic current that is believed to be primarily generated from photons that strike this common border. Photons that strike the border are believed to create electron/hole pairs that separate when created at the PN junction of the border. The photovoltaic current can have a sufficient current density to be destructive to the metal connections to a well if the area of these metal connections to the well is small relative to the length of the border. This photovoltaic current can be reduced below destructive levels by covering the common border sufficiently to reduce the number of photons hitting the common border. The surface area of the connections can also be increased to alleviate the problem.
摘要:
A mechanism is provided for extending useable lifetimes of semiconductor devices that are subject to trapped charge carriers in a gate dielectric. Embodiments of the present invention provide heat to the gate dielectric region from one or more sources, where the heat sources are included in a package along with the semiconductor device. It has been determined that heat, when applied during a period when the channel region of a transistor is in accumulation mode or is not providing a current across the channel, can at least partially recover the device from trapped charge carrier effects. Embodiments of the present invention supply heat to the affected gate dielectric region using mechanisms available where the semiconductor device is used (e.g., in the field).
摘要:
In one embodiment, a method of forming a via includes providing a semiconductor substrate, wherein the semiconductor substrate comprises a through-via region, forming isolation openings and a sacrificial feature in the through-via region, filling the isolation openings to form isolation regions, forming a dielectric layer over the semiconductor substrate after filling the isolation openings, forming a first portion of a through-via opening in the dielectric layer, forming a second portion of the through-via opening in the semiconductor substrate, wherein forming the second portion of the through-via opening comprises removing the sacrificial feature, and forming a conductive material in the first portion and the second portion of the through-via opening.
摘要:
An electronic device can include electronic components and an insulating layer overlying the electronic components. The electronic device can also include a capacitor overlying the insulating layer, wherein the capacitor includes a first electrode and a second electrode. The second electrode can include an opening, wherein from a top view, a defect lies within the opening. In another aspect, a process of forming an electronic device can include forming a first capacitor electrode layer over a substrate, forming a dielectric layer over the first capacitor electrode layer, and forming a second capacitor electrode layer over the dielectric layer. The process can also include detecting a defect and removing a first portion of the second capacitor electrode layer corresponding to the defect, wherein a second portion of the second capacitor electrode layer remains over the dielectric layer.
摘要:
Packaged fluid receptacles include: a plurality of fluid receptacles arranged one next to the other to form a composite structure having a top surface, bottom surface and end walls at a first end and a second end and having a longitudinal axis which extends through the end walls; and a removable support which contacts at least the top surface, bottom surface and end walls, the removable support including an attachment for applying a force to remove the support, preferably in a direction along the longitudinal axis. In a preferred embodiment, the support is one-piece and has a single attachment. Preferably, the packaged fluid receptacles are cuvettes usable in a clinical analyzer. A method for inserting a plurality of cuvettes into a clinical analyzer includes: providing packaged cuvettes as described above; inserting the packaged cuvettes into a cuvette loading station of a clinical analyzer in a manner in which the tab remains accessible to application of a force; securing the packaged cuvettes in the loading station; applying a force to the tab to peel back the support from the cuvettes; and removing the support to provide individual cuvettes.