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    FLOATING FASTNERS
    1.
    发明申请
    FLOATING FASTNERS 有权
    浮动快速

    公开(公告)号：US20130078052A1

    公开(公告)日：2013-03-28

    申请号：US13610822

    申请日：2012-09-11

    申请人： BRETT W. DEGNER ,  Houtan R. Farahani ,  Ron A. Hopkinson ,  William F. Leggett

    发明人： BRETT W. DEGNER ,  Houtan R. Farahani ,  Ron A. Hopkinson ,  William F. Leggett

    IPC分类号： H05K5/02 ,  F16B39/02

    CPC分类号： H05K5/0217 ,  F16B5/025 ,  F16B19/02 ,  F16B33/002 ,  F16B33/02 ,  F16B37/042 ,  F16B37/043 ,  F16B37/048 ,  F16B39/02 ,  G06F1/1613

    摘要： One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening associated with a first component, a second opening associated with a second component, a floating fastener, and a screw. The floating fastener is inserted into the first opening and/or second opening, and includes a threaded opening therein having a primary axis therethrough. The screw is inserted through first and/or second openings and into the threaded opening in the floating fastener. The screw and threaded opening combination is defined by contact between the screw and threaded opening about a thread surface that is substantially perpendicular to the primary axis, a screw thread return angle of 45 degrees or less, and a thread depth that is less than about triple the float between the major diameters of the screw and the threaded opening.

    摘要翻译： 可以使用一个或多个紧固件将部件固定在一起，例如在计算设备上的壳体部件。 每个紧固件可以包括与第一部件相关联的第一开口，与第二部件相关联的第二开口，浮动紧固件和螺钉。 浮动紧固件插入第一开口和/或第二开口中，并且包括其中具有主轴线的螺纹开口。 螺钉通过第一和/或第二开口插入浮动紧固件中的螺纹孔中。 螺钉和螺纹开口组合由螺钉和螺纹开口围绕基本上垂直于主轴线的螺纹表面，45度或更小的螺纹返回角度以及小于约三分之一的螺纹深度的接触限定 在螺杆的大直径和螺纹开口之间的浮子。

    Floating fasteners
    2.
    发明授权
    Floating fasteners 有权
    浮动紧固件

    公开(公告)号：US08573911B2

    公开(公告)日：2013-11-05

    申请号：US13610822

    申请日：2012-09-11

    申请人： Brett W. Degner ,  Houtan R. Farahani ,  Ron A. Hopkinson ,  William F. Leggett

    发明人： Brett W. Degner ,  Houtan R. Farahani ,  Ron A. Hopkinson ,  William F. Leggett

    IPC分类号： F16B39/22

    CPC分类号： H05K5/0217 ,  F16B5/025 ,  F16B19/02 ,  F16B33/002 ,  F16B33/02 ,  F16B37/042 ,  F16B37/043 ,  F16B37/048 ,  F16B39/02 ,  G06F1/1613

    摘要： One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening associated with a first component, a second opening associated with a second component, a floating fastener, and a screw. The floating fastener is inserted into the first opening and/or second opening, and includes a threaded opening therein having a primary axis therethrough. The screw is inserted through first and/or second openings and into the threaded opening in the floating fastener. The screw and threaded opening combination is defined by contact between the screw and threaded opening about a thread surface that is substantially perpendicular to the primary axis, a screw thread return angle of 45 degrees or less, and a thread depth that is less than about triple the float between the major diameters of the screw and the threaded opening.

    摘要翻译： 可以使用一个或多个紧固件将部件固定在一起，例如在计算设备上的壳体部件。 每个紧固件可以包括与第一部件相关联的第一开口，与第二部件相关联的第二开口，浮动紧固件和螺钉。 浮动紧固件插入第一开口和/或第二开口中，并且包括其中具有主轴线的螺纹开口。 螺钉通过第一和/或第二开口插入浮动紧固件中的螺纹孔中。 螺钉和螺纹开口组合由螺钉和螺纹开口围绕基本上垂直于主轴线的螺纹表面，45度或更小的螺纹返回角度以及小于约三分之一的螺纹深度的接触限定 在螺杆的大直径和螺纹开口之间的浮子。

    FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES
    9.
    发明申请
    FASTENERS AND DUAL-THICKNESS THERMAL STAGES IN ELECTRONIC DEVICES 有权
    电子设备中的紧固件和双厚度热阶段

    公开(公告)号：US20130329368A1

    公开(公告)日：2013-12-12

    申请号：US13614996

    申请日：2012-09-13

    申请人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    发明人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/04

    CPC分类号： G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203

    摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

    摘要翻译： 所公开的实施例提供了促进电子设备中的热传递的系统。 该系统包括被配置为将热量从电子设备中的发热部件导出的热管。 该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。 热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。 最后，该系统包括一组紧固件，其被配置为将热平台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。

    Fasteners and dual-thickness thermal stages in electronic devices
    10.
    发明授权
    Fasteners and dual-thickness thermal stages in electronic devices 有权
    电子设备中的紧固件和双层热层

    公开(公告)号：US08976528B2

    公开(公告)日：2015-03-10

    申请号：US13614996

    申请日：2012-09-13

    申请人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    发明人： Brett W. Degner ,  Patrick Kessler ,  Charles A. Schwalbach ,  Richard H. Tan ,  William F. Leggett

    IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/04 ,  G01F1/20

    CPC分类号： G06F1/20 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/203

    摘要： The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

    摘要翻译： 所公开的实施例提供了促进电子设备中的热传递的系统。 该系统包括被配置为将热量从电子设备中的发热部件导出的热管。 该系统还包括沿着发热部件和热管之间的热界面设置的热级，其中热级在发热部件和热管之间施加弹簧力。 热级包括第一厚度以容纳热管，第二厚度大于第一厚度，以增加发热部件和热管之间的弹簧力。 最后，该系统包括一组紧固件，其被配置为将热台固定到电子设备内的表面，并在热管和电子设备的外壳之间形成热间隙。