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1.发明授权公开(公告)号：US07954927B2
公开(公告)日：2011-06-07
申请号：US12024346
申请日：2008-02-01
IPC分类号： B41J2/14
CPC分类号： B41J2/1603 , B41J2/162 , B41J2/1631 , B41J2/1645
摘要： An improved photoimaged nozzle plate for a micro-fluid ejection head, a micro-fluid ejection head containing the nozzle plate, and methods for making a micro-fluid ejection head. The improved nozzle plate is provided by a photoresist nozzle plate layer applied to a thick film layer on a semiconductor substrate containing fluid ejector actuators. The photoresist nozzle plate layer has a plurality of nozzle holes therein. Each of the nozzle holes are formed in the nozzle plate layer from an exit surface of the nozzle plate layer to an entrance surface of the nozzle plate layer. Each of the nozzle holes has a reentrant hole profile with a wall angle greater than about 4° up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle plate layer.
摘要翻译： 用于微流体喷射头的改进的光刻喷嘴板，包含喷嘴板的微流体喷射头以及用于制造微流体喷射头的方法。 改进的喷嘴板由涂覆在包含流体喷射器致动器的半导体衬底上的厚膜层上的光致抗蚀剂喷嘴板层提供。 光致抗蚀剂喷嘴板层中具有多个喷嘴孔。 每个喷嘴孔从喷嘴板层的出射面到喷嘴板层的入射面形成在喷嘴板层中。 每个喷嘴孔具有从垂直于由喷嘴板层的出射表面限定的平面的轴测量的壁角大于约4°至多约30°的折入孔轮廓。
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2.发明授权公开(公告)号：US07364268B2
公开(公告)日：2008-04-29
申请号：US11239799
申请日：2005-09-30
IPC分类号： B41J2/14
CPC分类号： B41J2/1603 , B41J2/162 , B41J2/1631 , B41J2/1645
摘要： An improved photoimaged nozzle plate for a micro-fluid ejection head, a micro-fluid ejection head containing the nozzle plate, and methods for making a micro-fluid ejection head. The improved nozzle plate is provided by a photoresist nozzle plate layer applied to a thick film layer on a semiconductor substrate containing fluid ejector actuators. The photoresist nozzle plate layer has a plurality of nozzle holes therein. Each of the nozzle holes are formed in the nozzle plate layer from an exit surface of the nozzle plate layer to an entrance surface of the nozzle plate layer. Each of the nozzle holes has a reentrant hole profile with a wall angle greater than about 4° up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle plate layer.
摘要翻译： 用于微流体喷射头的改进的光刻喷嘴板，包含喷嘴板的微流体喷射头以及用于制造微流体喷射头的方法。 改进的喷嘴板由涂覆在包含流体喷射器致动器的半导体衬底上的厚膜层上的光致抗蚀剂喷嘴板层提供。 光致抗蚀剂喷嘴板层中具有多个喷嘴孔。 每个喷嘴孔从喷嘴板层的出射面到喷嘴板层的入射面形成在喷嘴板层中。 每个喷嘴孔具有从垂直于由喷嘴板层的出射表面限定的平面的轴测量的壁角大于约4°至多约30°的折入孔轮廓。
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3.发明申请公开(公告)号：US20080122895A1
公开(公告)日：2008-05-29
申请号：US12024346
申请日：2008-02-01
CPC分类号： B41J2/1603 , B41J2/162 , B41J2/1631 , B41J2/1645
摘要： An improved photoimaged nozzle plate for a micro-fluid ejection head, a micro-fluid ejection head containing the nozzle plate, and methods for making a micro-fluid ejection head. The improved nozzle plate is provided by a photoresist nozzle plate layer applied to a thick film layer on a semiconductor substrate containing fluid ejector actuators. The photoresist nozzle plate layer has a plurality of nozzle holes therein. Each of the nozzle holes are formed in the nozzle plate layer from an exit surface of the nozzle plate layer to an entrance surface of the nozzle plate layer. Each of the nozzle holes has a reentrant hole profile with a wall angle greater than about 4° up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle plate layer.
摘要翻译： 用于微流体喷射头的改进的光刻喷嘴板，包含喷嘴板的微流体喷射头以及用于制造微流体喷射头的方法。 改进的喷嘴板由涂覆在包含流体喷射器致动器的半导体衬底上的厚膜层上的光致抗蚀剂喷嘴板层提供。 光致抗蚀剂喷嘴板层中具有多个喷嘴孔。 每个喷嘴孔从喷嘴板层的出射面到喷嘴板层的入射面形成在喷嘴板层中。 每个喷嘴孔具有从垂直于由喷嘴板层的出射表面限定的平面的轴测量的壁角大于约4°至多约30°的折入孔轮廓。
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公开(公告)号：US07169538B2
公开(公告)日：2007-01-30
申请号：US10937968
申请日：2004-09-10
IPC分类号： B41J2/16
CPC分类号： B41J2/164 , B41J2/1603 , B41J2/1645 , B41J2/1646
摘要： A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.
摘要翻译： 用聚合材料（例如，光致抗蚀剂）对衬底的器件表面进行干喷涂以在衬底的表面上提供喷涂层。 喷涂层具有约0.5至约20微米的厚度。 流动特征在喷涂层中形成（例如，成像和显影）。 将喷嘴板层施加到喷涂层。 喷嘴板层具有约5至约40微米的厚度，并且包含形成在其中的喷嘴孔以提供微流体喷射头结构。
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公开(公告)号：US07470505B2
公开(公告)日：2008-12-30
申请号：US11234421
申请日：2005-09-23
IPC分类号： B41J2/16
CPC分类号： B41J2/1433 , B41J2/1603 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645 , Y10S430/146
摘要： Methods of making micro-fluid ejection head structures. One of the methods includes providing a substrate having a plurality fluid ejection actuators on a device surface thereof. The device surface of the substrate also has a thick film layer comprising at least one of fluid flow channels and fluid ejection chambers therein. A removable anti-reflective material is applied to at least one or more exposed portions of the device surface of the substrate. A nozzle layer is applied adjacent to the thick film layer. The nozzle layer is imaged to provide a plurality of nozzles in the nozzle layer, and the non-reflective material is removed from the exposed portions of the device surface of the substrate.
摘要翻译： 制造微流体喷射头结构的方法。 一种方法包括在其装置表面上提供具有多个流体喷射致动器的基板。 衬底的器件表面还具有包括流体流动通道和流体喷射室中的至少一个的厚膜层。 可移除的抗反射材料被施加到衬底的器件表面的至少一个或多个暴露部分。 在厚膜层附近施加喷嘴层。 喷嘴层被成像以在喷嘴层中提供多个喷嘴，并且从基板的装置表面的暴露部分去除非反射材料。
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公开(公告)号：US07600858B2
公开(公告)日：2009-10-13
申请号：US11754715
申请日：2007-05-29
申请人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
发明人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
IPC分类号： B41J2/05
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/1404 , B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645 , Y10T29/49135 , Y10T29/49139 , Y10T29/4914 , Y10T29/49401 , Y10T29/4979 , Y10T29/49798
摘要： A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
摘要翻译： 一种制造用于微流体喷射装置的微流体喷射头结构的方法。 该方法包括将可移除的心轴材料施加到在其装置表面上含有流体喷射致动器的半导体衬底晶片。 心轴材料成型为在衬底晶片上提供流体室和流体通道位置。 将微加工材料施加到成形心轴和晶片的装置表面，以在成形心轴和晶片上提供喷嘴板和流动特征层。 在喷嘴板和流动特征层中形成多个喷嘴孔。 然后将成形的心轴材料从衬底晶片的器件表面移除，以在喷嘴板和流动特征层中提供流体室和流体通道。
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公开(公告)号：US07254890B2
公开(公告)日：2007-08-14
申请号：US11026504
申请日：2004-12-30
申请人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
发明人： Johnathan L. Barnes , Craig M. Bertelsen , Brian C. Hart , Gary R. Williams , Sean T. Weaver , Girish S. Patil
CPC分类号： B41J2/1628 , B41J2/14024 , B41J2/1404 , B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1639 , B41J2/1645 , Y10T29/49135 , Y10T29/49139 , Y10T29/4914 , Y10T29/49401 , Y10T29/4979 , Y10T29/49798
摘要： A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
摘要翻译： 一种制造用于微流体喷射装置的微流体喷射头结构的方法。 该方法包括将可移除的心轴材料施加到在其装置表面上含有流体喷射致动器的半导体衬底晶片。 心轴材料成型为在衬底晶片上提供流体室和流体通道位置。 将微加工材料施加到成形心轴和晶片的装置表面，以在成形心轴和晶片上提供喷嘴板和流动特征层。 在喷嘴板和流动特征层中形成多个喷嘴孔。 然后将成形的心轴材料从衬底晶片的器件表面移除，以在喷嘴板和流动特征层中提供流体室和流体通道。
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公开(公告)号：US07905569B2
公开(公告)日：2011-03-15
申请号：US10941493
申请日：2004-09-15
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1631
摘要： A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.
摘要翻译： 一种用于微流体喷射头基板的基本上无机的平坦化层及其方法。 平坦化层包括由一个或多个电介质化合物组成的多个层和沉积在微流体的第二金属层上的总厚度范围为约1微米至约15微米的至少一个旋涂玻璃（SOG）层 喷射头基板。 平坦化层的最上层选自一种或多种介电化合物和硬掩模材料。
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公开(公告)号：US07938975B2
公开(公告)日：2011-05-10
申请号：US11780234
申请日：2007-07-19
申请人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
发明人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
IPC分类号： G11B5/127
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1645 , B81B2201/052 , B81C1/00531
摘要： A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
摘要翻译： 蚀刻半导体衬底的方法。 该方法包括以下步骤：将光致抗蚀剂蚀刻掩模层施加到衬底的器件表面。 光刻胶蚀刻掩模的选择第一区被掩蔽，成像和显影。 照射光致抗蚀剂蚀刻掩模层的选择的第二区域以辅助蚀刻掩模层从选择的第二区域的后蚀刻剥离。 蚀刻基板以形成通过基板的厚度的流体供给槽。 至少蚀刻掩模层的选择第二区域从衬底去除，由此从蚀刻掩模层的选择的第二区域形成的掩模层残留物显着减少。
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公开(公告)号：US07271105B2
公开(公告)日：2007-09-18
申请号：US10941404
申请日：2004-09-15
申请人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
发明人： John W. Krawczyk , James M. Mrvos , Girish S. Patil , Jason T. Vanderpool , Brian C. Hart , Christopher J. Money , Jeanne M. Saldanha Singh , Karthik Vaideeswaran
IPC分类号： H01L21/461
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1645 , B81B2201/052 , B81C1/00531
摘要： A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
摘要翻译： 蚀刻半导体衬底的方法。 该方法包括以下步骤：将光致抗蚀剂蚀刻掩模层施加到衬底的器件表面。 光刻胶蚀刻掩模的选择第一区被掩蔽，成像和显影。 照射光致抗蚀剂蚀刻掩模层的选择的第二区域以辅助蚀刻掩模层从选择的第二区域的后蚀刻剥离。 蚀刻基板以形成通过基板的厚度的流体供给槽。 至少蚀刻掩模层的选择第二区域从衬底去除，由此从蚀刻掩模层的选择的第二区域形成的掩模层残留物显着减少。
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