公开(公告)号：US06371836B1

公开(公告)日：2002-04-16

申请号：US09666511

申请日：2000-09-20

申请人： Brian J. Brown ,  Robert Tolles ,  James C. Nystrom ,  Doyle Bennett ,  Madhavi Chandrachood

发明人： Brian J. Brown ,  Robert Tolles ,  James C. Nystrom ,  Doyle Bennett ,  Madhavi Chandrachood

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B37/26

摘要： An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.

摘要翻译： 提供了改进的化学机械抛光方法和装置。 使用刷子来持续地从抛光垫上的表面特征（例如凹槽）刷洗浆料颗粒。 以这种方式，当浆料通过下方并且经受晶片抛光头的压缩力时，防止浆料在凹槽内变得压实。 本发明可以通过使用可操作地耦合到抛光垫表面的固定刷或者通过改进的调节组件来实现，该调节组件具有用于调节抛光垫的金刚石表面和用于清洁垫的表面特征的刷子。 当调整组件的刷部分扫过抛光垫的表面时，调节组件的刷部分可以或可以不旋转。

公开(公告)号：US6135868A

公开(公告)日：2000-10-24

申请号：US21765

申请日：1998-02-11

申请人： Brian J. Brown ,  Robert Tolles ,  James C. Nystrom ,  Doyle Bennett ,  Madhavi Chandrachood

发明人： Brian J. Brown ,  Robert Tolles ,  James C. Nystrom ,  Doyle Bennett ,  Madhavi Chandrachood

IPC分类号： B24B37/26 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304 ,  B24B21/18

CPC分类号： B24B53/017 ,  B24B37/26

摘要： An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.

公开(公告)号：US5899801A

公开(公告)日：1999-05-04

申请号：US741662

申请日：1996-10-31

申请人： Robert D. Tolles ,  James C. Nystrom ,  Jeffrey Marks ,  William Bartlett ,  Victor Belitsky

发明人： Robert D. Tolles ,  James C. Nystrom ,  Jeffrey Marks ,  William Bartlett ,  Victor Belitsky

IPC分类号： B24B37/34 ,  B24B1/00 ,  B24B29/00

CPC分类号： B24B37/345

摘要： A chemical mechanical polishing apparatus has a platen with a cavity with an opening to the top surface of the platen. A polishing pad is located at an upper surface of the platen. A flexible membrane is positioned in the cavity to define a first and a second volume. A pressure source is connected to the second volume to flex the membrane, and a lifting member is positioned in the first volume so that flexing of the membrane extends the lifting member through the opening to lift the substrate off the polishing pad. Alternately, de-ionized water may be forced through a passage in the platen and an aperture in the polishing pad to lift the substrate.

摘要翻译： 化学机械抛光装置具有带有空腔的台板，该空腔具有通向台板顶表面的开口。 抛光垫位于压板的上表面。 柔性膜定位在空腔中以限定第一和第二体积。 压力源连接到第二体积以弯曲膜，并且提升构件定位在第一体积中，使得膜的弯曲使提升构件延伸穿过开口以将衬底提离抛光垫。 或者，去离子水可以被迫通过压板中的通道和抛光垫中的孔以提升衬底。

公开(公告)号：US6152806A

公开(公告)日：2000-11-28

申请号：US211997

申请日：1998-12-14

申请人： James C. Nystrom

发明人： James C. Nystrom

IPC分类号： B24B37/04 ,  B24D13/14 ,  B24B1/00 ,  B24B29/00

CPC分类号： B24B37/042 ,  B24B37/16

摘要： A chemical mechanical polishing apparatus includes a plurality of concentric rotatable platens for polishing a substrate. A polishing pad is attached to each platen. Each platen may be rotated independently in either clockwise or counter-clockwise direction.

摘要翻译： 化学机械抛光装置包括用于抛光衬底的多个同心可旋转压板。 抛光垫连接到每个压板。 每个压板可以顺时针或逆时针方向独立旋转。

公开(公告)号：US5938507A

公开(公告)日：1999-08-17

申请号：US549480

申请日：1995-10-27

申请人： Sen-Hou Ko ,  Richard V. Rafloski ,  James C. Nystrom ,  John Prince ,  Alfred A. Goldspiel ,  Stephen J. Blumenkranz ,  Manoocher Birang

发明人： Sen-Hou Ko ,  Richard V. Rafloski ,  James C. Nystrom ,  John Prince ,  Alfred A. Goldspiel ,  Stephen J. Blumenkranz ,  Manoocher Birang

IPC分类号： B24B53/017 ,  H01L21/304 ,  B24B21/18

CPC分类号： B24B53/017

摘要： A conditioner apparatus uses one or more linear conditioners. The linear conditioners extend from the edge of the polishing pad almost to the center of the pad. The conditioner apparatus may use two conditioner rods located on either side of a radial segment. The rods gimbal so that if one rod rises, the other rod is forced downwardly. In addition, the rods can pivot independently about a lateral axis, but they cannot pivot around the vertical axis. The linear conditioners may be actuated by a piezoelectric member or swept by an arm toward and away from the center of the polishing pad.

摘要翻译： 调节装置使用一个或多个线性调节器。 线性调节器从抛光垫的边缘几乎延伸到垫的中心。 调理装置可以使用位于径向段两侧的两个调节杆。 杆状万向节，如果一根杆上升，另一根杆被迫向下。 此外，杆可以围绕横向轴线独立地枢转，但是它们不能围绕垂直轴线枢转。 线性调节器可以由压电元件驱动，或者由臂朝着抛光垫的中心或远离抛光垫的中心扫动。