公开(公告)号：US20150318230A1

公开(公告)日：2015-11-05

申请号：US14801377

申请日：2015-07-16

Applicant: Broadcom Corporation

Inventor： Milind S. Bhagavat ,  Mehdi Saeidi ,  Tak Sang Yeung

IPC: H01L23/467 ,  H05K7/20 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3675 ,  H01L2924/0002 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20154 ,  H01L2924/00

Abstract: Methods, systems, and apparatuses are described for cooling electronic devices. The electrical device includes an integrated circuit die (IC) having opposing first and second surfaces, a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate, and a flexural plate wave device. The flexural plate wave device is configured to generate a stream of air to flow across the electrical device to cool the IC die during operation of the IC die.

Abstract translation: 描述了用于冷却电子设备的方法，系统和装置。 电气装置包括具有相对的第一和第二表面的集成电路管芯（IC），IC模头的第二表面上的使得IC管芯能够耦接到衬底的多个互连件，以及弯曲板形波装置。 弯曲板波装置被配置为产生流过电气装置的空气流，以在IC管芯的工作期间冷却IC管芯。

公开(公告)号：US09472485B2

公开(公告)日：2016-10-18

申请号：US14694614

申请日：2015-04-23

Applicant: Broadcom Corporation

Inventor： Mehdi Saeidi ,  Sam Ziqun Zhao

IPC: H01L23/367 ,  H01L21/52 ,  H01L23/00 ,  H01L23/16 ,  H01L23/42

CPC classification number: H01L23/3675 ,  H01L21/52 ,  H01L23/16 ,  H01L23/42 ,  H01L23/562 ,  H01L24/33 ,  H01L2224/16225 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29076 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first thermal resistance. A second TIM is applied to the die and/or the substrate, and has a second thermal resistance that is greater than the first thermal resistance. An open end of a heat spreader lid is mounted to the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate. The first TIM and the second TIM are each in contact with an inner surface of the heat spreader lid. A ring-shaped stiffener may surround the die and be connected between the substrate and heat spreader lid by the second TIM.

公开(公告)号：US20150228553A1

公开(公告)日：2015-08-13

申请号：US14694614

申请日：2015-04-23

Applicant: Broadcom Corporation

Inventor： Mehdi Saeidi ,  Sam Ziqun Zhao

IPC: H01L23/367 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L21/52 ,  H01L23/16 ,  H01L23/42 ,  H01L23/562 ,  H01L24/33 ,  H01L2224/16225 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29076 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first thermal resistance. A second TIM is applied to the die and/or the substrate, and has a second thermal resistance that is greater than the first thermal resistance. An open end of a heat spreader lid is mounted to the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate. The first TIM and the second TIM are each in contact with an inner surface of the heat spreader lid. A ring-shaped stiffener may surround the die and be connected between the substrate and heat spreader lid by the second TIM.

Abstract translation: 描述了包括两个或更多个热界面材料（TIM）的翻转芯片封装。 通过焊料凸块将裸片安装到基板上。 第一个TIM应用于管芯，并具有第一个热阻。 第二TIM施加到管芯和/或衬底，并且具有大于第一热阻的第二热阻。 散热器盖的开口端安装到基板上，使得模具定位在由散热器盖和基板形成的外壳中。 第一TIM和第二TIM分别与散热器盖的内表面接触。 环形加强件可以围绕模具并且通过第二TIM连接在基板和散热器盖之间。