公开(公告)号：US09972555B2

公开(公告)日：2018-05-15

申请号：US15662127

申请日：2017-07-27

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Soshi Kuroda ,  Tatsuya Kobayashi ,  Takanori Aoki

IPC分类号： H01L29/76 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L29/06 ,  H01L23/58 ,  H01L23/535 ,  H01L21/66 ,  H01L23/29 ,  H01L21/78 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L22/32 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/535 ,  H01L23/562 ,  H01L23/585 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L29/0649 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/06135 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/30183 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10155 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0655

摘要： To provide a semiconductor device having improved reliability. The semiconductor device has a wiring board, bonding land, semiconductor chip mounted on the wiring board via an adhesive layer and having a pad electrode, bonding wire connecting the pad electrode with the bonding land, and sealing body. The sealing body is, in a circuit formation region, in contact with an organic protection film and, in a scribe region and a region between the pad electrode and the scribe region, in contact with a surface protection film while not in contact with the organic protection film. A first side surface is closer to the circuit formation region side than a second one. The adhesive layer covers entirety of the semiconductor chip back surface and the second side surface of the semiconductor chip. The first side surface is in contact with the sealing body without being covered with the adhesive layer.

公开(公告)号：US09704775B2

公开(公告)日：2017-07-11

申请号：US15285206

申请日：2016-10-04

申请人： FUJITSU LIMITED

发明人： Naoaki Nakamura

IPC分类号： H01L21/00 ,  H01L23/373 ,  H01L23/42 ,  B23K1/00 ,  B23K35/26 ,  C22C28/00 ,  H01L21/48 ,  H01L23/16 ,  H01L23/00

CPC分类号： H01L23/3736 ,  B23K1/0016 ,  B23K35/26 ,  C22C28/00 ,  H01L21/4871 ,  H01L23/16 ,  H01L23/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83815 ,  H01L2924/00011 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3511 ,  Y10T428/12458 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/83205

摘要： A thermal interface sheet includes a peripheral portion, in a surface direction, configured to have a melting point higher than the melting point of a central portion in the surface direction.

公开(公告)号：US20170173934A1

公开(公告)日：2017-06-22

申请号：US15453456

申请日：2017-03-08

申请人： Applied Materials, Inc.

发明人： Kadthala Ramaya NARENDRNATH ,  Gangadhar SHEELAVANT ,  Monika AGARWAL ,  Ashish BHATNAGAR

IPC分类号： B32B37/12 ,  H01L21/687 ,  B32B7/14 ,  H01L21/683

CPC分类号： B32B37/1292 ,  B32B7/14 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2221/68318 ,  H01L2221/68381 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/83862 ,  H01L2224/83877 ,  H01L2224/98 ,  H01L2924/15151 ,  Y10T156/10 ,  Y10T279/23 ,  Y10T428/24851 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

公开(公告)号：US20160276312A1

公开(公告)日：2016-09-22

申请号：US15061965

申请日：2016-03-04

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Shinya SHIMIZU ,  Mika KIRITANI ,  Ken MURAMATSU

IPC分类号： H01L25/065 ,  H01L25/16 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/30151 ,  H01L2224/32014 ,  H01L2224/32054 ,  H01L2224/32055 ,  H01L2224/32145 ,  H01L2224/3301 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49052 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/85007 ,  H01L2224/92165 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/05599 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor device includes a wiring substrate, a first semiconductor chip provided on the wiring substrate, a supporting member provided on the wiring substrate in a region which does not overlap with the first semiconductor chip in a plan view when viewed from a direction perpendicular to the wiring substrate, a resin member provided on the first semiconductor chip, and a second semiconductor chip provided on the supporting member and the resin member. A method for manufacturing a semiconductor device includes providing a first semiconductor chip in a first region on a wiring substrate, providing a supporting member in a second region on the wiring substrate, providing a resin member in at least a portion on the first semiconductor chip, and providing a second semiconductor chip on the supporting member and the resin member.

摘要翻译： 半导体器件包括布线基板，设置在布线基板上的第一半导体芯片，在从与第一半导体芯片垂直的方向观察的俯视图中不与第一半导体芯片重叠的区域中的布线基板上设置的支撑部件 布线基板，设置在第一半导体芯片上的树脂部件和设置在支撑部件和树脂部件上的第二半导体芯片。 一种半导体装置的制造方法，其特征在于，在配线基板的第一区域设置第一半导体芯片，在所述布线基板的第二区域设置支撑部件，在所述第一半导体芯片的至少一部分设置树脂部件， 以及在所述支撑构件和所述树脂构件上设置第二半导体芯片。

公开(公告)号：US09406577B2

公开(公告)日：2016-08-02

申请号：US14201935

申请日：2014-03-10

申请人： GLOBAL FOUNDRIES Singapore Pte. Ltd.

发明人： Ranjan Rajoo ,  Kai Chong Chan

IPC分类号： H01L23/10 ,  B81C3/00 ,  H01L21/50 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L23/10 ,  B81C3/001 ,  H01L21/50 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/03002 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/27464 ,  H01L2224/2761 ,  H01L2224/27618 ,  H01L2224/29011 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/3003 ,  H01L2224/30051 ,  H01L2224/3012 ,  H01L2224/30505 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8389 ,  H01L2224/83905 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/0231 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor wafer stack and a method of forming a semiconductor device is disclosed. The method includes providing first and second wafers with top and bottom surfaces. The wafers include edge and non-edge regions, and the first wafer includes devices formed in the non-edge region. A first protection seal may be formed at the edge region of the first wafer. The first and second wafers may further be bonded to form a device stack. The protection seal in the device stack contacts the first and second wafers to form a seal, and protects the devices in subsequent processing.

摘要翻译： 公开了一种半导体晶片堆叠和形成半导体器件的方法。 该方法包括向第一和第二晶片提供顶表面和底表面。 晶片包括边缘和非边缘区域，并且第一晶片包括形成在非边缘区域中的器件。 可以在第一晶片的边缘区域形成第一保护密封。 第一和第二晶片可以进一步结合以形成器件堆叠。 装置堆叠中的保护密封件接触第一和第二晶片以形成密封，并且在随后的处理中保护装置。

公开(公告)号：US09245819B2

公开(公告)日：2016-01-26

申请号：US13402413

申请日：2012-02-22

申请人： Michael B. Vincent

发明人： Michael B. Vincent

IPC分类号： H05K3/30 ,  H01L23/433 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L23/373

CPC分类号： H01L23/4334 ,  H01L21/6835 ,  H01L23/315 ,  H01L23/3737 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/27002 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2748 ,  H01L2224/2784 ,  H01L2224/27848 ,  H01L2224/279 ,  H01L2224/28105 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/29017 ,  H01L2224/29022 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/73153 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/35121 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L21/78 ,  H01L21/568 ,  H01L2224/274 ,  H01L2224/273 ,  H01L2924/00

摘要： An electrical component package is disclosed comprising: an electrical component having an embedded surface, a structure attached to the electrical component opposite the embedded surface, a conductive adhesive directly attached to the embedded surface, where the conductive adhesive is shaped to taper away from the embedded surface, and an encapsulation material covering the conductive adhesive and the electrical component. In various embodiments, the tapered conductive adhesive facilitates the securing of the conductive adhesive to the electrical component by the encapsulation material. Also disclosed are various methods of forming an electrical component package having a single interface conductive interconnection on the embedded surface. The conductive interconnection is configured to maintain an interconnection while under stress forces. Further disclosed in a method of applied a conductive adhesive that enables design flexibility regarding the shape and depth of the conductive interconnection.

摘要翻译： 公开了一种电气部件封装，包括：具有嵌入表面的电气部件，与嵌入表面相对的电气部件附接的结构，直接附着到嵌入表面的导电粘合剂，其中导电粘合剂成形为远离嵌入式 表面和覆盖导电粘合剂和电气部件的封装材料。 在各种实施例中，锥形导电粘合剂有助于通过封装材料将导电粘合剂固定到电气部件。 还公开了形成在嵌入表面上具有单个界面导电互连的电气部件封装的各种方法。 导电互连配置为在应力下保持互连。 进一步公开了一种应用导电粘合剂的方法，其使得能够对导电互连的形状和深度设计灵活性。

公开(公告)号：US20150340308A1

公开(公告)日：2015-11-26

申请号：US14323759

申请日：2014-07-03

申请人： Broadcom Corporation

发明人： Edward LAW ,  Sam Ziqun Zhao ,  Kunzhong Hu ,  Rezaur Rahman Khan

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05672 ,  H01L2224/06135 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/29012 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00014

摘要： A reconstituted semiconductor package and a method of making a reconstituted semiconductor package are described. An array of die-attach substrates is formed onto a carrier. A semiconductor device is mounted onto a first surface of each of the die-attach substrates. An interposer substrate is mounted over each of the semiconductor devices. The interposer substrates are electrically connected to the first surface of the respective die-attach substrates. A molding compound is filled in open spaces within and between the interposer substrates mounted to their respective die-attach substrates to form an array of reconstituted semiconductor packages. Electrical connections are mounted to a second surface of the die-attach substrates. The array of reconstituted semiconductor packages is singulated through the molding compound between each of the die-attach substrates and respective mounted interposer substrates.

摘要翻译： 描述了重构的半导体封装和制造重构的半导体封装的方法。 芯片附着基板的阵列形成在载体上。 半导体器件安装在每个裸片附着衬底的第一表面上。 插入器基板安装在每个半导体器件上。 插入器基板电连接到各个管芯附着基板的第一表面。 将模塑料填充在安装到它们各自的管芯附着衬底上的插入器衬底之内和之间的开放空间中，以形成重构的半导体封装的阵列。 电连接被安装到管芯附接衬底的第二表面。 重新组装的半导体封装的阵列通过模具化合物在每个裸片附着衬底和相应的安装的插入器衬底之间分割。

公开(公告)号：US09112001B2

公开(公告)日：2015-08-18

申请号：US14173406

申请日：2014-02-05

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Chia-Pao Shu ,  Chun-wen Cheng ,  Kuei-Sung Chang ,  Hsin-Ting Huang ,  Shang-Ying Tsai ,  Jung-Huei Peng

IPC分类号： H01L21/30 ,  H01L21/768 ,  B81C1/00 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/76838 ,  B81C1/00238 ,  B81C1/00269 ,  B81C2203/019 ,  H01L23/49838 ,  H01L23/528 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05617 ,  H01L2224/05638 ,  H01L2224/061 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/26145 ,  H01L2224/29011 ,  H01L2224/29014 ,  H01L2224/29017 ,  H01L2224/2902 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29181 ,  H01L2224/301 ,  H01L2224/32058 ,  H01L2224/321 ,  H01L2224/32106 ,  H01L2224/32148 ,  H01L2224/83203 ,  H01L2224/83365 ,  H01L2224/83805 ,  H01L2225/06527 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/01014 ,  H01L2924/01037 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/00014

摘要： A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates.

摘要翻译： 形成封装系统的方法包括提供具有金属焊盘和至少一个金属保护环的第一基板。 该方法还包括用第二衬底的半导体焊盘接合第一衬底的金属焊盘，其中至少一个金属保护环被配置为至少部分地与半导体焊盘相互作用以形成至少第一部分的电 在第一和第二基板之间接合材料。

公开(公告)号：US20150202851A1

公开(公告)日：2015-07-23

申请号：US14417898

申请日：2012-07-30

申请人： Erich Thallner

发明人： Erich Thallner

IPC分类号： B32B37/00 ,  B32B7/04 ,  B32B37/18

CPC分类号： B32B37/0076 ,  B32B7/045 ,  B32B37/18 ,  B32B2457/14 ,  H01L21/6835 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54493 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/0556 ,  H01L2224/131 ,  H01L2224/14145 ,  H01L2224/276 ,  H01L2224/29011 ,  H01L2224/29014 ,  H01L2224/2902 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/32052 ,  H01L2224/32055 ,  H01L2224/32145 ,  H01L2224/32502 ,  H01L2224/32506 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75253 ,  H01L2224/75822 ,  H01L2224/75824 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/831 ,  H01L2224/83193 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10155 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T428/24826 ,  Y10T428/24942 ,  H01L2224/83 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for bonding a first substrate to a second substrate including the steps of: making contact of a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, as a result of which a common contact area is formed; and producing a bond interconnection between the first substrate and the second substrate outside the common contact area. The invention also relates to a corresponding device and a substrate composite of a first substrate and a second substrate, in which a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, forms a common contact area, outside the common contact area there being a bond interconnection between the first substrate and the second substrate.

摘要翻译： 一种将第一基板接合到第二基板的方法，包括以下步骤：使第一基板的第一接触区域与第二基板的第二接触区域接触，该第二接触区域与第一接触区域平行排列， 其结果是形成公共接触区域; 以及在所述公共接触区域之外的所述第一基板和所述第二基板之间产生接合互连。 本发明还涉及第一衬底和第二衬底的相应的器件和衬底复合材料，其中第一衬底的第一接触区域具有第二衬底的第二接触区域，该第二区域平行于第一衬底 接触区域形成公共接触区域，在公共接触区域之外，在第一基板和第二基板之间具有接合互连。

公开(公告)号：US09070627B2

公开(公告)日：2015-06-30

申请号：US14031000

申请日：2013-09-18

申请人： Broadcom Corporation

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/48 ,  H01L23/00

CPC分类号： H01L24/17 ,  H01L21/4853 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29007 ,  H01L2224/29012 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/29035 ,  H01L2224/29036 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/3012 ,  H01L2224/30131 ,  H01L2224/30141 ,  H01L2224/30179 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/9221 ,  H01L2224/92242 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit (IC) package includes an IC die having a first surface and a second surface opposite of the first surface. The IC package includes first contact members coupled to the second surface of the IC die. The IC package includes a bottom substrate having a first surface and a second surface opposite of the first surface, where the first surface of the bottom substrate is coupled to the second surface of the IC die via the first contact members. The IC package includes an interposer substrate coupled to the first surface of the IC die via an adhesive material, where the adhesive material is disposed on at least a surface of the interposer substrate. The IC package includes second contact members coupled along a periphery of the interposer substrate, where the interposer substrate is coupled to the first surface of the bottom substrate via the second contact members.

摘要翻译： 集成电路（IC）封装包括具有第一表面和与第一表面相对的第二表面的IC管芯。 IC封装包括耦合到IC管芯的第二表面的第一接触构件。 IC封装包括具有第一表面和与第一表面相对的第二表面的底部衬底，其中底部衬底的第一表面经由第一接触构件联接到IC管芯的第二表面。 IC封装包括通过粘合剂材料耦合到IC管芯的第一表面的插入器基板，其中粘合材料设置在中介层基板的至少一个表面上。 IC封装包括沿着插入器衬底的周边耦合的第二接触构件，其中插入器衬底经由第二接触构件联接到底部衬底的第一表面。