公开(公告)号：US06710461B2

公开(公告)日：2004-03-23

申请号：US10162905

申请日：2002-06-06

申请人： Bruce C. S. Chou ,  Hsien-Ming Wu ,  Ping-Chin Sun

发明人： Bruce C. S. Chou ,  Hsien-Ming Wu ,  Ping-Chin Sun

IPC分类号： H01L2348

CPC分类号： B81B7/007 ,  B81C1/00888 ,  H01L23/147 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701

摘要： The present invention provides a wafer level package of micro electromechanical devices. The wafer level package of the present invention comprises a wafer having a plurality of micro electromechanical devices and a package wafer of the same size. A plurality of conductor plugs penetrate through the upper and lower surfaces of the package wafer. Solder bumps are formed on the conductor plugs to be adhered to predetermined solder bumps on the micro electromechanical device wafer so as to form a package device. The wafer level package of the present invention can prevent micro electromechanical devices from damage during the packaging procedure.

摘要翻译： 本发明提供一种微机电装置的晶片级封装。 本发明的晶片级封装包括具有多个微机电器件和相同尺寸的封装晶片的晶片。 多个导体插塞穿过封装晶片的上表面和下表面。 焊接凸块形成在要粘附到微机电装置晶片上的预定焊料凸块的导体插头上，以形成封装装置。 本发明的晶片级封装可以防止微机电装置在封装过程中损坏。

公开(公告)号：US09073748B2

公开(公告)日：2015-07-07

申请号：US13293917

申请日：2011-11-10

申请人： Bruce C. S. Chou ,  Chen-Chih Fan

发明人： Bruce C. S. Chou ,  Chen-Chih Fan

IPC分类号： H01L29/84 ,  B81B7/00 ,  H01L23/31

CPC分类号： B81C1/00825 ,  B81B7/0054 ,  B81C1/00301 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.

摘要翻译： 微电子机械系统（MEMS）组件包括载体和设置在载体上的MEMS装置。 缓冲层设置在MEMS器件上。 缓冲层的杨氏模量小于MEMS器件的杨氏模量。

公开(公告)号：US09058511B2

公开(公告)日：2015-06-16

申请号：US14082530

申请日：2013-11-18

申请人： Bruce C. S. Chou

发明人： Bruce C. S. Chou

IPC分类号： G06K9/00

CPC分类号： G06K9/0002 ,  G06K9/00013 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A biometrics sensor module includes a housing, a biometrics sensor and a coupling electrode. The housing has a first surface and a second surface opposite to the first surface. The biometrics sensor has a sensing surface, which is disposed on the first surface of the housing and has sensing members arranged in an array. The coupling electrode is disposed on the first or second surface of the housing. Two regions, projected from the sensing surface and the coupling electrode to the second surface of the housing, do not overlap with each other. A coupling signal is provided to the coupling electrode and directly or indirectly couples the coupling signal to an object, so that the sensing members of the biometrics sensor sense biometrics messages of the object contacting with the second surface of the housing.

摘要翻译： 生物测定传感器模块包括壳体，生物测定传感器和耦合电极。 壳体具有与第一表面相对的第一表面和第二表面。 生物测定传感器具有检测表面，其设置在壳体的第一表面上并且具有排列成阵列的感测构件。 耦合电极设置在壳体的第一或第二表面上。 从感测表面和耦合电极突出到壳体的第二表面的两个区域彼此不重叠。 耦合信号被提供给耦合电极并且将耦合信号直接地或间接地耦合到物体，使得生物特征传感器的感测构件感测与物体的第二表面接触的物体的生物测定消息。

公开(公告)号：US07915722B2

公开(公告)日：2011-03-29

申请号：US12003159

申请日：2007-12-20

申请人： Bruce C. S. Chou ,  Chen-Chih Fan

发明人： Bruce C. S. Chou ,  Chen-Chih Fan

IPC分类号： H01L23/02

CPC分类号： G06K9/00053 ,  H01L23/3185 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane.

摘要翻译： 信息感测装置包括基板，一个信息感测芯片，一个导电结构和成型体。 包括输出连接的电输出部分形成在基板上。 信息感测芯片电连接到电输出部分，并且具有安装在基板上的一个底部芯片表面和与物体接近或接触的一个顶部芯片表面以感测对象的特定信息。 导电结构电连接到电输出部分。 模制体与信息感测芯片和至少一个导电结构接触以暴露顶部芯片表面和导电结构的第一表面。 顶部芯片表面设置成与底部芯片表面相对。 顶部芯片表面和第一表面暴露在外部并且设置在基本上相同的平面上。

公开(公告)号：US07406185B2

公开(公告)日：2008-07-29

申请号：US10414214

申请日：2003-04-16

申请人： Bruce C. S. Chou ,  Yuan-Wei Cheng ,  Ching-Fu Tsou ,  Ming-Lin Tsai

发明人： Bruce C. S. Chou ,  Yuan-Wei Cheng ,  Ching-Fu Tsou ,  Ming-Lin Tsai

IPC分类号： G06K9/00 ,  G05B19/00 ,  F25B21/02

CPC分类号： G06K9/0002 ,  G01J5/12

摘要： The present invention provides a fingerprint sensing mechanism using a two-dimensional thermoelectric sensor array to capture the thermal image related to the ridges and valleys on the finger, wherein its fabricating method is totally compatible with integrated circuits processing. Using the body temperature of a human being as the stimulation source for biometrics, a temperature difference is produced from a ridge of a fingerprint contacting the thermoelectric sensor and the temperature gradient is converted into an electrical signal. A plurality of thermoelectric sensors arranged in a two-dimensional array forms a fingerprint sensor so as to obtain the electrical signal output of the ridge profile of the fingerprint.

摘要翻译： 本发明提供一种使用二维热电传感器阵列捕获与手指上的脊和谷有关的热图像的指纹感测机构，其中其制造方法与集成电路处理完全兼容。 使用人体的体温作为生物测定的刺激源，从与热电传感器接触的指纹的脊产生温差，并将温度梯度转换为电信号。 以二维阵列布置的多个热电传感器形成指纹传感器，以获得指纹的脊形轮廓的电信号输出。

公开(公告)号：US07277563B2

公开(公告)日：2007-10-02

申请号：US10638371

申请日：2003-08-12

申请人： Bruce C. S. Chou

发明人： Bruce C. S. Chou

IPC分类号： G06K9/00

CPC分类号： G01L1/146 ,  G01L1/148

摘要： A capacitive micro pressure sensing member and a fingerprint sensor using the same. The sensing member includes a substrate, a first suspended structure, a first protrusion structure, and a second suspended structure. The first suspended structure is located above the substrate and includes a suspended thin plate and at least one compliant suspension arm connected to the suspended thin plate, which is movable so that a distance from the suspended thin plate to the substrate is changed. The first protrusion structure is arranged at a center portion of a top surface of the suspended thin plate. The second suspended structure is arranged on a top surface of the first protrusion structure with a center portion of the second suspended structure contacting the first protrusion structure. The second suspended structure covers the first suspended structure to form a sealed chamber together with the substrate.

摘要翻译： 电容式微压力传感元件和使用其的指纹传感器。 感测构件包括基板，第一悬挂结构，第一突起结构和第二悬挂结构。 第一悬挂结构位于基板上方，并且包括悬挂的薄板和连接到悬挂的薄板的至少一个顺从的悬挂臂，其可移动，使得从悬置的薄板到基板的距离改变。 第一突出结构布置在悬挂薄板的顶表面的中心部分。 第二悬挂结构设置在第一突出结构的顶表面上，第二悬挂结构的中心部分接触第一突出结构。 第二悬挂结构覆盖第一悬挂结构以与基底一起形成密封室。

公开(公告)号：US06900644B2

公开(公告)日：2005-05-31

申请号：US10429733

申请日：2003-05-06

申请人： Bruce C. S. Chou ,  Wallace Y. W. Cheng ,  Chen-Chih Fan

发明人： Bruce C. S. Chou ,  Wallace Y. W. Cheng ,  Chen-Chih Fan

IPC分类号： G01R27/26 ,  G06K9/00

CPC分类号： G06K9/00053

摘要： A capacitive fingerprint sensor against ESD damage and contamination interference includes a substrate, a plurality of plate electrodes, a metal mesh, a plurality of ESD units, a plurality of bonding pads, and a protection layer. The plate electrodes, bonding pads and metal mesh are positioned on the substrate at the same level, and are composed of the same material. The ESD units are connected to the metal mesh that is conducted to the ground, and are exposed via a plurality of first openings. Thus, electrostatic charges from a finger may be discharged through this path to the ground. The metal mesh is covered by the protection layer and is not exposed. The number of the ESD units is far less than that of the plate electrodes so as to reduce the contamination interference on the captured fingerprint image.

摘要翻译： 针对ESD损伤和污染干扰的电容式指纹传感器包括基板，多个平板电极，金属网，多个ESD单元，多个接合焊盘和保护层。 平板电极，接合焊盘和金属网位于相同水平的基板上，由相同的材料组成。 ESD单元连接到传导到地面的金属网，并且经由多个第一开口露出。 因此，来自手指的静电电荷可以通过该路径被排出到地面。 金属网被保护层覆盖，不露出。 ESD单元的数量远远少于平板电极的数量，以便减少对捕获的指纹图像的污染干扰。

公开(公告)号：US08748999B2

公开(公告)日：2014-06-10

申请号：US13452037

申请日：2012-04-20

申请人： Bruce C. S. Chou ,  Jung-Kuo Tu ,  Chen-Chih Fan

发明人： Bruce C. S. Chou ,  Jung-Kuo Tu ,  Chen-Chih Fan

IPC分类号： H01L29/84 ,  G01P15/08 ,  H04R23/00 ,  G01L9/00 ,  H01L21/00

CPC分类号： B81C1/00158 ,  B81C1/00301 ,  G01P15/125 ,  H01G5/18 ,  H01L28/60

摘要： A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.

摘要翻译： 一种器件包括半导体衬底和具有背板的电容传感器，其中所述背板形成所述电容式传感器的第一电容器板。 背板是半导体衬底的一部分。 导电膜通过气隙与半导体衬底间隔开。 电容传感器的电容被配置成响应于多晶硅膜的移动而改变。

公开(公告)号：US07669047B2

公开(公告)日：2010-02-23

申请号：US11455732

申请日：2006-06-20

申请人： Bruce C. S. Chou ,  Jer-Wei Chang

发明人： Bruce C. S. Chou ,  Jer-Wei Chang

IPC分类号： G06F9/00 ,  G06F15/177

CPC分类号： G06F21/32 ,  G06F21/575

摘要： A biometrics signal input device with a USB interface is connected to a computer apparatus to control BIOS booting procedures of the computer apparatus. The computer apparatus communicates with a USB controller of the input device through the USB interface according to a USB communication protocol and regards this device as a USB device. Then, the computer apparatus executes a program stored in a memory of the input device and enables a biometrics sensor to read biometrics data of a user. Then, to-be-identified biometrics data and biometrics template data pre-stored in the memory are transferred to a main memory of the computer apparatus. A CPU of the computer apparatus compares the to-be-identified biometrics data with the biometrics template data. After the comparison passes, the BIOS booting procedures are allowed to be continued until the CPU has completely loaded an operation system stored in a main storage device of the computer apparatus.

摘要翻译： 具有USB接口的生物测定信号输入设备连接到计算机设备以控制计算机设备的BIOS引导过程。 计算机装置根据USB通信协议通过USB接口与输入设备的USB控制器通信，并将该设备视为USB设备。 然后，计算机装置执行存储在输入装置的存储器中的程序，并使生物测定传感器能够读取用户的生物特征数据。 然后，预先存储在存储器中的待识别的生物特征数据和生物特征数据模板数据被传送到计算机设备的主存储器。 计算机装置的CPU将待识别的生物特征数据与生物特征模板数据进行比较。 比较结束之后，允许继续执行BIOS引导程序直到CPU完全加载存储在计算机设备的主存储设备中的操作系统。

公开(公告)号：US07606440B2

公开(公告)日：2009-10-20

申请号：US11376179

申请日：2006-03-16

申请人： Bruce C. S. Chou ,  Yung-Pin Lee ,  Jer-Wei Chang

发明人： Bruce C. S. Chou ,  Yung-Pin Lee ,  Jer-Wei Chang

IPC分类号： G06K9/36

CPC分类号： G06K9/00026

摘要： In a linear image sensing device with image matching function, a linear sensors array senses a finger, which is moving over it, to obtain fragment image analog signals, which are amplified, by a programmable gain amplifier, into amplified signals. An analog-to-digital converter sequentially converts the amplified signals into digital image signals. An image matching module sequentially receives and processes adjacent two of the digital image signals, and outputs continuous non-overlapped fragment images through an input/output interface. A control logic controls operations and communications of the above-mentioned components. A terminal system receives the non-overlapped fragment images and assembles the non-overlapped fragment images into a complete fingerprint image in a manner of stacking the images side by side.

摘要翻译： 在具有图像匹配功能的线性图像感测装置中，线性传感器阵列感测在其上移动的手指，以获得由可编程增益放大器放大到放大信号的片段图像模拟信号。 模数转换器将放大的信号顺序地转换成数字图像信号。 图像匹配模块顺序地接收和处理相邻的两个数字图像信号，并通过输入/输出接口输出连续的非重叠片段图像。 控制逻辑控制上述组件的操作和通信。 终端系统接收非重叠的片段图像，并且以不叠加的片段图像以并排堆叠图像的方式将完整的指纹图像组装成完整的指纹图像。