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公开(公告)号：US20170365978A1
公开(公告)日：2017-12-21
申请号：US15627917
申请日：2017-06-20
Applicant: Bryan LOCHMAN , Thomas LIU , Matthew SAUTER , Bien CHANN , Robin HUANG , Parviz TAYEBATI , Michael DEUTSCH
Inventor： Bryan LOCHMAN , Thomas LIU , Matthew SAUTER , Bien CHANN , Robin HUANG , Parviz TAYEBATI , Michael DEUTSCH
Abstract: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.
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公开(公告)号：US20210028596A1
公开(公告)日：2021-01-28
申请号：US16654339
申请日：2019-10-16
Applicant: Bryan LOCHMAN , Matthew SAUTER , Bien CHANN , Michael DEUTSCH
Inventor： Bryan LOCHMAN , Matthew SAUTER , Bien CHANN , Michael DEUTSCH
Abstract: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.
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公开(公告)号：US20210408759A1
公开(公告)日：2021-12-30
申请号：US17377832
申请日：2021-07-16
Applicant: Bryan LOCHMAN , Matthew SAUTER , Bien CHANN , Michael DEUTSCH
Inventor： Bryan LOCHMAN , Matthew SAUTER , Bien CHANN , Michael DEUTSCH
Abstract: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.
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公开(公告)号：US20180241179A1
公开(公告)日：2018-08-23
申请号：US15949247
申请日：2018-05-11
Applicant: Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
Inventor： Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
CPC classification number: H01S5/4012 , H01S5/005 , H01S5/02 , H01S5/02212 , H01S5/02284 , H01S5/02288 , H01S5/02423 , H01S5/143 , H01S5/4025 , H01S5/4062 , H01S5/4087
Abstract: In various embodiments, a modular laser system features an enclosure having interfaces for accepting input laser beam modules, optical elements for combining beams from the modules into a combined output beam, and a heat-exchange manifold for interfacing with and cooling the modules during operation.
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公开(公告)号：US20190214790A1
公开(公告)日：2019-07-11
申请号：US16237824
申请日：2019-01-02
Applicant: Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
Inventor： Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
Abstract: In various embodiments, a modular laser system features an enclosure having interfaces for accepting input laser beam modules, optical elements for combining beams from the modules into a combined output beam, and a heat-exchange manifold for interfacing with and cooling the modules during operation.
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Patent Agency Ranking
公开(公告)号：US20180041012A1
公开(公告)日：2018-02-08
申请号：US15660134
申请日：2017-07-26
Applicant: Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
Inventor： Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
CPC classification number: H01S5/4012 , H01S5/005 , H01S5/02 , H01S5/02212 , H01S5/02284 , H01S5/02288 , H01S5/02423 , H01S5/143 , H01S5/4025 , H01S5/4062 , H01S5/4087
Abstract: In various embodiments, a modular laser system features an enclosure having interfaces for accepting input laser beam modules, optical elements for combining beams from the modules into a combined output beam, and a heat-exchange manifold for interfacing with and cooling the modules during operation.
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公开(公告)号：US20200185886A1
公开(公告)日：2020-06-11
申请号：US16710093
申请日：2019-12-11
Applicant: Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
Inventor： Parviz TAYEBATI , Bien CHANN , Bryan LOCHMAN , Matthew SAUTER , Wang-Long ZHOU
Abstract: In various embodiments, a modular laser system features an enclosure having interfaces for accepting input laser beam modules, optical elements for combining beams from the modules into a combined output beam, and a heat-exchange manifold for interfacing with and cooling the modules during operation.
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公开(公告)号：US20210066889A1
公开(公告)日：2021-03-04
申请号：US17019756
申请日：2020-09-14
Applicant: Bien CHANN , James BURGESS , Wang ZHOU , Bryan LOCHMAN , Francisco VILLARREAL-SAUCEDO
Inventor： Bien CHANN , James BURGESS , Wang ZHOU , Bryan LOCHMAN , Francisco VILLARREAL-SAUCEDO
Abstract: In various embodiments, wavelength beam combining laser systems incorporate etalons to establish external lasing cavities and/or to combine multiple input beams into a single output beam.
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公开(公告)号：US20170098923A1
公开(公告)日：2017-04-06
申请号：US15349425
申请日：2016-11-11
Applicant: Bien CHANN , James BURGESS , Wang ZHOU , Bryan LOCHMAN , Francisco VILLARREAL-SAUCEDO
Inventor： Bien CHANN , James BURGESS , Wang ZHOU , Bryan LOCHMAN , Francisco VILLARREAL-SAUCEDO
CPC classification number: H01S5/4012 , H01S5/141 , H01S5/405 , H01S5/4062 , H01S5/4087
Abstract: In various embodiments, wavelength beam combining laser systems incorporate etalons to establish external lasing cavities and/or to combine multiple input beams into a single output beam.
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公开(公告)号：US20210199902A1
公开(公告)日：2021-07-01
申请号：US17141365
申请日：2021-01-05
Applicant: Parviz TAYEBATI , Wang-Long ZHOU , Bien CHANN , Bryan LOCHMAN
Inventor： Parviz TAYEBATI , Wang-Long ZHOU , Bien CHANN , Bryan LOCHMAN
Abstract: In various embodiments, a beam-parameter adjustment system and focusing system alters a spatial power distribution of a radiation beams before the beam is coupled into an optical fiber or delivered to a workpiece.
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