摘要:
In a flash memory device, which can maintain an enhanced electric field between a control gate and a storage node (floating gate) and has a reduced cell size, and a method of manufacturing the flash memory device, the flash memory device includes a semiconductor substrate having a pair of drain regions and a source region formed between the pair of drain regions, a pair of spacer-shaped control gates each formed on the semiconductor substrate between the source region and each of the drain regions, and a storage node formed in a region between the control gate and the semiconductor substrate. A bottom surface of each of the control gates includes a first region that overlaps with the semiconductor substrate and a second region that overlaps with the storage node. The pair of spacer-shaped control gates are substantially symmetrical with each other about the source region.
摘要:
In a flash memory device, which can maintain an enhanced electric field between a control gate and a storage node (floating gate) and has a reduced cell size, and a method of manufacturing the flash memory device, the flash memory device includes a semiconductor substrate having a pair of drain regions and a source region formed between the pair of drain regions, a pair of spacer-shaped control gates each formed on the semiconductor substrate between the source region and each of the drain regions, and a storage node formed in a region between the control gate and the semiconductor substrate. A bottom surface of each of the control gates includes a first region that overlaps with the semiconductor substrate and a second region that overlaps with the storage node. The pair of spacer-shaped control gates are substantially symmetrical with each other about the source region.
摘要:
In a flash memory device, which can maintain an enhanced electric field between a control gate and a storage node (floating gate) and has a reduced cell size, and a method of manufacturing the flash memory device, the flash memory device includes a semiconductor substrate having a pair of drain regions and a source region formed between the pair of drain regions, a pair of spacer-shaped control gates each formed on the semiconductor substrate between the source region and each of the drain regions, and a storage node formed in a region between the control gate and the semiconductor substrate. A bottom surface of each of the control gates includes a first region that overlaps with the semiconductor substrate and a second region that overlaps with the storage node. The pair of spacer-shaped control gates are substantially symmetrical with each other about the source region.
摘要:
In a flash memory device, which can maintain an enhanced electric field between a control gate and a storage node (floating gate) and has a reduced cell size, and a method of manufacturing the flash memory device, the flash memory device includes a semiconductor substrate having a pair of drain regions and a source region formed between the pair of drain regions, a pair of spacer-shaped control gates each formed on the semiconductor substrate between the source region and each of the drain regions, and a storage node formed in a region between the control gate and the semiconductor substrate. A bottom surface of each of the control gates includes a first region that overlaps with the semiconductor substrate and a second region that overlaps with the storage node. The pair of spacer-shaped control gates are substantially symmetrical with each other about the source region.
摘要:
A transistor having a gate dielectric layer of partial thickness difference and a method of fabricating the same are provided. The method includes forming a gate dielectric layer having a main portion with a relatively thin thickness formed on a semiconductor substrate, and a sidewall portion with a relatively thick thickness formed on both sides of the main portion. A first gate is formed overlapping the main portion of the gate dielectric layer, and forming a second gate layer covering the sidewall portion of the gate dielectric layer and covering the first gate. The second gate layer is etched, thereby forming second gates patterned with a spacer shape on sidewalls of the first gate. The exposed sidewall portion of the gate dielectric layer is selectively etched using the second gates as a mask, thereby forming a pattern of the gate dielectric layer to be aligned with the second gates. A source/drain is formed in a portion of the semiconductor substrate exposed by the second gates.
摘要:
A transistor having a gate dielectric layer of partial thickness difference and a method of fabricating the same are provided. The method includes forming a gate dielectric layer having a main portion with a relatively thin thickness formed on a semiconductor substrate, and a sidewall portion with a relatively thick thickness formed on both sides of the main portion. A first gate is formed overlapping the main portion of the gate dielectric layer, and forming a second gate layer covering the sidewall portion of the gate dielectric layer and covering the first gate. The second gate layer is etched, thereby forming second gates patterned with a spacer shape on sidewalls of the first gate. The exposed sidewall portion of the gate dielectric layer is selectively etched using the second gates as a mask, thereby forming a pattern of the gate dielectric layer to be aligned with the second gates. A source/drain is formed in a portion of the semiconductor substrate exposed by the second gates.
摘要:
A transistor having a gate dielectric layer of partial thickness difference and a method of fabricating the same are provided. The method includes forming a gate dielectric layer having a main portion with a relatively thin thickness formed on a semiconductor substrate, and a sidewall portion with a relatively thick thickness formed on both sides of the main portion. A first gate is formed overlapping the main portion of the gate dielectric layer, and forming a second gate layer covering the sidewall portion of the gate dielectric layer and covering the first gate. The second gate layer is etched, thereby forming second gates patterned with a spacer shape on sidewalls of the first gate. The exposed sidewall portion of the gate dielectric layer is selectively etched using the second gates as a mask, thereby forming a pattern of the gate dielectric layer to be aligned with the second gates. A source/drain is formed in a portion of the semiconductor substrate exposed by the second gates.
摘要:
Provided is a method of manufacturing a semiconductor device, by which a cell transistor formed on a cell array area of a semiconductor substrate employs a structure in which an electrode in the shape of spacers is used to form a gate and a multi-bit operation is possible using localized bits, and transistors having structures optimized to satisfy different requirements depending upon functions of the transistors can be formed on a peripheral circuit area which is the residual area of the semiconductor substrate. In this method, a cell transistor is formed on the cell array area. The cell transistor includes a notch gate structure, a first channel region formed on a semiconductor substrate under the notch gate structure, a source region and a drain region formed on both sides of the first channel region, a first gate insulation film formed between the first channel region and the notch gate structure, and a memory layer locally formed on areas adjacent to the source and drain regions between the first channel region and the notch gate structure. At the same time that the cell transistor is formed, a plurality of peripheral circuit transistors including at least one transistor having a different structure from the cell transistor are formed on the peripheral circuit area.
摘要:
Provided is a method of manufacturing a semiconductor device, by which a cell transistor formed on a cell array area of a semiconductor substrate employs a structure in which an electrode in the shape of spacers is used to form a gate and a multi-bit operation is possible using localized bits, and transistors having structures optimized to satisfy different requirements depending upon functions of the transistors can be formed on a peripheral circuit area which is the residual area of the semiconductor substrate. In this method, a cell transistor is formed on the cell array area. The cell transistor includes a notch gate structure, a first channel region formed on a semiconductor substrate under the notch gate structure, a source region and a drain region formed on both sides of the first channel region, a first gate insulation film formed between the first channel region and the notch gate structure, and a memory layer locally formed on areas adjacent to the source and drain regions between the first channel region and the notch gate structure. At the same time that the cell transistor is formed, a plurality of peripheral circuit transistors including at least one transistor having a different structure from the cell transistor are formed on the peripheral circuit area.
摘要:
Provided is a method of manufacturing a semiconductor device, by which a cell transistor formed .on a cell array area of a semiconductor substrate employs a structure in which an electrode in the shape of spacers is used to form a gate and a multi-bit operation is possible using localized bits, and transistors having structures optimized to satisfy different requirements depending upon functions of the transistors can be formed on a peripheral circuit area which is the residual area of the semiconductor substrate. In this method, a cell transistor is formed on the cell array area. The cell transistor includes a notch gate structure, a first channel region formed on a semiconductor substrate under the notch gate structure, a source region and a drain region formed on both sides of the first channel region, a first gate insulation film formed between the first channel region and the notch gate structure, and a memory layer locally formed on areas adjacent to the source and drain regions between the first channel region and the notch gate structure. At the same time that the cell transistor is formed, a plurality of peripheral circuit transistors including at least one transistor having a different structure from the cell transistor are formed on the peripheral circuit area.