METHODS AND APPARATUS FOR CONTROLLING POWER DISTRIBUTION IN SUBSTRATE PROCESSING SYSTEMS
    1.
    发明申请
    METHODS AND APPARATUS FOR CONTROLLING POWER DISTRIBUTION IN SUBSTRATE PROCESSING SYSTEMS 审中-公开
    用于控制基板处理系统中功率分配的方法和装置

    公开(公告)号:US20130014894A1

    公开(公告)日:2013-01-17

    申请号:US13190985

    申请日:2011-07-26

    IPC分类号: C23F1/08 C23C16/52 C23C16/505

    摘要: Methods and apparatus for controlling power distribution in a substrate processing system are provided. In some embodiments, a substrate processing system including a process chamber having a substrate support and a processing region disposed above the substrate support; a first conduit disposed above the processing region to provide a portion of a first toroidal path that extends through the first conduit and across the processing region; a second conduit disposed above the processing region to provide a portion of a second toroidal path that extends through the second conduit and across the processing region; an RF generator coupled to the first and second conduits to provide RF energy having a first frequency to each of the first and second conduits; an impedance matching network disposed between the RF generator and the first and second conduits; and a power divider to control the amount of RF energy provided to the first and second conduits from the RF generator.

    摘要翻译: 提供了一种用于控制基板处理系统中的配电的方法和装置。 在一些实施例中,衬底处理系统包括具有衬底支撑件的处理室和设置在衬底支架上方的处理区域; 设置在所述处理区域上方以提供延伸穿过所述第一管道并横跨所述处理区域的第一环形路径的一部分的第一管道; 设置在所述处理区域上方的第二导管,以提供延伸穿过所述第二导管并横跨所述处理区域的第二环形路径的一部分; 耦合到所述第一和第二导管的RF发生器,以向所述第一和第二导管中的每一个提供具有第一频率的RF能量; 设置在所述RF发生器与所述第一和第二管道之间的阻抗匹配网络; 以及功率分配器,用于控制从RF发生器提供给第一和第二导管的RF能量的量。

    CEILING ELECTRODE WITH PROCESS GAS DISPERSERS HOUSING PLURAL INDUCTIVE RF POWER APPLICATORS EXTENDING INTO THE PLASMA
    3.
    发明申请
    CEILING ELECTRODE WITH PROCESS GAS DISPERSERS HOUSING PLURAL INDUCTIVE RF POWER APPLICATORS EXTENDING INTO THE PLASMA 有权
    带过程气体分离器的吸顶电极外壳电感式射频电源适配器扩展到等离子体

    公开(公告)号:US20090294065A1

    公开(公告)日:2009-12-03

    申请号:US12132133

    申请日:2008-06-03

    IPC分类号: C23F1/00

    CPC分类号: H01J37/321 H01J37/3244

    摘要: A gas distribution plate is formed of a metallic body having a bottom surface with plural gas disperser orifices and an internal gas manifold feeding the orifices. Each one of an array of discrete RF power applicators held in the plate includes (a) an insulating cylindrical housing extending through the plate, a portion of the housing extending outside of the plate through the bottom surface, and (b) a conductive solenoidal coil contained within the housing, a portion of the coil lying within the portion of the housing that extends outside of the plate through the bottom surface.

    摘要翻译: 气体分配板由具有多个气体分散器孔的底面的金属体和供给该孔的内部气体歧管形成。 保持在板中的分立RF功率施加器阵列中的每一个包括(a)延伸穿过板的绝缘圆柱形壳体,壳体的通过底表面延伸到板外部的部分,以及(b)导电螺线管线圈 所述线圈包含在所述壳体内,所述线圈的一部分位于所述壳体的通过所述底表面延伸到所述板外部的部分中。