LIQUID EJECTING HEAD MANUFACTURING METHOD AND LIQUID EJECTING HEAD
    2.
    发明申请
    LIQUID EJECTING HEAD MANUFACTURING METHOD AND LIQUID EJECTING HEAD 有权
    液体喷射制造方法和液体喷射头

    公开(公告)号:US20150217569A1

    公开(公告)日:2015-08-06

    申请号:US14604957

    申请日:2015-01-26

    IPC分类号: B41J2/16 H05K3/32

    摘要: Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.

    摘要翻译: 可以精确地定位用于密封液体喷射头上的电连接的膜。 具体而言,通过抽吸将胶片的一部分保持在手指状态下进行定位。 接下来,手指在定位状态下向下移动,并且胶片的一部分被按压在布线板上。 以这种方式将一部分膜固定到布线板上,密封树脂在被膜覆盖的同时流动。 因此,可以防止作为密封树脂流动的膜的位置偏移。 结果,可以在精确定位的状态下用薄膜进行覆盖。

    LIQUID EJECTING HEAD AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20200331261A1

    公开(公告)日:2020-10-22

    申请号:US16845628

    申请日:2020-04-10

    IPC分类号: B41J2/14 B41J2/16

    摘要: An element substrate is bonded to a support substrate with high positional accuracy. A manufacturing method of the liquid ejecting head includes curing a first adhesive, which is in contact with an element substrate and a support substrate, at a first temperature to perform first temporary fixing, heating a second adhesive, which is in contact with the element substrate and the support substrate, to a second temperature higher than the first temperature so as to cure the second adhesive and perform second temporary fixing and heating a third adhesive, which is in contact with the element substrate and the support substrate, to a third temperature higher than the second temperature so as to cure the third adhesive and bond the element substrate to the support substrate. An elastic modulus of the second adhesive is larger than an elastic modulus of the first adhesive at the second temperature.