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1.发明授权Printed wiring board, printed circuit board, and method for manufacturing printed circuit board 有权印刷电路板，印刷电路板和印刷电路板的制造方法公开(公告)号：US09474166B2
公开(公告)日：2016-10-18
申请号：US14103608
申请日：2013-12-11
发明人： Keigo Nakazawa , Makoto Ito
CPC分类号： H05K3/3494 , H01L2924/0002 , H05K1/0206 , H05K1/0209 , H05K3/3421 , H05K3/3452 , H05K2201/09572 , H05K2201/09618 , H05K2201/09781 , H05K2201/099 , H05K2201/10969 , H05K2203/042 , H05K2203/0465 , Y10T29/49144 , H01L2924/00
摘要： A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.
摘要翻译： 在安装有散热器的电子部件的第一表面层上，印刷布线板具有面向电子部件的散热器的传热图案。 印刷电路板具有形成在穿过印刷电路板的通孔中的通孔导体，该通孔对应于传热图案，并且热连接到传热图案。 传热图案具有暴露的多个连接焊盘，以便通过焊料与阻焊剂分隔的电子部件的散热器连接。 多个连接平台包括与通孔相邻的平台，并且不与通孔相邻。 在安装时，增强了电子部件的散热，同时增强了传热图案与电子部件的散热器的连接性。
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2.发明申请PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 有权印刷线路板，印刷电路板及制造印刷电路板的方法公开(公告)号：US20140174795A1
公开(公告)日：2014-06-26
申请号：US14103608
申请日：2013-12-11
发明人： Keigo Nakazawa , Makoto Ito
CPC分类号： H05K3/3494 , H01L2924/0002 , H05K1/0206 , H05K1/0209 , H05K3/3421 , H05K3/3452 , H05K2201/09572 , H05K2201/09618 , H05K2201/09781 , H05K2201/099 , H05K2201/10969 , H05K2203/042 , H05K2203/0465 , Y10T29/49144 , H01L2924/00
摘要： A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.
摘要翻译： 在安装有散热器的电子部件的第一表面层上，印刷布线板具有面向电子部件的散热器的传热图案。 印刷电路板具有形成在穿过印刷电路板的通孔中的通孔导体，该通孔对应于传热图案，并且热连接到传热图案。 传热图案具有暴露的多个连接焊盘，以便通过焊料与阻焊剂分隔的电子部件的散热器连接。 多个连接平台包括与通孔相邻的平台，并且不与通孔相邻。 在安装时，增强了电子部件的散热，同时增强了传热图案与电子部件的散热器的连接性。
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