公开(公告)号：US5453582A

公开(公告)日：1995-09-26

申请号：US396867

申请日：1995-03-01

申请人： Toshiaki Amano ,  Kazuhito Hikasa ,  Seishi Kumamoto ,  Takahiro Fujiwara

发明人： Toshiaki Amano ,  Kazuhito Hikasa ,  Seishi Kumamoto ,  Takahiro Fujiwara

IPC分类号： B23K35/00 ,  B23K35/34 ,  H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC分类号： H05K3/3421 ,  B23K35/34 ,  H05K1/111 ,  B23K35/007 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/10689 ,  H05K2203/042 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/3484 ,  Y02P70/611 ,  Y02P70/613

摘要： A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.

摘要翻译： 为了构成焊盘阵列，在绝缘基板上形成有要焊接有组分引线的大量焊盘。 更硬的层预涂在垫上。 每个焊盘具有要安装部件引线的部件引线安装部分和不安装部件引线的部件引线非安装部分。 部件引线非安装部分包括具有大于部件引线安装部分的宽度的宽部分。

公开(公告)号：US5160409A

公开(公告)日：1992-11-03

申请号：US740271

申请日：1991-08-05

申请人： Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

发明人： Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

IPC分类号： H01L21/48 ,  H05K1/11 ,  H05K3/06 ,  H05K3/34

CPC分类号： H05K3/3457 ,  H01L21/4853 ,  H05K1/111 ,  H05K3/3473 ,  H05K1/11 ,  H05K2201/09381 ,  H05K2203/042 ,  H05K2203/043 ,  H05K2203/0723 ,  H05K3/062 ,  Y02P70/611 ,  Y10T29/49121

摘要： A method for forming a solder-bumped circuit trace on a planar dielectric substrate includes fabricating a trace having an intersection between linear section, depositing onto the trace a uniform thin plate of solder alloy and reflowing the solder alloy to form a bump at the intersection. More particularly, the trace comprises first and second linear sections that intersect at an angle between 45 degrees and 135 degrees and have widths preferably between 50 and 150 microns. The solder plate is deposited, preferably by electroplating, at a thickness between about 10 and 25 microns. Thereafter, when the trace is heated to melt the solder layer, the solder coalesces at the intersection to form the bump.

摘要翻译： 在平面介质基板上形成焊料凸起的电路迹线的方法包括制造在线性部分之间具有交点的迹线，在迹线上沉积均匀的焊料合金薄板并回流焊料合金以在交叉点处形成凸块。 更具体地，迹线包括以45度和135度之间的角度相交并且具有优选地在50和150微米之间的宽度的第一和第二线性部分。 焊料板优选通过电镀沉积在约10至25微米之间的厚度。 此后，当加热痕迹以熔化焊料层时，焊料在相交处聚结形成凸块。

公开(公告)号：US10081069B2

公开(公告)日：2018-09-25

申请号：US14752060

申请日：2015-06-26

申请人： ERSA GmbH

发明人： Stefan Völker ,  Egon Spachmann

IPC分类号： B23K3/06 ,  H05K3/34 ,  B23K1/00 ,  B23K1/08 ,  B23K101/36

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/08 ,  B23K3/0653 ,  B23K2101/36 ,  H05K3/34 ,  H05K2203/042

摘要： A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

公开(公告)号：US20160184914A1

公开(公告)日：2016-06-30

申请号：US14752060

申请日：2015-06-26

申请人： ERSA GmbH

发明人： Stefan Völker ,  Egon Spachmann

IPC分类号： B23K3/06 ,  H05K3/34 ,  B23K1/00

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/08 ,  B23K3/0653 ,  B23K2101/36 ,  H05K3/34 ,  H05K2203/042

摘要： A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

摘要翻译： 用于焊接印刷电路板上的电气或电子部件的装置包括布置在焊料坩埚上方的焊接喷嘴装置。 喷嘴装置包括至少一个载体，在该载体上布置有至少一个焊接喷嘴。 熔融焊料使用输送单元通过焊接喷嘴从焊料坩埚中输送到要焊接的部件。 在已经离开焊接喷嘴的任何多余的焊料中，至少一个放电单元布置在焊接喷嘴的尖端和载体之间。 排放单元包括基本上围绕焊接喷嘴的至少一个挡板。

公开(公告)号：US20090321120A1

公开(公告)日：2009-12-31

申请号：US12495507

申请日：2009-06-30

申请人： Syuji HIRAMOTO ,  Norihiro ISHII

发明人： Syuji HIRAMOTO ,  Norihiro ISHII

IPC分类号： H05K1/18

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10175 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H05K1/0268 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/042 ,  H05K2203/0545 ,  Y02P70/611 ,  H01L2224/05599

摘要： A printed circuit board according to the present invention includes a printed wiring board, first electrodes, second electrodes, third electrodes, solders, and a flip chip. The printed wiring board includes a first surface and a second surface which is opposite the first surface. The first electrodes are respectively formed on the first surface. The second electrodes correspond to and are disposed near each of the first electrodes, and are respectively formed on the first surface. The third electrodes electrically respectively connect the first electrodes and the second electrodes corresponding to each of the first electrodes. The solders are applied so as to respectively cover the first electrodes, the second electrodes corresponding to the first electrodes, and the third electrodes connecting the first electrodes and the second electrodes. The flip chip is electrically connected to each of the first electrodes at a position opposed to the first electrodes.

摘要翻译： 根据本发明的印刷电路板包括印刷线路板，第一电极，第二电极，第三电极，焊料和倒装芯片。 印刷电路板包括与第一表面相对的第一表面和第二表面。 第一电极分别形成在第一表面上。 第二电极对应于并设置在每个第一电极附近，分别形成在第一表面上。 第三电极分别电连接与第一电极对应的第一电极和第二电极。 施加焊料以分别覆盖第一电极，对应于第一电极的第二电极以及连接第一电极和第二电极的第三电极。 倒装芯片在与第一电极相对的位置处电连接到每个第一电极。

公开(公告)号：US5315484A

公开(公告)日：1994-05-24

申请号：US972922

申请日：1992-11-06

申请人： Seiji Asano

发明人： Seiji Asano

IPC分类号： H01H1/58 ,  H01H3/16 ,  H01H11/00 ,  H05K1/11 ,  H05K3/34 ,  H05K1/16

CPC分类号： H05K3/3421 ,  H01H1/5805 ,  H05K1/111 ,  H01H11/00 ,  H01H3/16 ,  H05K2201/09663 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2201/10818 ,  H05K2203/042 ,  H05K2203/044 ,  H05K2203/048 ,  H05K3/3452 ,  H05K3/3468 ,  Y02P70/611 ,  Y02P70/613

摘要： A printed circuit board is provided with two soldering land portions on respective lead lines. Each of the soldering land portions has two sub-soldering land portions and a narrow connecting portion for connecting the sub-soldering portions, so that the land portions are substantially H-shaped. When the printed circuit board is dip soldered after being coated with a solder-proof layer exposing the soldering land portions, solder sticks to the soldering land portions in such a way that it is thicker on the sub-soldering land portions but thinner on the narrow connecting portions. Thereafter, the synchro contacts of a camera flash unit are positioned on the respective narrow connecting portions and soldered to the lead lines by a soldering iron or hot air.

摘要翻译： 印刷电路板在各自的引线上设置有两个焊接区域。 每个焊接部分具有两个子焊接台面部分和用于连接副焊接部分的窄连接部分，使得焊盘部分大致为H形。 当印刷电路板在涂覆有暴露焊接部分的防焊层之后进行浸焊时，焊料粘附到焊接焊盘部分，使得它们在次焊接焊盘部分上较厚，而在窄焊盘 连接部分。 此后，相机闪光灯单元的同步触点位于相应的窄连接部分上，并通过烙铁或热空气焊接到引线。

公开(公告)号：US5261989A

公开(公告)日：1993-11-16

申请号：US823873

申请日：1992-01-22

申请人： Kenneth M. Ueltzen

发明人： Kenneth M. Ueltzen

IPC分类号： H01R43/02 ,  H01R43/20 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  B32B31/00

CPC分类号： H01R43/205 ,  H01R43/0256 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09481 ,  H05K2201/10189 ,  H05K2203/042 ,  H05K2203/0455 ,  H05K3/42 ,  Y10T156/1056 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49183

摘要： A method and apparatus for bonding electrical conducting means having a body, a first lead, and a second lead to a printed circuit board having a first side and a second side. A first surface mount pad is formed on the first side of the printed circuit board. A reservoir pad is formed on the first side of the printed circuit board. A second surface mount pad is formed on the second side of the printed circuit board. A via hole is formed in the printed circuit board. The via hole runs from the first side to the second side of the printed circuit board. The via hole abuts the reservoir pad and the second surface mount pad. Bonding means is deposited onto the first surface mount pad and the reservoir pad and into the via hole but not onto the second surface mount pad. The first lead of the electrical conducting means is placed against the bonding means deposited on the first surface mount pad and the second lead of the electrical conducting means is placed below the second surface mount pad. The bonding means is heated. The bonding means is cooled.

摘要翻译： 一种用于将具有本体，第一引线和第二引线的导电装置接合到具有第一侧和第二侧的印刷电路板的方法和装置。 第一表面安装焊盘形成在印刷电路板的第一侧上。 在印刷电路板的第一侧上形成储存器垫。 第二表面安装焊盘形成在印刷电路板的第二侧上。 在印刷电路板上形成通孔。 通孔从印刷电路板的第一侧延伸至第二侧。 通孔邻接储存器垫和第二表面安装垫。 接合装置沉积在第一表面安装垫和储存器垫上并进入通孔中，但不沉积到第二表面安装垫上。 导电装置的第一引线抵靠沉积在第一表面安装焊盘上的接合装置放置，并且导电装置的第二引线被放置在第二表面安装焊盘的下方。 接合装置被加热。 粘合装置被冷却。

公开(公告)号：US20120295454A1

公开(公告)日：2012-11-22

申请号：US13564483

申请日：2012-08-01

申请人： Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

发明人： Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

IPC分类号： H01R12/51

CPC分类号： H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

摘要： A printed circuit board assembly (PCBA) chip package component includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad.

摘要翻译： 印刷电路板组件（PCBA）芯片封装组件包括：模块板和接口板。 第一个焊盘设置在模块板的底部，第二个焊盘设置在接口板的顶部，第二个焊盘为城堡式结构。 第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。 第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。

公开(公告)号：US06392163B1

公开(公告)日：2002-05-21

申请号：US09790421

申请日：2001-02-22

申请人： Glenn A. Rinne ,  Paul A. Magill

发明人： Glenn A. Rinne ,  Paul A. Magill

IPC分类号： H01R1204

CPC分类号： H01L24/16 ,  C08F8/44 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/06051 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/042 ,  Y02P70/613 ,  C08F20/54 ,  H01L2924/00012

摘要： A controlled-shaped solder reservoir provides additional solder to a bump in the step for increasing the volume of solder forming the solder bump. The controlled shaped reservoirs can be shaped and sized to provide predetermined amounts of solder to the solder bump. Thus, the height of the resulting solder bump can be predetermined. The solder reservoirs can be shaped to take a minimum amount of space, such as by at least partially wrapping around the solder bump. Consequently, the solder bumps may have increased height without adding to the space requirements of the solder bump, or without increasing the fabrication cost. In addition, due to the finite time required for solder flow, a means of sequencing events during soldering is provided.

摘要翻译： 受控形状的焊料储存器在步骤中向凸块提供额外的焊料，以增加形成焊料凸块的焊料的体积。 受控形状的储存器可以被成形和定尺寸以向焊料凸块提供预定量的焊料。 因此，可以预先确定所得到的焊料凸块的高度。 焊料储存器可以被成形为采取最小量的空间，例如通过至少部分地围绕焊料凸块缠绕。 因此，焊料凸块可以具有增加的高度，而不增加焊料凸块的空间要求，或者不增加制造成本。 另外，由于焊料流动所需的时间有限，所以提供了在焊接过程中排序事件的方法。

公开(公告)号：US5838070A

公开(公告)日：1998-11-17

申请号：US770406

申请日：1996-12-20

申请人： Toshimichi Naruse ,  Noriaki Sakamoto

发明人： Toshimichi Naruse ,  Noriaki Sakamoto

IPC分类号： H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52

CPC分类号： H05K1/111 ,  H05K3/3442 ,  H01L2924/0002 ,  H05K1/11 ,  H05K2201/09427 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2203/042 ,  H05K3/3431 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit apparatus has first and second pad electrodes arranged on a substrate to be separated by a first interval, first and second chip electrodes to be separated by a second interval smaller than the first interval, a first solder for fixedly attaching the first chip electrode to the first pad electrode and a second solder for fixedly attaching the second chip electrode to the second pad electrode. Because the first interval is longer than the second interval, any constricted portion does not exist in each of the first and second solders. Therefore, because any stress is not concentrated on any portion of each of the first and second solders, the occurrence of a crack in each of the first and second solders can be prevented.

摘要翻译： 电子电路装置具有布置在基板上的第一和第二焊盘电极，以第一间隔分开，第一和第二芯片电极以比第一间隔小的第二间隔隔开;第一焊料，用于固定地附接第一芯片电极 到第一焊盘电极和用于将第二芯片电极固定地附接到第二焊盘电极的第二焊料。 因为第一间隔长于第二间隔，所以第一和第二焊料的每一个中都不存在任何收缩部分。 因此，由于任何应力都不集中在第一和第二焊料的每一个的任何部分上，所以可以防止在第一和第二焊料中的每一个中出现裂纹。