公开(公告)号：US11903139B2

公开(公告)日：2024-02-13

申请号：US17181756

申请日：2021-02-22

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

IPC: H05K3/10 ,  H05K1/02 ,  G03F7/00 ,  H05K3/28 ,  H05K1/16

CPC classification number: H05K3/107 ,  G03F7/0002 ,  H05K1/0283 ,  B81C2201/0156 ,  B81C2201/0159 ,  H05K1/162 ,  H05K3/281 ,  H05K2201/0162 ,  H05K2201/10015 ,  H05K2203/0108 ,  H05K2203/0156

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

公开(公告)号：US20160234931A1

公开(公告)日：2016-08-11

申请号：US15019786

申请日：2016-02-09

Applicant: CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation

Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/18 ,  B22D25/02 ,  B22D23/00

CPC classification number: H05K3/107 ,  H05K1/0283 ,  H05K1/162 ,  H05K3/281 ,  H05K2201/0162 ,  H05K2201/10015 ,  H05K2203/0108 ,  H05K2203/0156

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract translation: 本公开描述了具有微米尺度特征的软质电子器件以及制造电子器件的方法。 在一些实施例中，该装置包括具有微通道的弹性体模具，其填充有共晶合金以产生导电元件。 微通道用聚合物密封以防止合金逸出微通道。 在一些实施例中，使用微转印技术将合金拉入微通道。 另外，可以使用软光刻或其他制造技术来制造模具。 本文描述的方法允许创建微米级电路特征，其线宽和间距比先前证明的小一个数量级。

公开(公告)号：US10945339B2

公开(公告)日：2021-03-09

申请号：US15019786

申请日：2016-02-09

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

IPC: H05K3/10 ,  H05K1/02 ,  G03F7/00 ,  H05K3/28 ,  H05K1/16

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

公开(公告)号：US20210204410A1

公开(公告)日：2021-07-01

申请号：US17181756

申请日：2021-02-22

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

IPC: H05K3/10 ,  H05K1/02 ,  G03F7/00

Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.