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    High-density soft-matter electronics
    1.
    发明授权
    High-density soft-matter electronics 有权

    公开(公告)号：US10945339B2

    公开(公告)日：2021-03-09

    申请号：US15019786

    申请日：2016-02-09

    Applicant: CARNEGIE MELLON UNIVERSITY

    Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

    IPC: H05K3/10 ,  H05K1/02 ,  G03F7/00 ,  H05K3/28 ,  H05K1/16

    Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

    FABRICATION, METHODS, APPARATUSES, AND SYSTEMS FOR ULTRA-COMPLIANT PROBES FOR NEURAL AND OTHER TISSUES
    3.
    发明申请
    FABRICATION, METHODS, APPARATUSES, AND SYSTEMS FOR ULTRA-COMPLIANT PROBES FOR NEURAL AND OTHER TISSUES 有权
    用于神经和其他组织的超声检查的制造，方法，设备和系统

    公开(公告)号：US20130131482A1

    公开(公告)日：2013-05-23

    申请号：US13680794

    申请日：2012-11-19

    Applicant: Carnegie Mellon University, Center for Technology

    Inventor： Gary K. Fedder ,  Burak Ozdoganlar ,  Peter J. Gilgunn

    IPC: A61B5/0478 ,  A61N1/05

    CPC classification number: A61B5/6848 ,  A61B5/0478 ,  A61B5/685 ,  A61B2562/028 ,  A61B2562/046 ,  A61B2562/125 ,  A61B2562/222 ,  A61N1/0534 ,  B29C35/02 ,  B29C35/0805 ,  B29C41/04 ,  B29C41/20 ,  B29C41/42 ,  B29C2035/0827 ,  B29K2001/08 ,  B29K2907/00 ,  B29K2995/006 ,  B29L2031/753 ,  G03F7/0035 ,  Y10T29/49826

    Abstract: Methods, systems and apparatuses of ultra-miniature, ultra-compliant probe arrays that allows for design flexibility to match the stiffness of the tissue it is being applied to, such as the brain tissue, in all three axes (x, y and z), with interconnect cross section smaller than cell dimensions. Stiffness matching requires specific geometric and fabrication approaches, commonly leading to ultra-thin probe wires. Sizing of the electrodes for specific cell dimensions reduces glial formation. Further reduction in stiffness is obtained by incorporating different geometric features to the electrode, such as meandering the electrode wires. The small thickness and geometric features of the wires commonly result in very high compliance. To enable effective insertion of the probes to the tissue, the present invention uses stiff biodisolvable and/or biodegradable polymers, including single use or combinations of carboxymethyl cellulose, polyvinylpyrrolidone, polyvinyl alcohol, maltose, other sugar molecules, polylactic acid and its co-polymers.

    Abstract translation: 超微型，超兼容的探针阵列的方法，系统和装置，允许设计灵活性将其正在应用的组织的刚度（例如脑组织）在所有三个轴（x，y和z） ，互连横截面小于单元尺寸。 刚度匹配需要特定的几何和制造方法，通常导致超薄探针线。 用于特定细胞尺寸的电极的尺寸减小了胶质细胞的形成。 通过将不同的几何特征结合到电极，例如蜿蜒的电极线，可以获得进一步的硬度的降低。 电线的小厚度和几何特征通常导致非常高的柔顺性。 为了有效地将探针插入组织，本发明使用僵硬的可生物降解和/或可生物降解的聚合物，包括单次使用或羧甲基纤维素，聚乙烯吡咯烷酮，聚乙烯醇，麦芽糖，其他糖分子，聚乳酸及其共聚物的组合 。

    High-Density Soft-Matter Electronics
    5.
    发明申请
    High-Density Soft-Matter Electronics 审中-公开
    高密度软质电子学

    公开(公告)号：US20160234931A1

    公开(公告)日：2016-08-11

    申请号：US15019786

    申请日：2016-02-09

    Applicant: CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation

    Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

    IPC: H05K1/02 ,  H05K3/10 ,  H05K1/18 ,  B22D25/02 ,  B22D23/00

    CPC classification number: H05K3/107 ,  H05K1/0283 ,  H05K1/162 ,  H05K3/281 ,  H05K2201/0162 ,  H05K2201/10015 ,  H05K2203/0108 ,  H05K2203/0156

    Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

    Abstract translation: 本公开描述了具有微米尺度特征的软质电子器件以及制造电子器件的方法。 在一些实施例中，该装置包括具有微通道的弹性体模具，其填充有共晶合金以产生导电元件。 微通道用聚合物密封以防止合金逸出微通道。 在一些实施例中，使用微转印技术将合金拉入微通道。 另外，可以使用软光刻或其他制造技术来制造模具。 本文描述的方法允许创建微米级电路特征，其线宽和间距比先前证明的小一个数量级。

    High-Density Soft-Matter Electronics
    6.
    发明申请
    High-Density Soft-Matter Electronics 有权

    公开(公告)号：US20210204410A1

    公开(公告)日：2021-07-01

    申请号：US17181756

    申请日：2021-02-22

    Applicant: CARNEGIE MELLON UNIVERSITY

    Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

    IPC: H05K3/10 ,  H05K1/02 ,  G03F7/00

    Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

    Fabrication, methods, apparatuses, and systems for ultra-compliant probes for neural and other tissues
    9.
    发明授权
    Fabrication, methods, apparatuses, and systems for ultra-compliant probes for neural and other tissues 有权
    用于神经和其他组织的超柔性探针的制造，方法，装置和系统

    公开(公告)号：US09241651B2

    公开(公告)日：2016-01-26

    申请号：US13680794

    申请日：2012-11-19

    Applicant: Carnegie Mellon University, Center for Technology Transfer and Enterpirse Creation

    Inventor： Gary K. Fedder ,  Burak Ozdoganlar ,  Peter J. Gilgunn

    IPC: A61B5/0478 ,  A61N1/05 ,  A61B5/00

    CPC classification number: A61B5/6848 ,  A61B5/0478 ,  A61B5/685 ,  A61B2562/028 ,  A61B2562/046 ,  A61B2562/125 ,  A61B2562/222 ,  A61N1/0534 ,  B29C35/02 ,  B29C35/0805 ,  B29C41/04 ,  B29C41/20 ,  B29C41/42 ,  B29C2035/0827 ,  B29K2001/08 ,  B29K2907/00 ,  B29K2995/006 ,  B29L2031/753 ,  G03F7/0035 ,  Y10T29/49826

    Abstract: Methods, systems and apparatuses of ultra-miniature, ultra-compliant probe arrays that allows for design flexibility to match the stiffness of the tissue it is being applied to, such as the brain tissue, in all three axes (x, y and z), with interconnect cross section smaller than cell dimensions. Stiffness matching requires specific geometric and fabrication approaches, commonly leading to ultra-thin probe wires. Sizing of the electrodes for specific cell dimensions reduces glial formation. Further reduction in stiffness is obtained by incorporating different geometric features to the electrode, such as meandering the electrode wires. The small thickness and geometric features of the wires commonly result in very high compliance. To enable effective insertion of the probes to the tissue, the present invention uses stiff biodisolvable and/or biodegradable polymers, including single use or combinations of carboxymethyl cellulose, polyvinylpyrrolidone, polyvinyl alcohol, maltose, other sugar molecules, polylactic acid and its co-polymers.

    Abstract translation: 超微型，超兼容的探针阵列的方法，系统和装置，允许设计灵活性将其正在应用的组织的刚度（例如脑组织）在所有三个轴（x，y和z） ，互连横截面小于单元尺寸。 刚度匹配需要特定的几何和制造方法，通常导致超薄探针线。 用于特定细胞尺寸的电极的尺寸减小了胶质细胞的形成。 通过将不同的几何特征结合到电极，例如蜿蜒的电极线，可以获得进一步的硬度的降低。 电线的小厚度和几何特征通常导致非常高的柔顺性。 为了有效地将探针插入组织，本发明使用僵硬的可生物降解和/或可生物降解的聚合物，包括单次使用或羧甲基纤维素，聚乙烯吡咯烷酮，聚乙烯醇，麦芽糖，其他糖分子，聚乳酸及其共聚物的组合 。

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