摘要:
Method for producing a microelectronic device comprising:a) the formation on an insulating layer of a semi-conductor on insulator type substrate, a first semi-conductor block covered with a first strain zone adapted to induce a compressive strain in said first block and a second semi-conductor block covered with a second strain zone adapted to induce a tensile strain in said second block, the first block and the second block each being formed of a lower region based on amorphous semi-conductor material, covered with an upper region of crystalline semi-conductor material in contact with one of said strain zones,b) the re-crystallization of said lower region of said first block and of said second block while using said upper region of crystalline material as starting zone for a recrystallization front.
摘要:
Method for modifying the strain state of a block of a semiconducting material comprising steps for: making a lower region of a block of semiconducting material resting on a substrate amorphous, while the crystalline structure of an upper region of the block in contact with the lower region is maintained, making a creep annealing with a sufficient thermal budget to enable creep of the lower region without recrystallizing the material of this lower region, making a recrystallization annealing of the lower region.