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公开(公告)号：US20240097721A1
公开(公告)日：2024-03-21
申请号：US18470481
申请日：2023-09-20
摘要： An integration system and method for the manufacture of radio frequency transmission front-end modules with radio frequency integrated circuit(s) and self-biased magnetic component(s) integrated on a “Wafer Level Packaging”-type technology. This integration makes it possible to design efficient, compact and low-cost front-end modules.
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公开(公告)号：US20240128227A1
公开(公告)日：2024-04-18
申请号：US18486467
申请日：2023-10-13
发明人： Perceval COUDRAIN , Arnaud GARNIER , Jeanne PIGNOL
IPC分类号： H01L23/00 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/427 , H01L23/552
CPC分类号： H01L24/32 , H01L21/561 , H01L23/3128 , H01L23/367 , H01L23/427 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/83 , H01L24/96 , H01L21/568 , H01L2224/19 , H01L2224/211 , H01L2224/27845 , H01L2224/29082 , H01L2224/29144 , H01L2224/29147 , H01L2224/29166 , H01L2224/32225 , H01L2224/32245 , H01L2224/83005 , H01L2224/83193 , H01L2224/83201 , H01L2224/83895 , H01L2224/83948 , H01L2224/95001 , H01L2224/96 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109
摘要： A SiP-type electronic device, including an electronic chip provided with an electrical interconnection face; a redistribution layer electrically coupled to the electrical interconnection face of the chip; electrical connection elements electrically coupled to the chip by the redistribution layer which is arranged between the chip and the connection elements; a first metal layer arranged on the side of a second face of the chip and secured to this second face; an encapsulation material arranged around the chip, between the redistribution layer and the first metal layer; a second metal layer including a first face secured by direct bonding to the first metal layer; a substrate arranged against a second face of the second metal layer.
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