公开(公告)号：US20230402337A1

公开(公告)日：2023-12-14

申请号：US18035343

申请日：2021-11-09

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Daniel Wayne Levesque, Jr. ,  Aize Li ,  Heather Nicole Vanselous

IPC: H01L23/15 ,  H01L23/13 ,  H01L21/48 ,  B32B17/06 ,  B32B3/26 ,  C03C15/00

CPC classification number: H01L23/15 ,  H01L23/13 ,  H01L21/481 ,  B32B17/06 ,  B32B3/266 ,  C03C15/00 ,  B32B2250/40

Abstract: In some embodiments, a method comprises forming a pilot hole or damage track through a laminate glass structure using a laser. The laminate glass structure comprising a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed from a second glass composition different from the first glass composition. After forming the pilot hole, the laminate glass structure is exposed to etching conditions that etch the first glass composition at a first etching rate and the second glass composition at a second etching rate, wherein the first etch rate is different from the second etch rate, to form an etched hole.

公开(公告)号：US10077206B2

公开(公告)日：2018-09-18

申请号：US15177431

申请日：2016-06-09

Applicant: CORNING INCORPORATED

Inventor： Thomas Michael Castle ,  Tian Huang ,  Yuhui Jin ,  Daniel Wayne Levesque, Jr. ,  Tammy Lynn Petriwsky

IPC: C03C23/00 ,  C03C15/00 ,  B23K26/382 ,  B23K26/40 ,  B23K26/0622 ,  B23K26/384 ,  B23K103/00 ,  C03C4/00 ,  B23K101/40 ,  H01L21/48 ,  H01L23/15

CPC classification number: C03C15/00 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/54 ,  C03C4/0071 ,  C03C23/0025 ,  H01L21/4807 ,  H01L23/15 ,  Y10T428/24182 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24777

Abstract: A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 μm/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 μm.

公开(公告)号：US10424606B1

公开(公告)日：2019-09-24

申请号：US15972628

申请日：2018-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Daniel Wayne Levesque, Jr. ,  Robert George Manley ,  Garrett Andrew Piech ,  Rajesh Vaddi ,  Heather Nicole Vanselous

IPC: H01L27/12 ,  H01L27/15

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

公开(公告)号：US10134657B2

公开(公告)日：2018-11-20

申请号：US15630363

申请日：2017-06-22

Applicant: CORNING INCORPORATED

Inventor： Daniel Wayne Levesque, Jr. ,  Garrett Andrew Piech ,  Aric Bruce Shorey

IPC: H01L29/40 ,  H01L23/48 ,  H01L21/762 ,  H01L21/311 ,  H01L21/768 ,  H01L21/306 ,  H01L21/268 ,  H01L21/683 ,  B81B7/00 ,  B81C1/00

Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.

公开(公告)号：US11608291B2

公开(公告)日：2023-03-21

申请号：US16347323

申请日：2017-10-31

Applicant: CORNING INCORPORATED

Inventor： Andres Covarrubias Jaramillo ,  Daniel Wayne Levesque, Jr. ,  Johannes Moll ,  Michael S Pambianchi ,  Prashanth Abraham Vanniamparambil

IPC: C03C23/00 ,  C03B33/02 ,  C03C15/00 ,  G10K11/162 ,  E04B1/84

Abstract: The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.

公开(公告)号：US10756003B2

公开(公告)日：2020-08-25

申请号：US16179048

申请日：2018-11-02

Applicant: CORNING INCORPORATED

Inventor： Daniel Wayne Levesque, Jr. ,  Garrett Andrew Piech ,  Aric Bruce Shorey

IPC: H01L23/48 ,  H01L21/311 ,  H01L23/498 ,  H01L21/48 ,  H01L23/15 ,  B81B7/00 ,  B81C1/00 ,  H01L21/268 ,  H01L21/306 ,  H01L21/683 ,  H01L21/762 ,  H01L21/768

Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.

公开(公告)号：US20200262742A1

公开(公告)日：2020-08-20

申请号：US16347323

申请日：2017-10-31

Applicant: CORNING INCORPORATED

Inventor： Andres Covarrubias Jaramillo ,  Daniel Wayne Levesque, Jr. ,  Johannes Moll ,  Michael S Pambianchi ,  Prashanth Abraham Vanniamparambil

IPC: C03C15/00 ,  C03B33/02 ,  C03C23/00

Abstract: The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.

公开(公告)号：US10366904B2

公开(公告)日：2019-07-30

申请号：US15696736

申请日：2017-09-06

Applicant: CORNING INCORPORATED

Inventor： Andres Covarrubias Jaramillo ,  Yuhui Jin ,  Frank Andrew Kramer, IV ,  Ekaterina Aleksandrovna Kuksenkova ,  Daniel Wayne Levesque, Jr. ,  Garrett Andrew Piech ,  Aric Bruce Shorey ,  Robert Stephen Wagner

IPC: H01L21/48 ,  C03C15/00 ,  C03C23/00 ,  H01L23/498 ,  H01L23/538

Abstract: Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.