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公开(公告)号：US20190248123A1
公开(公告)日：2019-08-15
申请号：US16391719
申请日：2019-04-23
CPC分类号： B32B37/06 , B23K26/21 , B23K26/244 , B23K26/324 , B23K2103/54 , B32B7/04 , B32B37/14 , B32B2310/0843 , B32B2315/08 , C03B23/20 , C03B23/203 , C03B23/207 , C03B23/22 , C03C23/0025 , C03C27/06
摘要： Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.
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2.发明授权公开(公告)号：US10564354B2
公开(公告)日：2020-02-18
申请号：US15846312
申请日：2017-12-19
发明人： Davide Domenico Fortusini , Scott Christopher Pollard , Alexander Mikhailovich Streltsov , James Scott Sutherland
摘要： The optical-electrical interconnection device comprises a glass support member with front-end and back-end portions that define a plane and an aperture. A cantilever member extends from the back-end portion into the aperture. The cantilever member supports an interconnection optical waveguide. The cantilever member comprises a bend region that causes a front-end section of the cantilever member to extend out of the plane. The front-end section is flexible, which allows for the interconnection optical waveguide to be aligned and optically coupled to a device waveguide of an optical-electrical device. A photonic assembly is formed using the optical-electrical interconnection device and at least one optical-electrical device. Methods of forming optical and electrical interconnections using the optical-electrical interconnection device are also disclosed.
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3.发明申请公开(公告)号：US20180172905A1
公开(公告)日：2018-06-21
申请号：US15846312
申请日：2017-12-19
发明人： Davide Domenico Fortusini , Scott Christopher Pollard , Alexander Mikhailovich Streltsov , James Scott Sutherland
CPC分类号： G02B6/125 , G02B6/1228 , G02B6/13 , G02B6/4206 , G02B6/4214 , G02B6/4225 , G02B6/423 , G02B6/4232
摘要： The optical-electrical interconnection device comprises a glass support member with front-end and back-end portions that define a plane and an aperture. A cantilever member extends from the back-end portion into the aperture. The cantilever member supports an interconnection optical waveguide. The cantilever member comprises a bend region that causes a front-end section of the cantilever member to extend out of the plane. The front-end section is flexible, which allows for the interconnection optical waveguide to be aligned and optically coupled to a device waveguide of an optical-electrical device. A photonic assembly is formed using the optical-electrical interconnection device and at least one optical-electrical device. Methods of forming optical and electrical interconnections using the optical-electrical interconnection device are also disclosed.
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公开(公告)号：US11426989B2
公开(公告)日：2022-08-30
申请号：US16391719
申请日：2019-04-23
IPC分类号： B32B37/06 , B32B37/04 , B32B37/14 , B23K26/21 , B23K26/244 , B23K26/324 , C03B23/20 , C03B23/203 , C03B23/22 , C03B23/207 , C03C27/06 , C03C23/00 , B32B7/04 , B23K103/00
摘要： Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.
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