Method and system for controlling the state of stress in deposited thin films

    公开(公告)号:US12297529B1

    公开(公告)日:2025-05-13

    申请号:US16547118

    申请日:2019-08-21

    Abstract: A method and system for controlling the state of stress in deposited thin films are disclosed. According to the method and system, various process parameters, including: process pressure; substrate temperature; deposition rate; and ion-beam energies (controlled via the ion beam current, voltage, signal frequency and duty cycle) are varied using a step-by-step methodology to arrive at a pre-determined desired state of stress in thin films deposited using PVD. The method may be expressed as a computer algorithm, whereby the step-by-step procedure to obtain a pre-determined stress state, is coded for more efficient development and control of deposition processes. Alternatively, a closed-loop controlled PVD deposition system allows a pre-determined stress state of a thin film to be obtained quickly and efficiency using a feedback loop, algorithm and one or more sensors to monitor the substrate thin film stress and various process tool parameters.

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