公开(公告)号：US11935879B2

公开(公告)日：2024-03-19

申请号：US17342925

申请日：2021-06-09

Applicant: CREE, INC

Inventor： Eng Wah Woo ,  Samantha Cheang ,  Kok Meng Kam ,  Marvin Mabell ,  Haedong Jang ,  Alexander Komposch

IPC: H01L25/16 ,  H01L21/48 ,  H01L23/00 ,  H01L23/047 ,  H01L23/66

CPC classification number: H01L25/165 ,  H01L21/4817 ,  H01L23/047 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6672 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48175 ,  H01L2224/73265 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/1421

Abstract: A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.