公开(公告)号：US11111333B2

公开(公告)日：2021-09-07

申请号：US16169062

申请日：2018-10-24

Applicant: Cytec Industries Inc.

Inventor： Jonathan E. Meegan ,  Marco Aurilia

IPC: C08G59/38 ,  C08G59/50 ,  C08L63/00 ,  C08G59/32 ,  C08G59/26 ,  C08G59/18 ,  B29C70/48 ,  C08L63/04 ,  C08L9/06 ,  C08L51/04 ,  C08G59/22

Abstract: Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.

公开(公告)号：US10682791B2

公开(公告)日：2020-06-16

申请号：US16276800

申请日：2019-02-15

Applicant: Cytec Industries Inc.

Inventor： Jonathan E. Meegan ,  Olivia Denman ,  Marco Aurilia

IPC: B32B27/38 ,  B32B27/26 ,  B32B27/20 ,  B32B27/18 ,  B32B27/04 ,  C08L63/00 ,  B29C35/02 ,  B29C45/00 ,  C08K3/01 ,  C08G59/50 ,  B29C45/14 ,  B29C45/72 ,  C08J5/24 ,  B29C45/02 ,  B29C70/44 ,  B29C70/48 ,  B29K63/00 ,  B29K105/08 ,  B29K105/16 ,  B29K409/06 ,  B29K509/08

Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.

公开(公告)号：US12227628B2

公开(公告)日：2025-02-18

申请号：US17416483

申请日：2019-12-21

Applicant: CYTEC INDUSTRIES INC.

Inventor： Fiorenzo Lenzi ,  Vincent Aerts ,  Marco Aurilia ,  Hazel-Ann Hosein

IPC: C08J5/24 ,  C08G73/10

Abstract: A curable composite laminate having an interlaminar region formed between adjacent layers of reinforcement fibers. The interlaminar region contains soluble polyimide particles that are dissolvable in the one or more thermoset resins at a curing temperature of the curable matrix resin, and insoluble thermoplastic particles that remain as discrete particles in the interlaminar region at the same curing temperature. Such curable composite laminate is capable of high resistance to the propagation of delamination upon curing.

公开(公告)号：US10245764B2

公开(公告)日：2019-04-02

申请号：US14970159

申请日：2015-12-15

Applicant: Cytec Industries Inc.

Inventor： Jonathan E. Meegan ,  Olivia Denman ,  Marco Aurilia

IPC: C08J5/24 ,  B29C35/02 ,  B29C45/02 ,  C08L63/00 ,  B29C45/00 ,  C08K3/01 ,  B29C45/14 ,  B29C45/72 ,  C08G59/50 ,  B32B27/04 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  B29K63/00 ,  B29K105/08 ,  B29K105/16 ,  B29K409/06 ,  B29K509/08 ,  B29C70/44 ,  B29C70/48

Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.