公开(公告)号：US10676647B1

公开(公告)日：2020-06-09

申请号：US16236962

申请日：2018-12-31

Applicant: Cabot Microelectronics Corporation

Inventor： Na Zhang ,  Kevin P. Dockery ,  Zhao Liu ,  Roman A. Ivanov

IPC: G09G1/02 ,  C09G1/02 ,  H01L21/321

Abstract: A chemical mechanical polishing composition includes a water based liquid carrier, cationic abrasive particles dispersed in the liquid carrier, a first amino acid compound having an isoelectric point of less than 7 and a second amino acid compound having an isoelectric point of greater than 7. The pH of the composition is in a range from about 1 to about 5. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.