公开(公告)号：US20140191155A1

公开(公告)日：2014-07-10

申请号：US14209110

申请日：2014-03-13

Applicant: Cabot Microelectronics Corporation

Inventor： Brian REISS ,  Timothy JOHNS ,  Michael WHITE ,  Lamon JONES ,  John CLARK

IPC: C09G1/02

CPC classification number: C09G1/02 ,  C09K3/1463 ,  H01L21/02024 ,  H01L21/3212

Abstract: The invention provides a polishing composition comprising silica, an aminophosphonic acid, a polysaccharide, a tetraalkylammonium salt, a bicarbonate salt, an azole ring, and water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.

Abstract translation: 本发明提供一种抛光组合物，其包含二氧化硅，氨基膦酸，多糖，四烷基铵盐，碳酸氢盐，唑环和水，其中抛光组合物的pH为约7至约11.本发明还提供了一种 用抛光组合物研磨衬底的方法。