Integrated circuit processing system
    1.
    发明授权
    Integrated circuit processing system 失效
    集成电路处理系统

    公开(公告)号:US4966519A

    公开(公告)日:1990-10-30

    申请号:US114812

    申请日:1987-10-29

    摘要: A vacuum-tight wafer carrier, and a load lock suitable for use with this wafer carrier. The wafers are supported at each side by a slightly sloping shelf, so that minimal contact (line contact) is made between the wafer surface and the surface of the shelf. This reduces generation of particulates by abrasion of the surface of the wafer. The carrier also contains elastic elements to restrain the wafers from rattling around, which further reduces the internal generation of particulates. When the wafer carrier is placed into the load lock, its body is lowered from beneath its cover through an aperture into a lower chamber, where wafers are loaded and unloaded under vacuum; the carrier cover remains covering the aperture into the lower chamber, so that the wafers never see any surface which is directly exposed to atmosphere. A wafer transport arm mechanism permits interchange of wafers among one or more processing stations and one or more load locks of this type.

    摘要翻译: 真空密封晶片载体和适合与该晶片载体一起使用的负载锁。 晶片在每一侧由稍微倾斜的搁架支撑,从而在晶片表面和搁板表面之间进行最小的接触(线接触)。 这通过晶片表面的磨损来减少颗粒的产生。 载体还包含弹性元件以限制晶片的晃动,这进一步减少了微粒的内部产生。 当晶片载体被放置在负载锁中时,其主体通过一个孔从其下方的下部腔室下降到下部腔室,其中晶片在真空下被装载和卸载; 载体盖保持覆盖孔进入下室,使得晶片从未看到直接暴露于大气的任何表面。 晶片传送臂机构允许在一个或多个处理站和一个或多个这种类型的装载锁之间交换晶片。

    Integrated circuit processing system
    2.
    发明授权
    Integrated circuit processing system 失效
    集成电路处理系统

    公开(公告)号:US5044871A

    公开(公告)日:1991-09-03

    申请号:US143918

    申请日:1988-01-13

    摘要: A vacuum-tight wafer carrier, and a load lock suitable for use with this wafer carrier. The wafers are supported at each side by a slightly sloping shelf, so that minimal contact (line contact) is made between the wafer surface and the surface of the shelf. This reduces generation of particulates by abrasion of the surface of the wafer. The carrier also contains elastic elements to restrain the wafers from rattling around, which further reduces the internal generation of particulates. When the wafer carrier is placed into the load lock, its body is lowered from beneath its cover through an aperture into a lower chamber, where wafers are loaded and unloaded under vacuum; the carrier cover remains covering the aperture into the lower chamber, so that the wafers never see any surface which is directly exposed to atmosphere. A wafer transport arm mechanism permits interchange of wafers among one or more processing stations and one or more load locks of this type.

    摘要翻译: 真空密封晶片载体和适合与该晶片载体一起使用的负载锁。 晶片在每一侧由稍微倾斜的搁架支撑,从而在晶片表面和搁板表面之间进行最小的接触(线接触)。 这通过晶片表面的磨损来减少颗粒的产生。 载体还包含弹性元件以限制晶片的晃动,这进一步减少了微粒的内部产生。 当晶片载体被放置在负载锁中时,其主体通过一个孔从其下方的下部腔室下降到下部腔室,其中晶片在真空下被装载和卸载; 载体盖保持覆盖孔进入下室,使得晶片从未看到直接暴露于大气的任何表面。 晶片传送臂机构允许在一个或多个处理站和一个或多个这种类型的装载锁之间交换晶片。

    Multi-zone illuminator with embedded process control sensors
    4.
    发明授权
    Multi-zone illuminator with embedded process control sensors 失效
    带嵌入式过程控制传感器的多区域照明器

    公开(公告)号:US5367606A

    公开(公告)日:1994-11-22

    申请号:US56599

    申请日:1993-08-10

    CPC分类号: H01L21/67115

    摘要: A multi-zone illuminator for processing semiconductor wafers is described which comprises a plurality of source lamps and dummy lamps embedded in the reflector side of a lamp housing. The source lamps are arranged in a plurality of concentric circular zones. The illuminator also comprises plurality of light pipes for receiving multi-point temperature sensors to measure the semiconductor wafer temperature and its distribution uniformity. A gold-plated reflector plate is attached to the bottom side of the lamp housing for reflecting and directing optical energy toward the wafer surface. The distance between the reflector plate and the wafer and the lamps and the wafer may be adjusted with the use of a spacial elevator and adaptor assembly. The multi-zone illuminator allows uniform wafer heating during both transient and steady-state wafer heating cycles.

    摘要翻译: 描述了用于处理半导体晶片的多区域照明器,其包括嵌入在灯壳体的反射器侧中的多个源灯和虚拟灯。 源灯布置成多个同心圆形区域。 照明器还包括用于接收多点温度传感器以测量半导体晶片温度及其分布均匀性的多个光管。 一个镀金的反光板安装在灯壳的底部,用于将光能反射并引导到晶片表面。 可以使用空间电梯和适配器组件来调节反射板与晶片与灯和晶片之间的距离。 多区域照明器允许在瞬态和稳态晶片加热循环期间均匀的晶片加热。

    Multi zone illuminator with embeded process control sensors and light
interference elimination circuit
    5.
    发明授权
    Multi zone illuminator with embeded process control sensors and light interference elimination circuit 失效
    具有嵌入式过程控制传感器和光干扰消除电路的多区域照明器

    公开(公告)号:US5268989A

    公开(公告)日:1993-12-07

    申请号:US870446

    申请日:1992-04-16

    CPC分类号: H01L21/67115

    摘要: A multi-zone illuminator for processing semiconductor wafers comprises a plurality of source lamps and dummy lamps embedded in the reflector side of a lamp housing. The source lamps are arranged in a plurality of concentric circular zones. The illuminator also comprises plurality of light pipes for receiving multi-point temperature sensors to measure the semiconductor wafer temperature and its distribution uniformity. A gold-plated reflector plate is attached to the bottom side of the lamp housing for reflecting and directing optical energy toward the wafer surface. The distance between the reflector plate and the wafer and the lamps and the wafer may be adjusted with the use of a spacial elevator and adaptor assembly. The multi-zone illuminator allows uniform wafer heating during both transient and steady-state wafer heating cycles.

    Vacuum slice carrier
    6.
    发明授权
    Vacuum slice carrier 失效
    真空切片载体

    公开(公告)号:US4943457A

    公开(公告)日:1990-07-24

    申请号:US96216

    申请日:1987-09-04

    IPC分类号: H01L21/673

    CPC分类号: H01L21/67369 Y10T428/1334

    摘要: A vacuum-tight wafer carrier. The wafers are supported at each side by a slightly sloping shelf, so that minimal contact (line contact) is made between the wafer surface and the surface of the shelf. This reduces generation of particulates by abrasion of the surface of the wafer. The door of the vacuum carrier contains elastic elements to press the wafers lightly against the back of the carrier box. Thus, when the door of the box is closed, the wafers are restrained from rattling around, which further reduces the internal generation of particulates.

    摘要翻译: 真空密封晶片载体。 晶片在每一侧由稍微倾斜的搁架支撑,从而在晶片表面和搁板表面之间进行最小的接触(线接触)。 这通过晶片表面的磨损来减少颗粒的产生。 真空载体的门包含弹性元件,将晶片轻轻按压在载体箱的背面。 因此,当箱子的门关闭时,晶片被抑制在周围,这进一步减少了微粒的内部产生。

    Vacuum processing system
    7.
    发明授权
    Vacuum processing system 失效
    真空加工系统

    公开(公告)号:US4687542A

    公开(公告)日:1987-08-18

    申请号:US790924

    申请日:1985-10-24

    摘要: A system for performing one semiconductor manufacturing operation or sequence of operations with reduced particulate contamination. A vacuum-tight wafer carrier, which contains numerous wafers in vacuum in a sealed box, is placed into a platform inside a vacuum load lock. The platform contains slots and protruding fingers to provide accurate registration of the position of the wafer carrier. After the load lock is pumped down, the door of the wafer carrier is opened, and a transfer arm removes wafers from the wafer carrier, in any desired order, and transfers them one by one through a port into a processing chamber.

    摘要翻译: 一种用于执行一种半导体制造操作或具有减少的颗粒污染的操作序列的系统。 在密封箱中真空中包含许多晶片的真空密封晶片载体被放置在真空装载锁中的平台内。 平台包含槽和突出的指状物,以提供晶片载体的位置的精确对准。 在下载负载锁定之后,打开晶片载体的门,并且传送臂以任何所需的顺序从晶片载体上移除晶片,并通过端口将它们一个接一个地传送到处理室中。

    System and method for service specific notification
    8.
    发明授权
    System and method for service specific notification 有权
    用于服务特定通知的系统和方法

    公开(公告)号:US08516047B2

    公开(公告)日:2013-08-20

    申请号:US11654145

    申请日:2007-01-16

    IPC分类号: G06F15/16 G06Q30/00

    摘要: Apparatus include a communication interface, a trigger interface, computer-readable media encloded subscriber-originated recipient list data, and a user interface. The user interface is configured to display and receive input from, via a computer screen display, plural sets of screen-displayed destination setting selection indicators for individually configuring sets of destination settings for corresponding event types. Each set of destination settings corresponds to a corresponding one of plural selectable event types selectable for causing corresponding triggered messages to be sent including sending the given event-specific message to the corresponding list of recipients. Individual ones of the selectable event types for a given user have corresponding differently configurable sets of destination settings, whereby the given user's selected destination settings for one selected event type cause one event-specific message to be sent to one device of the given user and the given user's selected destination settings for another selected event type cause another event-specific message to be sent to another device of the given user that is different than the one device. Meanwhile, selected ones of the selectable event types for the given user are selected by a user selecting, via the computer screen display, destination selection indicators corresponding to the selected ones of the selectable event types.

    摘要翻译: 装置包括通信接口,触发接口,计算机可读媒体包围的用户发起的接收者列表数据和用户接口。 用户界面被配置为通过计算机屏幕显示来显示和接收输入,用于单独配置针对相应事件类型的目的地设置集合的多组屏幕显示目的地设置选择指示符。 每组目的地设置对应于可选择的用于引起相应的触发消息被发送的多个可选择事件类型中的相应一个,包括将给定的事件特定消息发送到相应的接收者列表。 给定用户的可选事件类型中的各个具有对应的不同可配置的目的地设置集合,由此给定用户对于一个选择的事件类型的所选择的目的地设置使一个事件特定消息被发送给给定用户的一个设备,并且 给定用户选择的另一个选定的事件类型的目的地设置导致另一个事件特定的消息被发送到与一个设备不同的给定用户的另一个设备。 同时,通过用户通过计算机屏幕显示来选择与选择的可选事件类型相对应的目的地选择指示符,为给定用户选择的可选择事件类型选择。

    Self-locating sensor mounting apparatus
    9.
    发明授权
    Self-locating sensor mounting apparatus 有权
    自动定位传感器安装装置

    公开(公告)号:US08103328B2

    公开(公告)日:2012-01-24

    申请号:US12243461

    申请日:2008-10-01

    IPC分类号: A61B5/0478 A61B19/00

    CPC分类号: A61B5/0478 A61B5/0002

    摘要: A self-locating mounting apparatus for holding objects such as sensors at specific positions on a subject's head includes a central mount constituted by a plurality of inextensible elements adapted to fit over the top of a subject's head. In addition, the mounting apparatus includes an adjustable circumferential band adapted to circle the subject's head and connect the central mount to inextensible side elements via sliding joints. A plurality of biasing elements provide a force for biasing sensor mounting units on the mounting apparatus against a subject's head, allowing for long-term sensing while minimizing interference forces on the mounting units. Advantageously, the mounting apparatus holds sensors within approximately 5 mm of their desired measurement positions over a range of subject head sizes.

    摘要翻译: 用于将诸如传感器等物体保持在被检者头部的特定位置的自定位安装装置包括:由多个不可伸展元件构成的中央支座,适合于配合在被检者头部的顶部。 此外,安装设备包括可调节的环形带,其适于使被检者的头部圆形并且通过滑动接头将中央安装件连接到不可伸展的侧部元件。 多个偏置元件提供用于将安装装置上的传感器安装单元偏压抵靠对象的头部的力,允许长期检测,同时最小化安装单元上的干扰力。 有利地,安装装置将传感器保持在其目标头部尺寸范围内的所需测量位置的大约5mm的范围内。

    System for Measuring the Electric Potential of a Voltage Source
    10.
    发明申请
    System for Measuring the Electric Potential of a Voltage Source 审中-公开
    用于测量电压源电位的系统

    公开(公告)号:US20100148789A1

    公开(公告)日:2010-06-17

    申请号:US11992309

    申请日:2005-09-22

    IPC分类号: G01N27/02 G01R19/00

    CPC分类号: G01N33/5438 G01N33/48728

    摘要: A non-invasive measurement system (110) for measuring the electrical potential of a voltage source (20, 120) includes a sensing electrode (50, 151) spaced from the voltage source (20, 120). Preferably the voltage source (20, 120) is within a biological cell (115) located in a nutrient bath (119) including electrolytic medium (117) and an object (30, 190) is a portion of the electrolytic fluid (117) located between the cell (115) and the sensing electrode (50, 151). A feedback electrode (181) is formed in an annular shape and surrounds the sensing electrode (50, 151) thus creating an annular fluid region therebetween. The value of the voltage in the annular region (131) is set substantially equal to the value of the voltage in the object (190) and therefore the impedance between the object (190) and a stray voltage source (40) is maximized.

    摘要翻译: 用于测量电压源(20,120)的电位的非侵入性测量系统(110)包括与电压源(20,120)间隔开的感测电极(50,151)。 优选地,电压源(20,120)在位于包括电解介质(117)的营养浴(119)内的生物细胞(115)内,物体(30,190)是电解液(117)的一部分 在电池(115)和感测电极(50,151)之间。 反馈电极(181)形成为环状并且围绕感测电极(50,151),从而在它们之间产生环形流体区域。 环状区域(131)中的电压值被设定为基本上等于物体(190)中的电压值,因此物体(190)和杂散电压源(40)之间的阻抗最大化。