Lithography masks and methods of manufacture thereof
    1.
    发明申请
    Lithography masks and methods of manufacture thereof 有权
    光刻面具及其制造方法

    公开(公告)号:US20080119048A1

    公开(公告)日:2008-05-22

    申请号:US11602886

    申请日:2006-11-21

    IPC分类号: H01L21/302

    摘要: Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method includes providing a substrate, forming a first pattern in a first region of the substrate, and forming a second pattern in a second region of the substrate, the second pattern comprising patterns for features oriented differently than patterns for features of the first pattern. The method includes affecting a polarization rotation of light differently in the first region than in the second region of the substrate.

    摘要翻译: 公开了平版印刷掩模及其制造方法。 优选实施例包括制造光刻掩模的方法。 所述方法包括提供衬底,在所述衬底的第一区域中形成第一图案,以及在所述衬底的第二区域中形成第二图案,所述第二图案包括不同于第一图案特征的图案的图案。 该方法包括在第一区域中比在衬底的第二区域中影响光的偏振旋转。

    Lithography masks and methods of manufacture thereof
    2.
    发明授权
    Lithography masks and methods of manufacture thereof 有权
    光刻面具及其制造方法

    公开(公告)号:US07799486B2

    公开(公告)日:2010-09-21

    申请号:US11602886

    申请日:2006-11-21

    IPC分类号: G03F1/00

    摘要: Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method includes providing a substrate, forming a first pattern in a first region of the substrate, and forming a second pattern in a second region of the substrate, the second pattern comprising patterns for features oriented differently than patterns for features of the first pattern. The method includes affecting a polarization rotation of light differently in the first region than in the second region of the substrate.

    摘要翻译: 公开了平版印刷掩模及其制造方法。 优选实施例包括制造光刻掩模的方法。 所述方法包括提供衬底,在所述衬底的第一区域中形成第一图案,以及在所述衬底的第二区域中形成第二图案,所述第二图案包括不同于第一图案特征的图案的图案。 该方法包括在第一区域中比在衬底的第二区域中影响光的偏振旋转。

    Lithography Masks and Methods of Manufacture Thereof
    3.
    发明申请
    Lithography Masks and Methods of Manufacture Thereof 有权
    光刻面具及其制造方法

    公开(公告)号:US20100297398A1

    公开(公告)日:2010-11-25

    申请号:US12847641

    申请日:2010-07-30

    摘要: Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method includes providing a substrate, forming a first pattern in a first region of the substrate, and forming a second pattern in a second region of the substrate, the second pattern comprising patterns for features oriented differently than patterns for features of the first pattern. The method includes affecting a polarization rotation of light differently in the first region than in the second region of the substrate.

    摘要翻译: 公开了平版印刷掩模及其制造方法。 优选实施例包括制造光刻掩模的方法。 所述方法包括提供衬底,在所述衬底的第一区域中形成第一图案,以及在所述衬底的第二区域中形成第二图案,所述第二图案包括不同于第一图案特征的图案的图案。 该方法包括在第一区域中比在衬底的第二区域中影响光的偏振旋转。

    Lithography masks and methods of manufacture thereof
    4.
    发明授权
    Lithography masks and methods of manufacture thereof 有权
    光刻面具及其制造方法

    公开(公告)号:US07947431B2

    公开(公告)日:2011-05-24

    申请号:US12847641

    申请日:2010-07-30

    IPC分类号: H01L21/00 G03F1/00 G03B27/42

    摘要: Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method includes providing a substrate, forming a first pattern in a first region of the substrate, and forming a second pattern in a second region of the substrate, the second pattern comprising patterns for features oriented differently than patterns for features of the first pattern. The method includes affecting a polarization rotation of light differently in the first region than in the second region of the substrate.

    摘要翻译: 公开了平版印刷掩模及其制造方法。 优选实施例包括制造光刻掩模的方法。 所述方法包括提供衬底,在所述衬底的第一区域中形成第一图案,以及在所述衬底的第二区域中形成第二图案,所述第二图案包括不同于第一图案特征的图案的图案。 该方法包括在第一区域中比在衬底的第二区域中影响光的偏振旋转。

    Lithography Masks and Methods of Manufacture Thereof
    6.
    发明申请
    Lithography Masks and Methods of Manufacture Thereof 有权
    光刻面具及其制造方法

    公开(公告)号:US20090023078A1

    公开(公告)日:2009-01-22

    申请号:US11781105

    申请日:2007-07-20

    IPC分类号: G03F1/00 G03F7/20

    CPC分类号: G03F1/29 G03F1/26

    摘要: Lithography masks and methods of manufacture thereof are disclosed. For example, a method of manufacturing a lithography mask includes forming a stack over a substrate. The stack includes bottom attenuated phase shift material layers, intermediate opaque material layers, and finally top resist layers. The method further includes patterning the stack and then trimming the resist layers to uncover a portion of the opaque material layers. The uncovered opaque material layers are subsequently etched followed by removal of any remaining resist layers.

    摘要翻译: 公开了平版印刷掩模及其制造方法。 例如,制造光刻掩模的方法包括在衬底上形成叠层。 该堆叠包括底部衰减相移材料层,中间不透明材料层,最后是顶部抗蚀剂层。 该方法还包括图案化叠层,然后修整抗蚀剂层以露出不透明材料层的一部分。 随后蚀刻未覆盖的不透明材料层,随后除去任何剩余的抗蚀剂层。

    Lithography masks and methods of manufacture thereof
    9.
    发明授权
    Lithography masks and methods of manufacture thereof 有权
    光刻面具及其制造方法

    公开(公告)号:US08071261B2

    公开(公告)日:2011-12-06

    申请号:US11781105

    申请日:2007-07-20

    IPC分类号: G03F1/00

    CPC分类号: G03F1/29 G03F1/26

    摘要: Lithography masks and methods of manufacture thereof are disclosed. For example, a method of manufacturing a lithography mask includes forming a stack over a substrate. The stack includes bottom attenuated phase shift material layers, intermediate opaque material layers, and finally top resist layers. The method further includes patterning the stack and then trimming the resist layers to uncover a portion of the opaque material layers. The uncovered opaque material layers are subsequently etched followed by removal of any remaining resist layers.

    摘要翻译: 公开了平版印刷掩模及其制造方法。 例如,制造光刻掩模的方法包括在衬底上形成叠层。 该堆叠包括底部衰减相移材料层,中间不透明材料层,最后是顶部抗蚀剂层。 该方法还包括图案化叠层,然后修整抗蚀剂层以露出不透明材料层的一部分。 随后蚀刻未覆盖的不透明材料层,随后除去任何剩余的抗蚀剂层。

    Mask layout formation
    10.
    发明授权
    Mask layout formation 有权
    面膜布局形成

    公开(公告)号:US08875063B2

    公开(公告)日:2014-10-28

    申请号:US12901595

    申请日:2010-10-11

    IPC分类号: G06F17/50 G03F1/00 G03F1/30

    CPC分类号: G03F1/30 G03F1/0069

    摘要: A method for forming a mask layout is described. A plurality of phase shapes are formed on either side of a critical feature of a design layout of an intergrated circuit chip having a plurality of critical features. A plurality of transition edges are identified from the edges of each phase shape. Each transition edge is parallel to critical feature. A transition space is identified as defined by one of the group including two transition edges and one transition edge. A transition polygon is formed by closing each transition space with at least one closing edge. Each transition polygon is transformed into a printing assist feature. A mask layout is formed from the printing assist features and critical features.

    摘要翻译: 描述了形成掩模布局的方法。 在具有多个关键特征的集成电路芯片的设计布局的关键特征的任一侧上形成多个相位形状。 从每个相位形状的边缘识别多个过渡边缘。 每个过渡边缘与关键特征平行。 识别由包括两个过渡边缘和一个过渡边缘的组之一所定义的过渡空间。 通过用至少一个关闭边缘关闭每个过渡空间来形成过渡多边形。 每个过渡多边形被转换成打印辅助功能。 从打印辅助功能和关键特征形成面罩布局。