公开(公告)号：US08035213B2

公开(公告)日：2011-10-11

申请号：US12285268

申请日：2008-10-01

申请人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

发明人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

IPC分类号： H01L23/12 ,  H01L21/48

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.

摘要翻译： 提供了芯片封装结构及其制造方法。 芯片封装结构包括封装部分和多个外部导体。 封装部分包括分布层，芯片，多个内部导体和密封剂。 分布层具有第一表面和第二表面，并且芯片设置在第一表面上。 每个内部导体具有第一端子和第二端子。 第一端子设置在第一表面上。 密封剂设置在第一表面上用于覆盖芯片并部分地封装内部导体，使得每个内部导体的第一端子和第二端子从密封剂露出。 设置在封装部分的分布层的第二表面上的外部导体电连接到内部导体。

公开(公告)号：US20090102066A1

公开(公告)日：2009-04-23

申请号：US12285268

申请日：2008-10-01

申请人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

发明人： Chang-Chi Lee ,  Shih-Kuang Chen ,  Yuan-Ting Chang

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors.

摘要翻译： 提供了一种芯片封装结构及其制造方法。 芯片封装结构包括封装部分和多个外部导体。 封装部分包括分布层，芯片，多个内部导体和密封剂。 分布层具有第一表面和第二表面，并且芯片设置在第一表面上。 每个内部导体具有第一端子和第二端子。 第一端子设置在第一表面上。 密封剂设置在第一表面上用于覆盖芯片并部分地封装内部导体，使得每个内部导体的第一端子和第二端子从密封剂露出。 设置在封装部分的分布层的第二表面上的外部导体电连接到内部导体。

公开(公告)号：US20090200175A1

公开(公告)日：2009-08-13

申请号：US12068464

申请日：2008-02-07

申请人： Yuan-Ting Chang ,  Ruey-Feng Tai

发明人： Yuan-Ting Chang ,  Ruey-Feng Tai

IPC分类号： C25D11/06

CPC分类号： C25D11/06 ,  C25D11/16 ,  C25D11/24

摘要： A multicolor anodizing treatment for treating the surface of an aluminum workpiece includes the steps of (1) anti-oil procedure where dirty oil is removed from the aluminum workpiece, (2) rinsing where the aluminum workpiece is cleaned with running water in a rinsing trough, (3) chemical polishing where the aluminum workpiece is polished by means of a chemical solution, (4) anodizing where the aluminum workpiece is anodized to produce an oxide surface layer, (5) coloring where the aluminum workpiece is colored with at least one color, (6) drying where the aluminum workpiece is dried, and (7) finishing where the aluminum workpiece is sealed with a layer of sealant.

摘要翻译： 用于处理铝工件表面的多色阳极氧化处理包括以下步骤：（1）从铝工件除去脏油的防油程序，（2）在漂洗槽中用自来水清洁铝工件的冲洗 ，（3）通过化学溶液抛光铝工件的化学抛光，（4）阳极氧化，其中铝工件被阳极氧化以产生氧化物表面层，（5）铝工件着色于至少一个 颜色，（6）干燥铝工件时的干燥，（7）铝合金工件用一层密封剂密封完成。