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27 条记录 (耗时 0.036 秒)

    Antenna apparatus
    1.
    发明申请
    Antenna apparatus 审中-公开
    天线装置

    公开(公告)号：US20070080890A1

    公开(公告)日：2007-04-12

    申请号：US11543808

    申请日：2006-10-06

    申请人： Chang-Fa Yang ,  Shun-Tian Lin ,  Chao-Hung Lai ,  Chao-Wei Wang ,  Yen-Ming Chen ,  Chuan-Lin Hu ,  Yu-Wei Chen ,  Chang-Lun Liao

    发明人： Chang-Fa Yang ,  Shun-Tian Lin ,  Chao-Hung Lai ,  Chao-Wei Wang ,  Yen-Ming Chen ,  Chuan-Lin Hu ,  Yu-Wei Chen ,  Chang-Lun Liao

    IPC分类号： H01Q1/36

    CPC分类号： H01Q1/38 ,  H01Q7/00

    摘要： An antenna apparatus has a substrate, a plurality of meandered conductive strips and a feeding conductive strip disposed on the substrate. The meandered conductive strips have different sizes, and are spaced at intervals and arranged in parallel according to their sizes in order. The feeding conductive strip is electrically connected to the meandered conductive strips. Therefore, a radiating structure having multiple meandered conductive strips can generate electromagnetic mutual coupling, thus obtaining the resonance of multiple and wide-frequency bands.

    摘要翻译： 天线装置具有基板，多个曲折的导电条和设置在基板上的馈电导电条。 蜿蜒的导电带具有不同的尺寸，并且间隔开并且按照它们的尺寸按顺序平行布置。 馈电导电带电连接到蜿蜒的导电条。 因此，具有多个弯曲的导电条的辐射结构可以产生电磁互耦，从而获得多个频带的共振。

    Micro chip antenna
    8.
    发明申请
    Micro chip antenna 失效
    微芯片天线

    公开(公告)号：US20060158377A1

    公开(公告)日：2006-07-20

    申请号：US11036015

    申请日：2005-01-18

    申请人： Chuan-Ling Hu ,  Meng-Chiu Pan ,  Shun-Tian Lin ,  Chang-Fa Yang ,  Kuo-Chung Cheng ,  Sea-Fue Wang ,  Lisen Chang ,  Chang-Lun Liao ,  Chia-Hung Chen

    发明人： Chuan-Ling Hu ,  Meng-Chiu Pan ,  Shun-Tian Lin ,  Chang-Fa Yang ,  Kuo-Chung Cheng ,  Sea-Fue Wang ,  Lisen Chang ,  Chang-Lun Liao ,  Chia-Hung Chen

    IPC分类号： H01Q1/38

    CPC分类号： H01Q1/38 ,  H01Q1/22 ,  H01Q1/2283

    摘要： A method for manufacturing microchip antenna comprises a dielectric substrate having antennal radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths; a dielectric substrate having the antennal radiated conductor paths being packaged by the material capable of adjusting easily dielectric constant; and an antennal object including antennal radiated conductor paths, feeding ends, welding spots and packaging materials. The main body of the antenna has multi-folded paths, feeding ends, welding spots, and a packaging body. The radiation wires of the antenna is built on a single or a multiple input ends on a dielectric substrate and is multi-folded wires and it is packaged by another dielectric material. The radiation wires of the antenna can be designed and manufactured in three dimension so as to reduce the area occupied by the antenna and reduce the coupling interference between the elements.

    摘要翻译： 一种微芯片天线的制造方法，其特征在于，包括：具有由单个进给端或多个进给端构成的天线辐射导体路径和多个弯曲路径的电介质基板; 具有天线辐射导体路径的电介质基板被能够容易调节介电常数的材料封装; 以及包括天线辐射导体路径，馈电端，焊点和包装材料的触角物体。 天线的主体具有多折叠路径，馈电端，焊点和封装体。 天线的辐射线建立在电介质基板上的单个或多个输入端上，并且是多折线，并且由另一介质材料封装。 天线的辐射线可以三维设计和制造，以减少天线所占的面积，并减少元件之间的耦合干扰。

    SOC for integrating micro-antenna
    9.
    发明授权
    SOC for integrating micro-antenna 失效
    用于集成微型天线的SOC

    公开(公告)号：US07301461B2

    公开(公告)日：2007-11-27

    申请号：US11109624

    申请日：2005-04-20

    申请人： Chuan-Ling Hu ,  Shun-Tian Lin ,  Chang-Fa Yang

    发明人： Chuan-Ling Hu ,  Shun-Tian Lin ,  Chang-Fa Yang

    IPC分类号： G08B13/14

    CPC分类号： H01Q1/38 ,  H01Q23/00

    摘要： An integrating SOC capable of integrating a micro-antenna System on Chip (SOC) of integrating micro-antennas comprises an existing radio frequency model, a circuit board and an antenna element to a package of single SOC. The micro-antenna element is formed by using antenna radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths. Active or passive elements are selected to match up the antenna element and relative circuits, and arranges on the circuit board. Then by using embedding type injection molding or glue-filling modeling, the single SOC is finished by the package of a radio frequency model and an antenna element.

    摘要翻译： 能够集成微型天线的微型天线片上系统（SOC）的集成SOC包括现有的射频模型，电路板和天线元件到单个SOC的封装。 微型天线元件通过使用由单个馈送端或多个馈送端和多个弯曲路径组成的天线辐射导体路径形成。 选择有源或无源元件以匹配天线元件和相对电路，并布置在电路板上。 然后通过使用嵌入式注塑或灌胶建模，单个SOC由射频模型和天线元件的封装完成。

    Chip antenna
    10.
    发明授权
    Chip antenna 失效
    芯片天线

    公开(公告)号：US07212165B2

    公开(公告)日：2007-05-01

    申请号：US10960310

    申请日：2004-10-06

    申请人： Chang-Fa Yang ,  Jen-Hsun Li ,  Jing-Ming Chen ,  Jun-Hong Lin ,  Shun-Tian Lin

    发明人： Chang-Fa Yang ,  Jen-Hsun Li ,  Jing-Ming Chen ,  Jun-Hong Lin ,  Shun-Tian Lin

    IPC分类号： H01Q1/24

    CPC分类号： H01Q1/2283 ,  H01Q1/22 ,  H01Q1/38 ,  Y10T29/49016 ,  Y10T29/49018

    摘要： A chip antenna has an antenna body and a package. The antenna body has multiple meandered metal lines and is encapsulated with the package. The material of the package is a dielectric composite formed with polymers and ceramic powders, which has a dielectric constant designed for the antenna. The characteristics of the chip antenna are determined by the structures of the antenna body and the dielectric constant of the package. Thus, a requirement for tiny structures in antenna applications can be satisfied.

    摘要翻译： 芯片天线具有天线体和封装。 天线体具有多条蜿蜒的金属线，并用封装封装。 封装的材料是由聚合物和陶瓷粉末形成的电介质复合材料，其具有为天线设计的介电常数。 芯片天线的特性由天线体的结构和封装的介电常数决定。 因此，可以满足对天线应用中的微小结构的要求。