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1.发明申请公开(公告)号：US20190299251A1
公开(公告)日：2019-10-03
申请号：US16443931
申请日：2019-06-18
申请人： Chao Chen , Kailiang Chen , Leung Kin Chiu , Youn-Jae Kook , Keith G. Fife
发明人： Chao Chen , Kailiang Chen , Leung Kin Chiu , Youn-Jae Kook , Keith G. Fife
摘要： Aspects of technology described herein relate to ultrasound apparatuses including capacitive micromachines ultrasonic transducers (CMUTs) that are directly electrically coupled to delta-sigma analog-to-digital converters (ADCs). The apparatus may lack an amplifier or multiplexer between each CMUT and delta-sigma ADC. The apparatus may include between 100 and 20,000 CMUTs and between 100 and 20,000 delta-sigma ADCs, each of the CMUTs directly electrically coupled to one of the delta-sigma ADCs. The CMUTs and the delta-sigma ADCs may be monolithically integrated on a single substrate. The delta-sigma ADCs may lack an integrator distinct from the CMUT. An internal capacitance of the CMUT may serve as an integrator for the delta-sigma ADC.
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公开(公告)号：US20210328564A1
公开(公告)日：2021-10-21
申请号：US17232088
申请日：2021-04-15
申请人： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
发明人： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
摘要： Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.
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公开(公告)号：US20210325349A1
公开(公告)日：2021-10-21
申请号：US17232100
申请日：2021-04-15
申请人： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
发明人： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
摘要： Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.
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公开(公告)号：US20200150252A1
公开(公告)日：2020-05-14
申请号：US16678830
申请日：2019-11-08
申请人： Kailiang Chen , Chao Chen , Keith G. Fife
发明人： Kailiang Chen , Chao Chen , Keith G. Fife
摘要： A variable-current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied. The variable-current trans-impedance amplifier may include multiple stages, including a first stage having N-P transistor pairs configured to receive an input signal and produce a single-ended amplified signal.
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公开(公告)号：US20210088638A1
公开(公告)日：2021-03-25
申请号：US17025927
申请日：2020-09-18
IPC分类号： G01S7/52
摘要： Circuitry for an ultrasound device is described. The ultrasound device may include a symmetric switch positioned between a pulser and an ultrasound transducer. The pulser may produce bipolar pulses. The symmetric switch may selectively isolate a receiver from the pulser and the ultrasound transducer during a transmit mode of the device, when the bipolar pulses are provided by the pulser to the ultrasound transducer for transmission, and may selectively permit the receiver to receive signals from the ultrasound transducer during a receive mode. The symmetric switch may be provided with a well switch to remove well capacitances in a signal path of the device.
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公开(公告)号：US20190142387A1
公开(公告)日：2019-05-16
申请号：US16192603
申请日：2018-11-15
申请人： Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
发明人： Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
摘要： Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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公开(公告)号：US20180376253A1
公开(公告)日：2018-12-27
申请号：US16016359
申请日：2018-06-22
IPC分类号： H04R17/00
摘要： Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.
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公开(公告)号：US20210028792A1
公开(公告)日：2021-01-28
申请号：US16937553
申请日：2020-07-23
申请人： Sewook Hwang , Jungwook Yang , Kailiang Chen , Nevada J. Sanchez , Keith G. Fife
发明人： Sewook Hwang , Jungwook Yang , Kailiang Chen , Nevada J. Sanchez , Keith G. Fife
摘要： Aspects of the technology described herein relate to control circuitry configured to turn on and off the ADC driver. In some embodiments, the control circuitry is configured to turn on and off the ADC driver in synchronization with sampling activity of an ADC, in particular based on when an ADC is sampling. The control circuitry may be configured to turn on the ADC driver during the hold phase of the ADC a time period before the track phase and to turn off the ADC driver during the hold phase a time period after the track phase. In some embodiments, the control circuitry is configured to control a duty cycle of the ADC driver turning on and off. In some embodiments, the control circuitry is configured to control a ratio between an off current and an on current in the ADC driver.
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公开(公告)号：US20190149109A1
公开(公告)日：2019-05-16
申请号：US16244934
申请日：2019-01-10
申请人： Amandeep Singh , Kailiang Chen , Tyler S. Ralston
发明人： Amandeep Singh , Kailiang Chen , Tyler S. Ralston
CPC分类号： H03F3/45179 , G01N29/2406 , G01N29/44 , G01N29/4463 , G01N29/449 , H03F3/345 , H03F2200/129 , H03F2203/45116 , H03F2203/45524 , H03M1/124 , H03M1/38
摘要： An ultrasound circuit comprising a single-ended trans-impedance amplifier (TIA) is described, The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TEA is followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
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公开(公告)号：US08035414B2
公开(公告)日：2011-10-11
申请号：US12422979
申请日：2009-04-13
IPC分类号： H03K19/173 , H03K19/177
CPC分类号： G06F7/388
摘要： A family of reconfigurable, charge-conserving asynchronous logic elements that interact with their nearest neighbors permits design and implementation of circuits that are asynchronous at the bit level, rather than at the level of functional blocks. These elements pass information by means of charge packets (tokens), rather than voltages. Each cell is self-timed, and cells that are configured as interconnect perform at propagation delay speeds, so no hardware non-local connections are needed. An asynchronous logic element comprises a set of edges for asynchronous communication with at least one neighboring cell, each edge having an input for receiving tokens from neighboring cells and an output for transferring an output charge packet to at least one neighboring cell, and circuitry configured to perform a logic operation utilizing received charge packets as inputs and to produce an output charge packet reflecting the result of the logic operation.
摘要翻译： 与其最近邻居交互的可重配置，电荷节省的异步逻辑元件系列允许设计和实现在位级别而不是功能块级异步的电路。 这些元件通过电荷分组（令牌）传递信息，而不是电压。 每个单元都是自定时的，配置为互连的单元以传播延迟速度执行，因此不需要硬件非本地连接。 异步逻辑元件包括用于与至少一个相邻小区异步通信的一组边缘，每个边缘具有用于从相邻小区接收令牌的输入和用于将输出电荷分组传送到至少一个相邻小区的输出，以及被配置为 利用接收的充电分组作为输入进行逻辑运算，并产生反映逻辑运算结果的输出电荷分组。
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