公开(公告)号：US08809972B2

公开(公告)日：2014-08-19

申请号：US13173119

申请日：2011-06-30

申请人： Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

发明人： Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

IPC分类号： H01L23/10

CPC分类号： B81C1/00134 ,  B81B7/0064 ,  B81C1/0023 ,  B81C2203/00 ,  B81C2203/0792 ,  H01L41/0933 ,  H01L41/1134 ,  H01L2224/11

摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

摘要翻译： 一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖子的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

公开(公告)号：US09227841B2

公开(公告)日：2016-01-05

申请号：US14274118

申请日：2014-05-09

申请人： Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

发明人： Chao Ta Huang ,  Shih Ting Lin ,  Yu Wen Hsu

IPC分类号： H01L41/08 ,  B81C1/00 ,  B81B7/00 ,  H01L41/113 ,  H01L41/09

CPC分类号： B81C1/00134 ,  B81B7/0064 ,  B81C1/0023 ,  B81C2203/00 ,  B81C2203/0792 ,  H01L41/0933 ,  H01L41/1134 ,  H01L2224/11

摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

摘要翻译： 一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。 电路芯片包括基板和多个金属接合区域。 基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。 微机电系统装置包括多个基座和至少一个感测元件。 基底连接至至少一个金属接合区域。 至少一个感测元件弹性地连接到基座。 所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。 盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

公开(公告)号：US08695426B2

公开(公告)日：2014-04-15

申请号：US13220068

申请日：2011-08-29

申请人： Yu Wen Hsu ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

发明人： Yu Wen Hsu ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

IPC分类号： G01C19/56

CPC分类号： B81C1/00301 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2207/07 ,  B81C2203/0792 ,  G01C19/5762

摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

摘要翻译： 本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。 弹簧连接到锚固件和移动部件。 绝缘层设置在移动部分和锚中。 移动部分和锚固体中的每一个被绝缘层分成两个导电部分。 由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。

公开(公告)号：US20120160027A1

公开(公告)日：2012-06-28

申请号：US13220068

申请日：2011-08-29

申请人： Yu Wen HSU ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

发明人： Yu Wen HSU ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

IPC分类号： G01C19/02 ,  H01L21/02

CPC分类号： B81C1/00301 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2207/07 ,  B81C2203/0792 ,  G01C19/5762

摘要： The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

摘要翻译： 本公开涉及具有电绝缘结构的微机电系统（MEMS）装置。 MEMS器件包括至少一个移动部件，至少一个锚固件，至少一个弹簧和绝缘层。 弹簧连接到锚固件和移动部件。 绝缘层设置在移动部分和锚中。 移动部分和锚固体中的每一个被绝缘层分成两个导电部分。 由此，不同运动部件的电信号通过未电气连接的绝缘电路传输。

公开(公告)号：US08104354B2

公开(公告)日：2012-01-31

申请号：US12877337

申请日：2010-09-08

申请人： Yu Wen Hsu ,  Chao Ta Huang ,  Jing Yuan Lin ,  Sheah Chen

发明人： Yu Wen Hsu ,  Chao Ta Huang ,  Jing Yuan Lin ,  Sheah Chen

IPC分类号： G01L9/12 ,  H01L21/302

CPC分类号： G01L9/0073 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49002

摘要： A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver.

摘要翻译： 电容式传感器包括衬底，至少一个第一电极，至少一个第二电极，感测装置，至少一个锚定基座，至少一个可移动框架和多个弹簧构件。 第一电极和第二电极设置在基板上，锚固体围绕第一和第二电极并且设置在基板上。 可动框架围绕感测装置。 一些弹簧构件连接可动框架和感测装置，而另一个弹簧构件连接可动框架和锚固基座。 感测装置和第一电极都是感测电极。 可移动框架设置在第二电极上方，并与第二电极配合以用作电容式驱动器。

公开(公告)号：US20110154905A1

公开(公告)日：2011-06-30

申请号：US12877337

申请日：2010-09-08

申请人： Yu Wen HSU ,  Chao Ta Huang ,  Jing Yuan Lin ,  Sheah Chen

发明人： Yu Wen HSU ,  Chao Ta Huang ,  Jing Yuan Lin ,  Sheah Chen

IPC分类号： G01R27/26 ,  H01L21/302 ,  G01L9/12

CPC分类号： G01L9/0073 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49002

摘要： A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver.

摘要翻译： 电容式传感器包括衬底，至少一个第一电极，至少一个第二电极，感测装置，至少一个锚定基座，至少一个可移动框架和多个弹簧构件。 第一电极和第二电极设置在基板上，锚固体围绕第一和第二电极并且设置在基板上。 可动框架围绕感测装置。 一些弹簧构件连接可动框架和感测装置，而另一个弹簧构件连接可动框架和锚固基座。 感测装置和第一电极都是感测电极。 可移动框架设置在第二电极上方，并与第二电极配合以用作电容式驱动器。