摘要:
Described are fabric care compositions, comprising a builder and an aqueous dispersion comprising an ethylene acrylic acid copolymer and a fragrance.
摘要:
Described are fabric care compositions, comprising a builder and an aqueous dispersion comprising an ethylene acrylic acid copolymer and a fragrance.
摘要:
A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要:
A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要:
Described are devices for retaining a nonporous substrate, as well as methods for their use, the devices comprising a housing for receiving the nonporous substrate, a removable well insert attached to the housing and adjacently coplanar to the substrate, the well insert having at least one opening that, together with the substrate, defines a well, and means for exerting a force against the substrate such that the substrate engages the well insert with sufficient force to attain a fluid-tight seal in the well.
摘要:
The present invention relates to a turbidity calibration standard comprising: a number of from 1 to 5 sequentially-interfaced layers, wherein each layer independently comprises a light-permeable polymer or light-permeable interpolymer; a measured light transmission modulating amount of at least one light transmission modulator, which is distributed in any one or more of the layers; and a light-permeable container, which contains the layers and the at least one light transmission modulator. Also, the invention relates to methods of making and using the standard, and kits comprising the standard.
摘要:
A process is disclosed for the formation of a high flux composite membrane having a thin discriminating film affixed to a porous support layer through a glue layer. The process comprises the formation of the discriminating film by irradiating an aqueous polymer solution in the substantial absence of drying and under conditions which are sufficient to form a polymer film on the surface of the polymer solution at the interphase of the solution and a blanketing fluid. The film is then affixed to the support through the glue layer which may be the same polymer solution from which the discriminating film is formed.
摘要:
Described are devices for retaining a nonporous substrate, as well as methods for their use, the devices comprising a housing for receiving the nonporous substrate, a removable well insert attached to the housing and adjacently coplanar to the substrate, the well insert having at least one opening that, together with the substrate, defines a well, and means for exerting a force against the substrate such that the substrate engages the well insert with sufficient force to attain a fluid-tight seal in the well.
摘要:
A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要:
The invention is an image capturing device comprising a lens to capture the image of the one or more samples which are located in an image capturing chamber, a nest receptacle to hold the one or more samples during imaging, and at least one illuminating source to illuminate the one or more samples. The chamber, lighting and nest receptacle are configured to minimize undesired reflections and improve the image quality.