Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
    3.
    发明申请
    Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition 有权
    稳定,浓缩,水溶性纤维素自由化学机械抛光组合物

    公开(公告)号:US20120225556A1

    公开(公告)日:2012-09-06

    申请号:US13039705

    申请日:2011-03-03

    IPC分类号: H01L21/306 C09K3/14 C09K13/00

    CPC分类号: H01L21/3212 C09G1/16

    摘要: A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

    摘要翻译: 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物,包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 任选地,非糖水溶性聚合物; 任选地,式I的水溶性酸化合物,其中R选自氢和C 1-5烷基,并且其中x是1或2; 任选地,络合剂; 任选地,氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外,提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法,包括:提供基板,其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸,氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

    Stable, concentratable chemical mechanical polishing composition and methods relating thereto
    4.
    发明申请
    Stable, concentratable chemical mechanical polishing composition and methods relating thereto 有权
    稳定,可浓缩的化学机械抛光组合物及其相关方法

    公开(公告)号:US20120225555A1

    公开(公告)日:2012-09-06

    申请号:US13039723

    申请日:2011-03-03

    IPC分类号: H01L21/306 C09K13/00

    CPC分类号: H01L21/3212 C09G1/16

    摘要: A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

    摘要翻译: 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物,包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 水溶性纤维素; 任选地,非糖水溶性聚合物; 任选地,式I的水溶性酸化合物,其中R选自氢和C 1-5烷基,并且其中x是1或2; 任选地,络合剂; 任选地,氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外,提供了制备本发明的化学机械抛光组合物的方法和基材的化学机械抛光方法,包括:提供基材,其中所述基材是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸,氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

    DEVICES FOR RETAINING A NONPOROUS SUBSTRATE AND METHODS
    5.
    发明申请
    DEVICES FOR RETAINING A NONPOROUS SUBSTRATE AND METHODS 失效
    用于保持非常基底和方法的装置

    公开(公告)号:US20100083778A1

    公开(公告)日:2010-04-08

    申请号:US12573914

    申请日:2009-10-06

    IPC分类号: G01M19/00 B65D25/04

    摘要: Described are devices for retaining a nonporous substrate, as well as methods for their use, the devices comprising a housing for receiving the nonporous substrate, a removable well insert attached to the housing and adjacently coplanar to the substrate, the well insert having at least one opening that, together with the substrate, defines a well, and means for exerting a force against the substrate such that the substrate engages the well insert with sufficient force to attain a fluid-tight seal in the well.

    摘要翻译: 描述了用于保持无孔基材的装置及其使用方法,所述装置包括用于接收无孔基材的壳体,附接到壳体并与基底相邻共面的可移除的井插入物,所述钻井插入物具有至少一个 打开,其与基底一起限定了孔,以及用于向衬底施加力的装置,使得衬底以足够的力与孔插入物接合以在井中获得流体密封。

    STABLE TURBIDITY CALIBRATION STANDARDS
    6.
    发明申请
    STABLE TURBIDITY CALIBRATION STANDARDS 有权
    稳定的涡度校准标准

    公开(公告)号:US20090059218A1

    公开(公告)日:2009-03-05

    申请号:US12195779

    申请日:2008-08-21

    IPC分类号: G01J1/10

    CPC分类号: G01N21/4785

    摘要: The present invention relates to a turbidity calibration standard comprising: a number of from 1 to 5 sequentially-interfaced layers, wherein each layer independently comprises a light-permeable polymer or light-permeable interpolymer; a measured light transmission modulating amount of at least one light transmission modulator, which is distributed in any one or more of the layers; and a light-permeable container, which contains the layers and the at least one light transmission modulator. Also, the invention relates to methods of making and using the standard, and kits comprising the standard.

    摘要翻译: 浊度校准标准本发明涉及一种浑浊度校准标准,其包括:多个1至5个顺序界面层,其中各层独立地包含透光聚合物或透光互聚物; 分布在任何一个或多个层中的至少一个光传输调制器的测量光透射调制量; 以及容纳所述层和所述至少一个光透射调制器的透光性容器。 此外,本发明涉及制备和使用该标准品的方法,以及包含该标准品的试剂盒。

    Devices for retaining a nonporous substrate and methods
    8.
    发明授权
    Devices for retaining a nonporous substrate and methods 失效
    用于保留无孔底物和方法的装置

    公开(公告)号:US08697013B2

    公开(公告)日:2014-04-15

    申请号:US12573914

    申请日:2009-10-06

    IPC分类号: G01N15/06

    摘要: Described are devices for retaining a nonporous substrate, as well as methods for their use, the devices comprising a housing for receiving the nonporous substrate, a removable well insert attached to the housing and adjacently coplanar to the substrate, the well insert having at least one opening that, together with the substrate, defines a well, and means for exerting a force against the substrate such that the substrate engages the well insert with sufficient force to attain a fluid-tight seal in the well.

    摘要翻译: 描述了用于保持无孔基材的装置及其使用方法,所述装置包括用于接收无孔基材的壳体,附接到壳体并与基底相邻共面的可移除的井插入物,所述钻井插入物具有至少一个 打开,其与基底一起限定了孔,以及用于向衬底施加力的装置,使得衬底以足够的力与孔插入物接合以在井中获得流体密封。

    Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
    9.
    发明授权
    Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition 有权
    稳定,浓缩,水溶性纤维素自由化学机械抛光组合物

    公开(公告)号:US08440097B2

    公开(公告)日:2013-05-14

    申请号:US13039705

    申请日:2011-03-03

    IPC分类号: C09K13/00

    CPC分类号: H01L21/3212 C09G1/16

    摘要: A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.

    摘要翻译: 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物,包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 任选地,非糖水溶性聚合物; 任选地,式I的水溶性酸化合物,其中R选自氢和C 1-5烷基,并且其中x是1或2; 任选地,络合剂; 任选的氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外,提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法,包括:提供基板,其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸,氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

    DIGITAL IMAGING SYSTEM
    10.
    发明申请
    DIGITAL IMAGING SYSTEM 审中-公开
    数字成像系统

    公开(公告)号:US20100118130A1

    公开(公告)日:2010-05-13

    申请号:US12615564

    申请日:2009-11-10

    IPC分类号: H04N7/18 G06K9/00 H04N5/33

    CPC分类号: G01N21/51

    摘要: The invention is an image capturing device comprising a lens to capture the image of the one or more samples which are located in an image capturing chamber, a nest receptacle to hold the one or more samples during imaging, and at least one illuminating source to illuminate the one or more samples. The chamber, lighting and nest receptacle are configured to minimize undesired reflections and improve the image quality.

    摘要翻译: 本发明是一种图像捕获装置,其包括:用于捕获位于图像捕获室中的一个或多个样本的图像的镜头,用于在成像期间保持所述一个或多个样本的巢容器,以及至少一个照明源 一个或多个样品。 房间,照明和窝窝被配置为最小化不期望的反射并提高图像质量。