Process and materials for making contained layers and devices made with same
    1.
    发明授权
    Process and materials for making contained layers and devices made with same 失效
    制作含有相同层数和装置的工艺和材料

    公开(公告)号:US08309376B2

    公开(公告)日:2012-11-13

    申请号:US12738460

    申请日:2008-10-24

    Abstract: There is provided a process for forming a contained second layer over a first layer. The process comprises forming the first layer having a first surface energy and then treating the first layer with a photocurable surface-active composition which is a fluorinated ester or fluorinated imide of an α,β-unsaturated polyacid; exposing the photocurable surface-active composition patternwise with radiation resulting in exposed areas and unexposed areas; developing the photocurable surface-active composition to remove the unexposed areas resulting in a first layer having untreated portions in the unexposed areas and treated portions in the exposed areas, where the treated portions have a second surface energy that is lower than the first surface energy; and forming the second layer on the untreated portions of the first layer. There is also provided an organic electronic device made by the process.

    Abstract translation: 提供了一种用于在第一层上形成包含的第二层的方法。 该方法包括形成具有第一表面能的第一层,然后用可光固化的表面活性组合物处理第一层,该组合物是α,β-不饱和多元酸的氟化酯或氟化酰亚胺; 用辐射曝光可光固化的表面活性组合物,导致曝光区域和未曝光区域; 显影所述光固化性表面活性组合物以除去未曝光区域,从而在未曝光区域中具有未处理部分的第一层和暴露区域中的处理部分,其中处理部分具有低于第一表面能的第二表面能; 以及在所述第一层的未处理部分上形成所述第二层。 还提供了通过该方法制造的有机电子装置。

    PROCESS FOR FORMING ENCAPSULATED ELECTRONIC DEVICES
    5.
    发明申请
    PROCESS FOR FORMING ENCAPSULATED ELECTRONIC DEVICES 有权
    形成封装电子器件的方法

    公开(公告)号:US20110081735A1

    公开(公告)日:2011-04-07

    申请号:US12323642

    申请日:2008-11-26

    CPC classification number: H01L51/5246

    Abstract: There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.

    Abstract translation: 这里提供了形成封装的电子器件的方法。 该设备在基板上具有有效区域和密封区域。 该方法包括提供基底; 在所述密封区域的至少一部分上形成具有第一表面能的材料的不连续图案; 形成多个活性层,其中至少一个活性层通过液体沉积形成,所述液体介质具有大于所述第一表面能的表面能; 提供封装组件; 以及将密封组件粘合到密封区域中的基底。 还提供了通过所公开的方法形成的装置。

    PROCESS AND MATERIALS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME
    9.
    发明申请
    PROCESS AND MATERIALS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME 失效
    用于制造包含层的工艺和材料及其制品

    公开(公告)号:US20100213454A1

    公开(公告)日:2010-08-26

    申请号:US12738460

    申请日:2008-10-24

    Abstract: There is provided a process for forming a contained second layer over a first layer. The process comprises forming the first layer having a first surface energy and then treating the first layer with a photocurable surface-active composition which is a fluorinated ester or fluorinated imide of an α,β-unsaturated polyacid; exposing the photocurable surface-active composition patternwise with radiation resulting in exposed areas and unexposed areas; developing the photocurable surface-active composition to remove the unexposed areas resulting in a first layer having untreated portions in the unexposed areas and treated portions in the exposed areas, where the treated portions have a second surface energy that is lower than the first surface energy; and forming the second layer on the untreated portions of the first layer. There is also provided an organic electronic device made by the process.

    Abstract translation: 提供了一种用于在第一层上形成包含的第二层的方法。 该方法包括形成具有第一表面能的第一层,然后用可光固化的表面活性组合物处理第一层,该组合物是α,β-不饱和多元酸的氟化酯或氟化酰亚胺; 用辐射曝光可光固化的表面活性组合物,导致曝光区域和未曝光区域; 显影可光固化表面活性组合物以除去未曝光区域,从而在未曝光区域中具有未处理部分的第一层和暴露区域中的处理部分,其中处理部分具有低于第一表面能的第二表面能; 以及在所述第一层的未处理部分上形成所述第二层。 还提供了通过该方法制造的有机电子装置。

    PROCESS FOR MAKING CONTAINED LAYERS
    10.
    发明申请
    PROCESS FOR MAKING CONTAINED LAYERS 审中-公开
    制作包含层的方法

    公开(公告)号:US20080286487A1

    公开(公告)日:2008-11-20

    申请号:US12121234

    申请日:2008-05-15

    CPC classification number: C23C14/12 C23C14/042 H01L51/0005 H01L51/56

    Abstract: There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy and a first glass transition temperature; condensing an intermediate material over and in direct contact with the first layer to form an intermediate layer, said intermediate layer having a second surface energy which is lower than the first surface energy; patterning the intermediate layer to form uncovered areas of the first layer and covered areas of the first layer; and forming a contained second layer over the uncovered areas of the first layer. There is also provided a process for making an organic electronic device.

    Abstract translation: 提供了一种用于在第一层上形成包含的第二层的方法,包括以下步骤:形成具有第一表面能和第一玻璃化转变温度的第一层; 将中间材料冷凝在第一层上并直接接触第一层以形成中间层,所述中间层具有低于第一表面能的第二表面能; 图案化中间层以形成第一层的未覆盖区域和第一层的覆盖区域; 以及在所述第一层的未覆盖区域上形成包含的第二层。 还提供了制造有机电子设备的方法。

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