Organic material with a region including a guest material and organic electronic devices incorporating the same
    2.
    发明申请
    Organic material with a region including a guest material and organic electronic devices incorporating the same 审中-公开
    具有包括客体材料的区域的有机材料和包含其的有机电子器件

    公开(公告)号:US20050100657A1

    公开(公告)日:2005-05-12

    申请号:US10705321

    申请日:2003-11-10

    摘要: Organic electronic devices may include an organic electronic component having an organic layer including guest material(s). One or more liquid compositions may be placed over a substantially solid organic layer. Each liquid composition can include guest material(s) and liquid medium (media). The liquid medium (media) may interact with the organic layer to form a solution, dispersion, emulsion, or suspension. The viscosity of the resulting solution, dispersion, emulsion, or suspension can be higher than the liquid composition to keep lateral migration of the guest material to a relatively low level. Still, most, if not all, the guest material(s) can migrate into the organic layer to locally change the electronic or electro-radiative characteristics of a region within the organic layer, with less than one order of magnitude difference in guest material concentration throughout the thickness of the organic layer. The process can be used for organic active layers, filter layers, and combinations thereof.

    摘要翻译: 有机电子器件可以包括具有包括客体材料的有机层的有机电子部件。 一种或多种液体组合物可以放置在基本上固体的有机层上。 每种液体组合物可以包括客体材料和液体介质(介质)。 液体介质(介质)可与有机层相互作用以形成溶液,分散体,乳液或悬浮液。 所得溶液,分散体,乳液或悬浮液的粘度可高于液体组合物,以保持客体材料的侧向迁移至相对低的水平。 然而,大多数(如果不是全部)客体材料可以迁移到有机层中以局部地改变有机层中的区域的电子或电辐射特性,其中客体材料浓度的差异小于一个数量级 贯穿整个有机层的厚度。 该方法可用于有机活性层,过滤层及其组合。

    Electronic devices and processes for forming electronic devices
    3.
    发明申请
    Electronic devices and processes for forming electronic devices 审中-公开
    用于形成电子设备的电子设备和工艺

    公开(公告)号:US20070075626A1

    公开(公告)日:2007-04-05

    申请号:US11446945

    申请日:2006-06-05

    IPC分类号: H05B33/00

    摘要: An electronic device includes a substrate, a first layer, a first pixel, and a patterned reactive surface-active layer. The first pixel includes a first pixel driving circuit that overlies the substrate and includes a first electronic component. The first electronic component includes a first electrode and a second layer. The first electrode overlies at least a part of the first pixel driving circuit. The patterned reactive surface-active layer has a lower surface energy than the first layer. A process for forming an electronic device includes forming a first pixel driving circuit over a substrate, forming a first electrode of a first electronic component over the substrate, forming a first layer, forming a patterned reactive surface-active layer, and forming a second layer over the first electrode of the first electronic component.

    摘要翻译: 电子器件包括衬底,第一层,第一像素和图案化的反应性表面活性层。 第一像素包括覆盖在衬底上并包括第一电子部件的第一像素驱动电路。 第一电子部件包括第一电极和第二层。 第一电极覆盖第一像素驱动电路的至少一部分。 图案化的反应性表面活性层具有比第一层更低的表面能。 一种用于形成电子器件的方法包括在衬底上形成第一像素驱动电路,在衬底上形成第一电子部件的第一电极,形成第一层,形成图案化的反应性表面活性层,以及形成第二层 在第一电子部件的第一电极之上。

    Electronic device including a guest material within a layer and a process for forming the same
    4.
    发明申请
    Electronic device including a guest material within a layer and a process for forming the same 有权
    包括层内的客体材料的电子设备及其形成方法

    公开(公告)号:US20060145167A1

    公开(公告)日:2006-07-06

    申请号:US11026732

    申请日:2004-12-30

    IPC分类号: H01L21/00 H01L33/00

    摘要: A process for forming an electronic device includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

    摘要翻译: 一种用于形成电子器件的方法包括在衬底上形成第一层并将第一液体组合物置于第一层的第一部分上。 第一液体组合物包括至少第一客体材料和第一液体介质。 第一液体组合物与第一层接触并且大量的第一客体材料与第一层混合。 电子器件包括衬底和覆盖衬底的连续的第一层。 连续层包括电子部件所在的第一部分和没有电子部件所在的第二部分。 第一部分为至少30nm厚,并且包括第一客体材料,并且第二部分不超过40nm厚。

    Electronic device including a guest material within a layer and a process for forming the same
    5.
    发明授权
    Electronic device including a guest material within a layer and a process for forming the same 失效
    包括层内的客体材料的电子设备及其形成方法

    公开(公告)号:US07420205B2

    公开(公告)日:2008-09-02

    申请号:US11840367

    申请日:2007-08-17

    IPC分类号: H01L33/00 H01L51/00

    摘要: An electronic device made by a process that includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

    摘要翻译: 一种通过包括在基底上形成第一层并将第一液体组合物放置在第一层的第一部分上的方法制造的电子器件。 第一液体组合物包括至少第一客体材料和第一液体介质。 第一液体组合物与第一层接触并且大量的第一客体材料与第一层混合。 电子器件包括衬底和覆盖衬底的连续的第一层。 连续层包括电子部件所在的第一部分和没有电子部件所在的第二部分。 第一部分为至少30nm厚,并且包括第一客体材料,并且第二部分不超过40nm厚。

    Electronic device including a guest material within a layer and a process for forming the same
    8.
    发明授权
    Electronic device including a guest material within a layer and a process for forming the same 有权
    包括层内的客体材料的电子设备及其形成方法

    公开(公告)号:US07268006B2

    公开(公告)日:2007-09-11

    申请号:US11026732

    申请日:2004-12-30

    IPC分类号: H01L21/20

    摘要: A process for forming an electronic device includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

    摘要翻译: 一种用于形成电子器件的方法包括在衬底上形成第一层并将第一液体组合物置于第一层的第一部分上。 第一液体组合物包括至少第一客体材料和第一液体介质。 第一液体组合物与第一层接触并且大量的第一客体材料与第一层混合。 电子器件包括衬底和覆盖衬底的连续的第一层。 连续层包括电子部件所在的第一部分和没有电子部件所在的第二部分。 第一部分为至少30nm厚,并且包括第一客体材料,并且第二部分不超过40nm厚。