摘要:
A system and a corresponding method for multi-core synchronous debugging of a multi-core platform including a plurality of cores are provided. The method includes the following steps. Transmit a core debugging instruction to one of the cores selected by a system debugging instruction or store a group setting included in the system debugging instruction according to the type of the system debugging instruction. Control every core in a group to start executing program instructions simultaneously according to another system debugging instruction. The group is a subset of the cores and the group setting indicates which ones of the cores are included in the group. Use a handshaking mechanism to control all cores of the group to enter a debug mode simultaneously when a debug event happens in any core of the group.
摘要:
A system and a corresponding method for multi-core synchronous debugging of a multi-core platform including a plurality of cores are provided. The method includes the following steps. Transmit a core debugging instruction to one of the cores selected by a system debugging instruction or store a group setting included in the system debugging instruction according to the type of the system debugging instruction. Control every core in a group to start executing program instructions simultaneously according to another system debugging instruction. The group is a subset of the cores and the group setting indicates which ones of the cores are included in the group. Use a handshaking mechanism to control all cores of the group to enter a debug mode simultaneously when a debug event happens in any core of the group.
摘要:
An implanting method for forming a photodiode comprises providing a substrate with a first conductivity, growing an epitaxial layer on the substrate, implanting ions with a second conductivity in the epitaxial layer from a front side of the substrate and implanting ions with the first conductivity in the epitaxial layer from the front side of the substrate to form a photo active region adjacent to the front side and a photo inactive region underneath the photo active region. By employing the implanting method, an average doping density of the photo active region is approximately ten times more than an average doping density of the photo inactive region.
摘要:
A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed on the front side of the semiconductor substrate. A dielectric layer is disposed on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate. A metal shield is over the dielectric layer and overlapping the photo-sensitive device. A metal plug penetrates through the dielectric layer, wherein the metal plug electrically couples the metal shield to the semiconductor substrate.
摘要:
An implanting method for forming a photodiode comprises providing a substrate with a first conductivity, growing an epitaxial layer on the substrate, implanting ions with a second conductivity in the epitaxial layer from a front side of the substrate and implanting ions with the first conductivity in the epitaxial layer from the front side of the substrate to form a photo active region adjacent to the front side and a photo inactive region underneath the photo active region. By employing the implanting method, an average doping density of the photo active region is approximately ten times more than an average doping density of the photo inactive region.
摘要:
A cigarette lighter built with a flip-out windshield having one corner edge hinged to the lighter body. The windshield is normally folded in and concealed in the lighter body when not in use, and is then flipped out to protect the flame from wind when in use.
摘要:
A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed on the front side of the semiconductor substrate. A dielectric layer is disposed on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate. A metal shield is over the dielectric layer and overlapping the photo-sensitive device. A metal plug penetrates through the dielectric layer, wherein the metal plug electrically couples the metal shield to the semiconductor substrate.