公开(公告)号：US06761852B2

公开(公告)日：2004-07-13

申请号：US10095272

申请日：2002-03-11

申请人： Chee-Tian Yeo ,  Lye-King Tan

发明人： Chee-Tian Yeo ,  Lye-King Tan

IPC分类号： B22F322

CPC分类号： C22C1/058 ,  B22F3/1003 ,  B22F3/1035 ,  B22F2998/00 ,  B22F2998/10 ,  B22F2999/00 ,  C22C32/0063 ,  C22C32/0089 ,  B22F1/0014 ,  B22F3/1025 ,  B22F3/225 ,  B22F3/1021

摘要： Although MIM (metal injection molding) has received widespread application, aluminum has not been widely used for MIM in the prior art because of the tough oxide layer that grows on aluminum particles, thus preventing metal—metal bonding between the particles. The present invention solves this problem by adding a small amount of material that forms a eutectic mixture with aluminum oxide, and therefore aids sintering, to reduce the oxide, thereby allowing intimate contact between aluminum surfaces. The process includes the ability to mold and then sinter the feedstock into the form of compacted items of intricate shapes, small sizes (if needed), and densities of about 95% of bulk.

摘要翻译： 虽然MIM（金属注射成型）已经得到广泛应用，但是由于在铝颗粒上生长的韧性氧化物层，因此铝在现有技术中尚未广泛用于MIM，从而防止颗粒之间的金属 - 金属结合。 本发明通过添加少量与氧化铝形成共晶混合物的材料来解决该问题，因此有助于烧结以减少氧化物，从而允许铝表面之间的紧密接触。 该方法包括将原料模塑并随后烧结成复杂形状，小尺寸（如果需要）和压实体积约95％的压实物品的形式的能力。

公开(公告)号：US06569380B2

公开(公告)日：2003-05-27

申请号：US09940049

申请日：2001-08-27

申请人： Kay-Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan

发明人： Kay-Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan

IPC分类号： B22F706

CPC分类号： B22F3/225 ,  B22F7/06 ,  B22F7/062 ,  B22F2998/00 ,  B22F2998/10 ,  H01L21/4807 ,  H01L23/367 ,  H01L2924/0002 ,  Y10T428/12028 ,  B22F5/10 ,  B22F3/22 ,  B22F3/02 ,  B22F3/1021 ,  H01L2924/00

摘要： A method to form a combined enclosure and heat sink structure for a semiconductor device is achieved. A first feedstock comprising a first mixture of powdered metal materials, lubricants, and binders is prepared. A second feedstock comprising a second mixture of powdered metal materials, lubricants, and binders is prepared such that the difference between the sintering shrinkage of each of the first and second feedstocks is less than 1%. The first and second feedstocks are pressed to form a first green part having an enclosure shape and a second green part having a heat sink shape. The lubricants and the binders from said first and second green parts are removed to form a first powdered skeleton and a second powdered skeleton. The first and second powdered skeletons are sintered to complete the combined enclosure and heat sink structure. The first and second powdered skeletons are in intimate contact during the sintering. Optionally, at least one hollow cooling channel is formed in the combine structure by burning away a fugitive plastic structure during the sintering process.

公开(公告)号：US06660225B2

公开(公告)日：2003-12-09

申请号：US09960908

申请日：2001-09-24

申请人： Kay Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan ,  Robin Baumgartner

发明人： Kay Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan ,  Robin Baumgartner

IPC分类号： B22F706

CPC分类号： B22F3/225 ,  B21C3/02 ,  B22F5/00 ,  B22F7/06 ,  B22F7/062 ,  B22F2998/00 ,  B22F2998/10 ,  H01F1/22 ,  B22F5/007 ,  B22F5/10 ,  B22F2207/20 ,  B22F3/02 ,  B22F3/22

摘要： The invention shows how powder injection molding may be used to form a continuous body having multiple parts, each of which has different functional properties such as corrosion resistance or hardness, there being no connective materials such as solder or glue between the parts. This is accomplished through careful control of the relative shrinkage rates of these various parts. Although there is no limit to how many parts with different functional properties can make up an object, special attention is paid to certain pairs of functional properties that are difficult and/or expensive to combine in a single object when other manufacturing means are used.

公开(公告)号：US06935022B2

公开(公告)日：2005-08-30

申请号：US10229831

申请日：2002-08-28

申请人： Randall M. German ,  Lye-King Tan ,  John Johnson

发明人： Randall M. German ,  Lye-King Tan ,  John Johnson

IPC分类号： B22F3/02 ,  B22F3/11 ,  B22F5/10 ,  B22F5/12 ,  B22F7/06 ,  F28D15/02 ,  H01L21/48 ,  H01L23/427 ,  H05K7/20 ,  F28F7/00 ,  B23P6/00 ,  F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28D2015/0225 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

摘要翻译： 集成电路芯片运行过程中的散热是一个不断恶化的老问题。 本发明通过将嵌入的热管直接放置在芯片的正下方而显着地改善了这一点。 使用粉末注射成型，首先将包装的下部形成为包括一个或多个空腔的初始绿色部分。 然后，后者衬有被设计成在烧结之后产生多孔材料的原料，此时将工作流体引入多孔孔并密封，由此形成位于芯片正下方的一个或多个热管。 然后将后者密封在外壳内。 在操作期间，由芯片产生的热量有效地传递到外壳外部的点。 还描述了用于制造该结构的方法。

公开(公告)号：US06461563B1

公开(公告)日：2002-10-08

申请号：US09733527

申请日：2000-12-11

申请人： Kay-Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan ,  Robin Baumgartner

发明人： Kay-Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan ,  Robin Baumgartner

IPC分类号： B22F702

CPC分类号： B22F3/225 ,  B21C3/02 ,  B22F5/00 ,  B22F7/06 ,  B22F2998/00 ,  B22F2998/10 ,  H01F1/22 ,  Y10T428/12028 ,  B22F5/007 ,  B22F5/10 ,  B22F2207/20 ,  B22F3/02 ,  B22F3/22

摘要： The invention shows how powder injection molding may be used to form a continuous body having multiple parts, each of which has different physical properties such as magnetic characteristics or hardness. This is accomplished through careful control of the relative shrinkage rates of these various parts. Additionally, care is taken to ensure that only certain selected physical properties are allowed to differ between the parts while others may be altered through relatively small changes in the composition of the feedstocks used. An additional application of the present invention is a process for forming, in a single integrated operation, an object that is contained within an enclosure while not being attached to said enclosure. This is accomplished by causing the shrinkage rate of the object to be substantially greater than that of the enclosure. As a result, after sintering, the object is found to have detached itself from the enclosure and is free to move around therein. Several examples of structures formed using these processes are presented.

摘要翻译： 本发明示出了如何使用粉末注射成型来形成具有多个部件的连续主体，每个部件具有不同的物理特性，例如磁特性或硬度。 这是通过仔细控制这些各个部件的相对收缩率来实现的。 另外，注意确保仅允许某些选定的物理性质在各部分之间不同，而其它物理性质可以通过使用的原料的组成的相对小的变化而改变。 本发明的另一个应用是在单个集成操作中形成被包含在外壳内而不附着到所述外壳的物体的过程。 这是通过使物体的收缩率显着大于外壳的收缩率来实现的。 结果，在烧结之后，发现物体已经从外壳脱离并且在其中自由移动。 介绍了使用这些过程形成的结构的几个例子。

公开(公告)号：US07347968B2

公开(公告)日：2008-03-25

申请号：US10676216

申请日：2003-10-01

申请人： Kay Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan ,  Robin Baumgartner

发明人： Kay Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan ,  Robin Baumgartner

IPC分类号： B22F7/06

CPC分类号： B22F3/225 ,  B21C3/02 ,  B22F5/00 ,  B22F7/06 ,  B22F7/062 ,  B22F2998/00 ,  B22F2998/10 ,  H01F1/22 ,  B22F5/007 ,  B22F5/10 ,  B22F2207/20 ,  B22F3/02 ,  B22F3/22

摘要： The invention shows how powder injection molding may be used to form a continuous body having multiple parts, each of which has different functional properties such as corrosion resistance or hardness, there being no connective materials such as solder or glue between the parts. This is accomplished through careful control of the relative shrinkage rates of these various parts. Although there is no limit to how many parts with different functional properties can make up an object, special attention is paid to certain pairs of functional properties that are difficult and/or expensive to combine in a single object when other manufacturing means are used.

摘要翻译： 本发明示出了如何使用粉末注射成型来形成具有多个部分的连续体，每个部分具有不同的功能性质如耐腐蚀性或硬度，在部件之间不存在诸如焊料或粘合剂的连接材料。 这是通过仔细控制这些各个部件的相对收缩率来实现的。 尽管对于具有不同功能性质的多个部件可以组成一个对象没有限制，但是特别注意在使用其它制造装置时在单个对象中组合的某些功能特性对很困难和/或昂贵。

公开(公告)号：US20060000584A1

公开(公告)日：2006-01-05

申请号：US11141886

申请日：2005-06-01

申请人： Randall German ,  Lye-King Tan ,  John Johnson

发明人： Randall German ,  Lye-King Tan ,  John Johnson

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28D2015/0225 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

公开(公告)号：US20050284616A1

公开(公告)日：2005-12-29

申请号：US11141885

申请日：2005-06-01

申请人： Randall German ,  Lye-King Tan ,  John Johnson

发明人： Randall German ,  Lye-King Tan ,  John Johnson

IPC分类号： B22F3/02 ,  B22F3/11 ,  B22F5/10 ,  B22F5/12 ,  B22F7/06 ,  F28D15/02 ,  H01L21/48 ,  H01L23/427 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28D2015/0225 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

公开(公告)号：US06776955B1

公开(公告)日：2004-08-17

申请号：US09655113

申请日：2000-09-05

申请人： Kay-Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan

发明人： Kay-Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan

IPC分类号： B22F300

CPC分类号： B22F3/225 ,  B22F3/1283 ,  B22F5/10 ,  B22F2998/00 ,  B22F2998/10 ,  B22F2207/20 ,  B22F3/10

摘要： This invention describes a novel production method of manufacturing metal/ceramic articles with complex internal undercut features using powder injection molding processes The shape of the undercut/hollow feature is initially molded using a disposable material such as a degradable polymer. The PIM feedstock is then molded onto this to form the required shape geometry, in effect encapsulating the polymeric feature in the PIM feedstock. The resulting two-material part is then sent for processing which removes the polymer through solvent or thermal process. After the polymer and the binder have been removed, the part now comprises a powder skeleton that contains the internal undercut feature within itself. After sintering the result is a metal/ceramic part having an internal undercut feature. The technical advantage of the present invention is that it does not require complex toolings or costly secondary operations while retaining the flexibility to design any internal undercut features of complex geometry. An additional embodiment of the invention is also disclosed in which a solid structure is encapsulated inside a hollow shell said structure being free to move around inside the shell.

摘要翻译： 本发明描述了使用粉末注射成型工艺制造具有复杂内部底切特征的金属/陶瓷制品的新型制造方法。底切/中空特征的形状首先使用一次性材料如可降解聚合物模制。 然后将PIM原料模制到其上以形成所需的形状几何形状，实际上将聚合物特征包封在PIM原料中。 然后将所得的双材料部分送入加工，通过溶剂或热处理除去聚合物。 在聚合物和粘合剂已被去除之后，该部件现在包括其本身内部具有内部底切特征的粉末骨架。 烧结结果是具有内部底切特征的金属/陶瓷部件。 本发明的技术优点在于它不需要复杂的工具或昂贵的二次操作，同时保持灵活性来设计复杂几何形状的任何内部底切特征。 还公开了本发明的另外的实施例，其中将固体结构封装在中空壳内，所述结构可自由地在壳体内移动。